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Integrated release films for phase-change interfaces

  • US 6,399,209 B1
  • Filed: 03/28/2000
  • Issued: 06/04/2002
  • Est. Priority Date: 04/16/1999
  • Status: Expired due to Fees
First Claim
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1. A thermally conductive conformable interface pad for inter-position along the heat dissipating path between a solid state electronic device and heat sinking surface, and comprising a laminate with a relatively soft conformable body layer having opposed major surfaces and with at least one major surface consisting of an integrally bonded anti-blocking layer, said laminate being characterized in that:

  • (a) said conformable body layer comprises a blend of microcrystalline wax, an alkyl substituted poly (hydro, methyl-siloxane) wax, and a thermally conductive particulate solid, the particulate solid having a particle size of up to about 10 microns, wherein said microcrystalline wax and said alkyl substituted poly (hydro, methyl-siloxane) wax components, in combination, are present in said blend in the amount of between about 18% and 55% by weight, balance thermally conductive particulate solids; and

    (b) said integrally bonded anti-blocking layer being a resinous material selected from the group consisting of a mixture of an alkyl substituted poly (hydro, methyl-siloxane) wax and a microcrystalline wax;

    a mixture of a glassy polyester layer with a glass transition temperature of at least about 70°

    C.; and

    a mixture of a cross-linked acrylic.

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