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Projection exposure apparatus and method

  • US 6,400,441 B1
  • Filed: 09/20/2000
  • Issued: 06/04/2002
  • Est. Priority Date: 11/28/1996
  • Status: Expired due to Fees
First Claim
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1. A projection exposure method for exposing sensitive substrates by projecting a pattern formed on a mask through a projection optical system onto the sensitive substrates, comprising:

  • preparing a first substrate stage and a second substrate stage, each of which is movable independently on a two-dimensional plane while holding a sensitive substrate; and

    performing, by using the first substrate stage, at least one of an exchange operation for the sensitive substrate and a detecting operation for a mark on the first stage or on the sensitive substrate held on the first stage, while executing a scanning exposure operation for the sensitive substrate held on the second substrate stage, wherein each of shot areas on the sensitive substrate held on the second substrate stage is exposed by moving the second substrate stage while projecting the pattern on the mask onto the sensitive substrate held on the second substrate stage, and wherein the two substrate stages are controlled such that the two substrate stages do not physically interfere with each other.

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