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Apparatus and method for selectivity restricting process fluid flow in semiconductor processing

  • US 6,395,640 B2
  • Filed: 12/07/2000
  • Issued: 05/28/2002
  • Est. Priority Date: 12/17/1999
  • Status: Active Grant
First Claim
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1. A semiconductor processing apparatus comprising:

  • a process chamber;

    at least one substrate support disposed within the process chamber operable to support a substrate wafer;

    at least one showerhead assembly disposed within the process chamber facing the substrate support, the showerhead assembly having a showerhead plate;

    the showerhead plate having a plurality of passageways extending therethrough for directing a process fluid toward a substrate wafer disposed on the substrate support; and

    a blocking assembly disposed within the process chamber, the blocking assembly having an active position between the showerhead assembly and the substrate support to restrict process fluid flow from the showerhead and a neutral position which allows unrestricted process flow.

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