Hermatic firewall for MEMS packaging in flip-chip bonded geometry

• US 6,400,009 B1
• Filed: 10/15/1999
• Issued: 06/04/2002
• Est. Priority Date: 10/15/1999
• Status: Expired due to Term

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agere Systems Guardian Corp. (Broadcom, Inc.), Lucent Technologies, Inc. (Nokia Corporation)
• Inventors: Kim, Jungsang, Gates, John VanAtta II, Bishop, David John
• Primary Examiner(s): Enad, Elvin
• Assistant Examiner(s): Lee, Kyung S.
• Application Number:
  US09/419,488
• Time in Patent Office: 963 Days
• Field of Search: 257/704, 257/710, 257/659, 257/660, 257/729, 257/712, 257/703, 257/708
• US Class Current: 257/704
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.

Claims

1. A packing having a cavity with a height for having a micro-electromechanical systems (MEMS) device and sealing the MEMS device in the cavity to protect the MEMS device against deleterious conditions present in an environment of the package, comprising:

a first substrate for defining a base on which the MEMS device is fabricated;

a firewall fabricated on the first substrate and having a bottom surface engaged with the first substrate, said firewall forming walls of the cavity which extend upwardly away from the bottom surface for fully surrounding the MEMS device within the cavity which is bounded and formed by the firewall and the first substrate, said firewall comprising alternating stacks of poly-silicon and silicon dioxide encapsulated by poly-silicon; and

a second substrate bonded to the first substrate over the firewall and in sealed engagement with the firewall for creating a cavity-closing seat for the cavity within which the MEMS device is fully enclosed against the deleterious conditions present in the environment of the package so that the MEMS device is packaged protectedly within the cavity and remote from the deleterious conditions.

2. The package of claim 1, wherein the seal is a hermetic seal.

3. The package of claim 2, wherein the hermetic seal comprises a thin film metal material overlaying at least a portion of a top surface of the firewall.

4. The package of claim 3, wherein the hermetic seal comprises a thin film metal material soldered to the top surface of the firewall to produce the hermetic seal having a mechanical strength and imparting structural integrity to the package.

5. The package of claim 4, further comprising a plurality of solder bumps fabricated on the first substrate to supplement the mechanical strength provided by the hermetic seal.

6. The package of claim 5, wherein the thin film metal material comprises gold.

7. The package of claim 5, wherein the thin film metal material comprises silver.

8. The package of claim 5, wherein the thin film metal material comprises an alloy of gold.

9. The package of claim 5, wherein the thin film metal material comprises an alloy of silver.

10. The package of claim 1, further comprising electrical leads connected to the MEMS device in the cavity and extending through the firewall.

11. The package of claim 10, wherein the electrical leads comprise a poly-silicon layer surrounded by a silicon dioxide layer which is further surrounded by another layer of poly-silicon.

12. The package of claim 1, further comprising a plurality of spacers formed on either one or both of the two substrates to space apart the two substrates by a predetermined distance and thereby define a height of the cavity, and wherein the second substrate is placed over the cavity in further sealed engagement with the plurality of spacers.

13. A package having a cavity with a height for housing a micro-electromechanical systems (MEMS) device and sealing the MEMS device in the cavity to protect the MEMS device against deleterious conditions present in an environment of the package, comprising:

a first substrate for defining a base on which the MEMS device is fabricated;

a firewall fabricated on the first substrate and having a bottom surface engaged with the first substrate, said firewall forming walls of the cavity which extend upwardly away from the bottom surface, for fully surrounding the MEMS device within the cavity which is bounded and formed by the firewall and the first substrate;

electrical leads connected to the MEMS device in the cavity and extending through the firewall, said electrical leads comprising a poly-silicon layer surrounded by a silicon dioxide layer which is farther surrounded by another layer of poly-silicon; and

a second substrate bonded to the first substrate over the firewall and in sealed engagement with the firewall for creating a cavity-closing seal for the cavity within which the MEMS device is fully enclosed against the deleterious conditions present in the environment of the package so that the MEMS device is packaged protectedly within the cavity and remote from the deleterious conditions.

14. The package of claim 13, further comprising a plurality of spacers formed on either one or both of the two substrates to space apart the two substrates by a predetermined amount and thereby define a height of the cavity, and wherein the second substrate is placed over the cavity in further sealed engagement with the plurality of spacers.

15. The package of claim 13, wherein the seal is a hermetic seal comprising a thin film metal material overlaying at least a portion of a top surface of the firewall.

16. The package of claim 15, wherein the hermetic seal is soldered to the top surface of the firewall to produce the hermetic seal having a mechanical strength and imparting structural integrity to the package.

17. The package of claim 16, further comprising a plurality of solder bumps fabricated on the first substrate to supplement the mechanical strength provided by the hermetic seal.

18. The package of claim 13, wherein the firewall comprises alternating stacks of poly-silicon and silicon dioxide encapsulated by poly-silicon.