Apparatus and method for selectivity restricting process fluid flow in semiconductor processing

• US 6,395,640 B2
• Filed: 12/07/2000
• Issued: 05/28/2002
• Est. Priority Date: 12/17/1999
• Status: Active Grant

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Rose, David Jay
• Primary Examiner(s): Ghyka, Alexander G.
• Application Number:
  US09/732,341
• Publication Number:
  US 20010031560A1
• Time in Patent Office: 537 Days
• Field of Search: 438/706,716,745,758,782,935 118/715,728,729
• US Class Current: 438/706
• CPC Class Codes: H01L 21/6708 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence

Abstract

A semiconductor processing apparatus (10) is disclosed which includes a process chamber (12) and at least one substrate support (18) disposed within the process chamber (12) operable to support a substrate wafer (20). The semiconductor processing apparatus includes at least one showerhead assembly (14) disposed within the process chamber (12) facing the substrate support (18) and has a showerhead plate (16). The showerhead plate (16) has a plurality of passageways (17) extending therethrough for directing process fluid toward a substrate wafer (20) disposed on the substrate support (18). A blocking assembly (21) is disposed within the process chamber (12), the blocking assembly has an active position (32) between the showerhead assembly (14) and the substrate support (18) to restrict the flow of process fluid between the showerhead assembly (14) and the substrate support (18). The blocking assembly also has a neutral position (30) that does not restrict the flow of process fluid between the showerhead assembly (14) and the substrate support (18).

Claims

1. A semiconductor processing apparatus comprising:

a process chamber;

at least one substrate support disposed within the process chamber operable to support a substrate wafer;

at least one showerhead assembly disposed within the process chamber facing the substrate support, the showerhead assembly having a showerhead plate;

the showerhead plate having a plurality of passageways extending therethrough for directing a process fluid toward a substrate wafer disposed on the substrate support; and

a blocking assembly disposed within the process chamber, the blocking assembly having an active position between the showerhead assembly and the substrate support to restrict process fluid flow from the showerhead and a neutral position which allows unrestricted process flow.

2. The apparatus of claim 1 wherein the blocking assembly further comprises a rotator associated with the blocking assembly such that the rotator is secured within the process chamber, the rotator operable to selectively position the blocking assembly in its active position and its neutral position.

3. The apparatus of claim 1 wherein the blocking assembly further comprises:

a rod assembly extending from the process chamber;

an arm assembly coupled to the rod assembly and extending substantially perpendicular from the rod assembly, at least one blocking disk coupled to the arm assembly; and

a rod assembly having a selectively variable length such that the rod assembly operates to selectively raise or lower the blocking disk relative to the showerhead assembly.

4. The apparatus of claim 1 further comprising:

the process chamber having a top portion; and

the blocking assembly depending from the top portion.

5. The apparatus of claim 1 further comprising:

the process chamber having a bottom portion; and

the blocking assembly extending from the bottom portion.

6. The apparatus of claim 1 further comprising at least one blocking disk releasably coupled to the blocking assembly.

7. The apparatus of claim 1 further comprising:

a plurality of substrate supports;

a plurality of showerhead assemblies disposed within the process chamber facing the respective substrate supports; and

a plurality of blocking assemblies for selectively restricting process fluid flow from the showerhead assemblies.

8. The apparatus of claim 1 wherein the blocking assembly further comprises at least one blocking disk having a heating element disposed within the blocking disk.

9. The apparatus of claim 1 wherein the blocking assembly further comprises:

at least one blocking disk having an outer diameter smaller than the outer diameter of the substrate wafer; and

the at least one blocking disk selectively movable between the active position and the neutral position.

10. A process fluid blocking assembly for controlling the flow of a process fluid in a semiconductor processing apparatus comprising:

a rotator selectively rotatable;

at least one blocking disk having a substantially circular configuration;

a linkage having a first end and a second end; and

the first end coupled to the rotator and the second end coupled to the at least one blocking disk such that the blocking disk rotates as the rotator rotates.

11. The process fluid blocking assembly of claim 10 further comprising:

the linkage further having a plurality of ends operable to support a plurality of blocking disks; and

a plurality of blocking disks attached to the plurality of ends.

12. The process fluid blocking assembly of claim 10 further comprising the rotator operable to selectively position the at least one blocking disk within a semiconductor processing apparatus.

13. The process fluid blocking assembly of claim 10 further comprising:

a plurality of blocking disks having multiple disk sizes; and

the plurality of blocking disks operable to releasably couple to the linkage.

14. The process fluid blocking assembly of claim 10 further comprising:

the at least one blocking disk having a heating element disposed within the blocking disk; and

the heating element electrically connected to a power source.

15. The process fluid blocking assembly of claim 10 further comprising:

the at least one blocking disk having an electrode disposed therein; and

the electrode electrically connected to a power source.