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Multifunctional laminate structure and process

  • US 6,399,903 B1
  • Filed: 02/15/2000
  • Issued: 06/04/2002
  • Est. Priority Date: 03/01/1999
  • Status: Expired due to Fees
First Claim
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1. A multilayered structural element for attachment to electronic circuitry which comprises as sequentially attached layers:

  • (a) thin, flexible polymeric outer film layer, (b) an electronic interface layer, the electronic interface layer comprising a thin, flexible polymeric film layer having a pattern of electrically conductive lines on at least one side thereof;

    (c) a rigid structural layer;

    (d) an electromagnetic interference shielding layer; and

    (e) an optional protective layer.

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