Integrated circuit packaging for optical sensor devices
First Claim
1. An optical device structure comprising:
- a first substrate comprising;
a first major surface and a second major surface;
an optical sensor located at said first major surface;
a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points;
a second substrate comprising;
a first major surface and a second major surface;
means, aligned with said optical sensor, for allowing light to be detected by said optical sensor;
a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate;
a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and
a circuit board comprising;
a first major surface and a second major surface;
a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate;
a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads of said circuit board;
wherein said optical sensor is electrically connected to said third plurality of conductive pads of said circuit board.
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Accused Products
Abstract
An optical device packaging technique involves an optical sensor that is formed on a first substrate and flip chip bonded to a second substrate. The second substrate includes a through hole or a transparent section that is aligned with the optical sensor in order to allow light to contact the optical sensor. An embodiment of an optical device structure includes an optical sensor, a first substrate, a second substrate, and a circuit board. The optical sensor is formed on or within the first substrate and the individual sensors or pixels of the optical sensor are electrically connected to contact pads that are exposed on the first substrate. The first substrate is flip chip bonded to the second substrate. The second substrate is flip chip bonded to a circuit board. Another embodiment of an optical device structure includes an optical sensor, a first substrate, and a circuit board as the second substrate. In the embodiment, contact pads of the first substrate are flip chip bonded to contact pads of the circuit board with conductive balls. The connection between the first substrate and the circuit board provides the electrical connection between the optical sensor and the circuit board.
187 Citations
21 Claims
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1. An optical device structure comprising:
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a first substrate comprising;
a first major surface and a second major surface;
an optical sensor located at said first major surface;
a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points;
a second substrate comprising;
a first major surface and a second major surface;
means, aligned with said optical sensor, for allowing light to be detected by said optical sensor;
a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate;
a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and
a circuit board comprising;
a first major surface and a second major surface;
a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate;
a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads of said circuit board;
wherein said optical sensor is electrically connected to said third plurality of conductive pads of said circuit board.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An optical device structure comprising:
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a first substrate comprising;
a first major surface and a second major surface;
an optical sensor located at said first major surface;
a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points; and
a circuit board comprising;
a first major surface and a second major surface;
means, aligned with said optical sensor, for allowing light to be detected by said optical sensor;
a plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate;
a plurality of interconnects flip chip bonded between said plurality of connection points of said first substrate and said plurality of conductive pads of said circuit board;
a plurality of conductive leads physically connected to said circuit board and electrically connected to said plurality of conductive pads;
wherein said optical sensor is electrically connected to said plurality of conductive leads of said circuit board. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. An optical device structure comprising:
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a first substrate comprising;
a first major surface and a second major surface;
an optical sensor located at said first major surface;
a plurality of connection points formed at said first major surface, wherein said optical sensor is electrically connected to at least a portion of said plurality of connection points;
a second substrate comprising;
a first major surface and a second major surface;
a through hole, aligned with said optical sensor, for allowing light to be detected by said optical sensor;
a first plurality of conductive pads located at said first major surface and aligned with said plurality of connection points of said first substrate, wherein said plurality of connection points of said first substrate are flip chip bonded to said first plurality of conductive pads of said second substrate;
a second plurality of conductive pads physically connected to said second substrate and electrically connected to said first plurality of conductive pads; and
a circuit board comprising;
a first major surface and a second major surface;
a third plurality of conductive pads formed on said first major surface of said circuit board and aligned with said second plurality of conductive pads of said second substrate;
a plurality of interconnects connected between said second plurality of conductive pads of said second substrate and said third plurality of conductive pads of said circuit board, wherein said second plurality of conductive pads of said second substrate are flip chip bonded to said third plurality of conductive pads;
wherein said optical sensor is electrically connected to said third plurality of conductive pads on said circuit board. - View Dependent Claims (21)
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Specification