High performance system-on-chip using post passivation process and glass substrates

• US 6,399,997 B1
• Filed: 08/01/2000
• Issued: 06/04/2002
• Est. Priority Date: 08/01/2000
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Megic Corporation (Chipbond Technology Corporation)
• Inventors: Lee, Jin-Yuan, Lin, Mou-Shiung
• Primary Examiner(s): TSAI, H JEY
• Application Number:
  US09/631,041
• Time in Patent Office: 672 Days
• Field of Search: 257/277, 257/782-783, 257/438, 257/528-540, 438/238-239, 438/381-382, 438/455-459
• US Class Current: 257/531
• CPC Class Codes: H01L 27/0688 Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind

Abstract

A new method is provided to create semiconductor devices. A completed semiconductor device that may or may contain passive electrical components is attached to a glass panel by means of an adhesive layer. The surface of the raw silicon layer of the substrate is now removed in addition to the silicon that is present between adjacent circuits. The objective of the process of the invention is to remove as much of the raw, loss inducing silicon as possible thus eliminating losses that are induced by the silicon substrate and as a consequence improving the quality of the passive components that overly the active surface of the substrate. By removing silicon from between adjacent circuits, interference between adjacent circuits is also eliminated.

Claims

1. A method of reducing electromagnetic losses, incurred by operational semiconductor devices or by thereto attached passive electrical components, said losses incurred in silicon that is in close physical proximity to said operational semiconductor devices or to said thereto attached passive electrical components, comprising:

providing a semiconductor substrate, having a passive surface exposing unprocessed silicon in or on which no semiconductor devices have been created, further having an active surface exposing processed silicon in or on the surface of which semiconductor devices have been created, having points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate;

creating one or more layers of interconnects over the active surface of said substrate, said layers of interconnects comprising conductive interconnect lines or conductive contact points or conductive vias in one or more layers, with points of electrical contact having been provided in or on the surface of said overlaying interconnecting metalization structure, at least one of said points of electrical contact making contact with at least one of said conductive interconnect lines or said conductive contact points or said conductive vias provided in said one or more layers of said overlaying interconnecting metalization structure, at least one of said metal lines or said contact points or said conductive vias making contact with at least one of said points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate;

depositing a layer of passivation over the surface of said one or more layers of interconnects;

providing passive components on the surface of said passivation layer, creating a completed semiconductor device, said completed semiconductor device comprising at least one active semiconductor device created in or on the active surface of said substrate in addition having at least one electrical components overlying said at least one active semiconductor device, said completed semiconductor device being bounded by a first plane that is parallel with and located below the passive surface of said substrate, said first plane forming an interface between said unprocessed silicon of said substrate and said processed silicon of said substrate, further being bounded by a second plane that is parallel with said first plane and coincides with the surface of said passive components, further being bounded by a set of four planes that are perpendicular to the surface of said substrate;

coating the second surface of said completed semiconductor device with a layer of adhesive material, having a surface;

attaching said completed semiconductor device to a glass panel by pressing said surface of said adhesive layer against said glass panel;

removing said unprocessed silicon, starting at the passive surface of said substrate, to about said first plane of said completed semiconductor device; and

removing said unprocessed silicon from in between adjacent completed semiconductor devices, using methods of etching, said removal being bounded by said set of four planes bounding said completed semiconductor device.

2. The method of claim 1 with the additional step of providing at least one first access to said one or more layers of interconnects over the active surface of said substrate, said first access being in the surface of said one or more layers of interconnects over the active surface of said substrate that is located closest to the surface of said substrate.

3. The method of claim 1 with the additional step of providing at least one second access to said one or more layers of interconnects over the active surface of said substrate, said second access being in the surface of said one or more layers of interconnects over the active surface of said substrate that is located furthest removed from the surface of said substrate.

4. The method of claim 1 with the additional step of providing a thick layer of insulation, passivating material over the surface of said layer of passivation.

5. The method of claim 4 wherein said insulating, separating layer comprises a polymer dielectric layer or any other appropriate insulating material but more preferably comprises polyimide or the polymer benzocyclobutene (BCB).

6. The method of claim 4 wherein said insulating, separating layer is of a thickness after curing within the range of approximately 1.0 to 150 um.

7. The method of claim 4 wherein said insulating, separating layer is spin-on coated and cured.

8. The method of claim 7 wherein said insulating, separating layer after said spin-on coating is cured at a temperature within the range of approximately 200 to 450 degrees C. for a time within the range of approximately 0.1 to 1.5 hours said curing to occur within a vacuum or nitrogen ambient.

9. The method of claim 4 wherein said insulating, separating layer is subjected to multiple processing steps of spin on coating and curing.

10. The method of claim 9 wherein said insulating, separating layer after each process step of said spin on coating is cured at a temperature within the range of approximately 200 to 450 degrees C. for a time within the range of approximately 0.5 to 1.5 hours said curing the occur within a vacuum or nitrogen ambient.

35. The method of claim 1 wherein said removing said unprocessed silicon, starting at the passive surface of said substrate, uses methods of backside grinding or Chemical Mechanical Polishing (CMP).

37. The method of claim 1 wherein said passive electrical components are selected from a group comprising thin film passive components and discrete passive components.

11. A method of reducing electromagnetic losses incurred by operational semiconductor devices or by thereto attached electrical components, said losses incurred in silicon that is in close physical proximity to said operational semiconductor devices or to said thereto attached electrical components, comprising:

providing a semiconductor substrate, having a passive surface exposing unprocessed silicon in or on which no semiconductor devices have been created, further having an active surface exposing processed silicon in or on the surface of which semiconductor devices have been created, having points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate;

depositing a layer of passivation over the surface of said semiconductor devices created in or on the active surface of said substrate;

providing components on the surface of said layer of passivation, creating a completed semiconductor device, said completed semiconductor device comprising at least one active semiconductor device created in or on the active surface of said substrate, in addition having at least one electrical component overlying said at least one active semiconductor device, said completed semiconductor device being bounded by a first plane that is parallel with and located below the passive surface of said substrate that forms an interface between said unprocessed silicon of said substrate and said processed silicon of said substrate, further being bounded by a second plane that is parallel with said first plane and coincides with the surface of said electrical components, further being bounded by a set of four planes that are perpendicular to the surface of said substrate;

coating the surface of said electrical components with a layer of adhesive material, having a surface;

attaching said completed semiconductor device to a glass panel by pressing said surface of said adhesive layer against said glass panel;

removing said unprocessed silicon, starting at the passive surface of said substrate, to about said first plane of said completed semiconductor device, using methods of backside grinding or Chemical Mechanical Polishing (CMP); and

removing said unprocessed silicon from in between adjacent completed semiconductor devices, using methods of etching, said removal being bounded by said set of four planes bounding said completed semiconductor device.

12. The method of claim 11 with the additional step of providing at least one access to said points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate.

13. The method of claim 11 with the additional step of providing a thick layer of insulation, passivating material over the surface of said layer of passivation.

14. The method of claim 13 wherein said insulating, separating layer comprises a polymer dielectric layer or any other appropriate insulating material but more preferably comprises polyimide or the polymer benzocyclobutene (BCB).

15. The method of claim 13 wherein said insulating, separating layer is of a thickness after curing within the range of approximately 1.0 to 30 um.

16. The method of claim 13 wherein said insulating, separating layer is spin-on coated and cured.

17. The method of claim 13 wherein said insulating, separating layer is subjected to multiple processing steps of spin on coating and curing.

38. The method of claim 11 wherein said at least one electrical component is selected from a group comprising at least one thin film passive component and at least one discrete passive component.

18. A structure for reducing electromagnetic losses, incurred by operational semiconductor devices or by thereto attached passive electrical components, said losses incurred in silicon that is in close physical proximity to said operational semiconductor devices or to said thereto attached passive electrical components, comprising:

a semiconductor substrate, having a passive surface exposing unprocessed silicon in or on which no semiconductor devices have been created, further having an active surface exposing processed silicon in or on the surface of which semiconductor devices have been created, having points of electrical contact provided to staid semiconductor devices in or on the active surface of said substrate;

one or more layers of interconnects over the active surface of said substrate, said layers of interconnects comprising conductive interconnect lines or conductive contact points or conductive vias in one or more layers, with points of electrical contact having been provided in or on the surface of said overlaying interconnecting metalization structure, at least one of said points of electrical contact making contact with at least one of said conductive interconnect lines or said conductive contact points or said conductive vias provided in said one or more layers of said overlaying interconnecting metalization structure, at least one of said metal lines or said contact points or said conductive vias making contact with at least one of said points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate;

a layer of passivation deposited over the surface of said one or more layers of interconnects;

passive components created on the surface of said passivation layer, creating a completed semiconductor device, said completed semiconductor device comprising at least one active semiconductor device created in or on the active surface of said substrate in addition having at least one electrical component overlying said at least one active semiconductor device, said completed semiconductor device being bounded by a first plane that is parallel with and located below the passive surface of said substrate, said first plane forming an interface between said unprocessed silicon of said substrate and said processed silicon of said substrate, further being bounded by a second plane that is parallel with said first plane and coincides with the surface of said passive components, further being bounded by a set of four planes that are perpendicular to the surface of said substrate;

a layer of adhesive material, having a surface, coated over the second surface of said completed semiconductor device;

said completed semiconductor device attached to a glass panel by pressing said surface of said adhesive layer against said glass panel;

said unprocessed silicon having been removed, starting at the passive surface of said substrate, to about said first plane of said completed semiconductor device, using methods of backside grinding or Chemical Mechanical Polishing (CMP); and

said unprocessed silicon having been removed from in between adjacent completed semiconductor devices, using methods of etching, said removal being bounded by said set of four planes bounding said completed semiconductor device.

19. The structure of claim 18 with the addition of at least one first access to said one or more layers of interconnects over the active surface of said substrate, said first access being in the surface of said one or more layers of interconnects over the active surface of said substrate that is located closest to the surface of said substrate.

20. The structure of claim 18 with the addition of at least one second access to said one or more layers of interconnects over the active surface of said substrate, said second access being in the surface of said one or more layers of interconnects over the active surface of said substrate that is located furthest removed from the surface of said substrate.

21. The structure of claim 18 with the addition of a thick layer of insulation, passivating material over the surface of said layer of passivation.

22. The structure of claim 21 wherein said insulating, separating layer comprises a polymer dielectric layer or any other appropriate insulating material but more preferably comprises polyimide or the polymer benzocyclobutene (BCB).

23. The structure of claim 21 wherein said insulating, separating layer is of a thickness after curing within the range of approximately 1.0 to 150 um.

24. The structure of claim 21 wherein said insulating, separating layer is spin-on coated and cured.

25. The structure of claim 24 wherein said insulating, separating layer after said spin-on coating is cured at a temperature within the range of approximately 250 to 450 degrees C. for a time within the range of approximately 0.5 to 1.5 hours said curing to occur within a vacuum or nitrogen ambient.

26. The structure of claim 21 wherein said insulating, separating layer is subjected to multiple processing steps of spin on coating and curing.

27. The structure of claim 26 wherein said insulating, separating layer after each process step of said spin on coating is cured at a temperature within the range of approximately 200 to 450 degrees C. for a time within the range of approximately 0.1 to 1.5 hours said curing the occur within a vacuum or nitrogen ambient.

36. The method of claim 18 wherein said removing said unprocessed silicon, starting at the passive surface of said substrate, uses methods of backside grinding or Chemical Mechanical Polishing (CMP).

39. The method of claim 18 wherein said passive components are selected from a group comprising thin film passive components and discrete passive components.

28. A structure for reducing electromagnetic losses incurred by operational semiconductor devices or by thereto attached electrical components, said losses incurred in silicon that is in close physical proximity to said operational semiconductor devices or to said thereto attached electrical components, comprising:

a semiconductor substrate, having a passive surface exposing unprocessed silicon in or on which no semiconductor devices have been created, further having an active surface exposing processed silicon in or on the surface of which semiconductor devices have been created, having points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate;

a layer of passivation deposited over the surface of said semiconductor devices created in or on the active surface of said substrate;

components provided on the surface of said layer of passivation, creating a completed semiconductor device, said completed semiconductor device comprising at least one active semiconductor device created in or on the active surface of said substrate, in addition having at least one passive electrical components overlying said at least one active semiconductor device, said completed semiconductor device being bounded by a first plane that is parallel with and located below the passive surface of said substrate that forms an interface between said unprocessed silicon of said substrate and said processed silicon of said substrate, further being bounded by a second plane that is parallel with said first plane and coincides with the surface of said passive components, further being bounded by a set of four planes that are perpendicular to the surface of said substrate;

a layer of adhesive material, having a surface, coated over the surface of said components with;

said completed semiconductor device attached to a glass panel by pressing said surface of said adhesive layer against said glass panel;

said unprocessed silicon having been removed, starting at the passive surface of said substrate, to about said first plane of said completed semiconductor device, using methods of backside grinding or Chemical Mechanical Polishing (CMP); and

said unprocessed silicon having been removed from in between adjacent completed semiconductor devices, using methods of etching, said removal being bounded by said set of four planes bounding said completed semiconductor device.

29. The structure of claim 28 with the of at least one access to said points of electrical contact provided to said semiconductor devices in or on the active surface of said substrate.

30. The structure of claim 28 with the addition a thick layer of insulation, passivating material over the surface of said layer of passivation.

31. The structure of claim 30 wherein said insulating, separating layer comprises a polymer dielectric layer or any other appropriate insulating material but more preferably comprises polyimide or the polymer benzocyclobutene (BCB).

32. The structure of claim 30 wherein said insulating, separating layer is of a thickness after curing within the range of approximately 1.0 to 150 um.

33. The structure of claim 30 wherein said insulating, separating layer is spin-on coated and cured.

34. The structure of claim 30 wherein said insulating, separating layer is subjected to multiple processing steps of spin on coating and curing.

40. The method of claim 28 wherein said passive electrical components are selected from a group comprising thin film passive components and discrete passive components.