Integrated circuit socket assembly having integral shielding members

• US 6,400,577 B1
• Filed: 08/30/2001
• Issued: 06/04/2002
• Est. Priority Date: 08/30/2001
• Status: Expired due to Fees

• Current Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Original Assignee: Tyco Electronics Corporation (TE Connectivity Limited)
• Inventors: Yue, Chuanlong, Knaub, Curtis G., Goodwin, Jonathan W.
• Primary Examiner(s): Gandhi, Jayprakash N.
• Assistant Examiner(s): Phan, Thanh S.
• Application Number:
  US09/943,596
• Time in Patent Office: 278 Days
• Field of Search: 361/816, 361/818, 361/704, 361/709, 361/753, 361/715, 361/800, 174/35.R, 174/35.GC, 439/66, 439/71, 439/74, 439/341, 257/717-719
• US Class Current: 361/816
• CPC Class Codes: H05K 7/1084 pin grid array package carriers

Abstract

An integrated circuit socket assembly including a frame and a contact assembly has EMI shielding integral with the socket frame. In one embodiment, the integrated circuit socket includes a cocket for a Land Grid Array (LGA) or Ball Grid Array (BGA) device. EMI shielding in the form of a conductive shielding member is disposed in opening that extend through side portions one each of the sides of the frame. The conductive shielding members extend slightly below the lower surface of the the frame so as to make contact with cooperative conductive areas on a printed circuit board when the socket assembly is mounted to the printed circuit board in amounting position. The conductive shielding members may extend above the upper surface of the frame so as to contact a conductive heat sink mounted above the socket assembly. In a preferred embodiment, the conductive members comprise resilient conductive shielding members.

Claims

1. A shielded socket for an integrated circuit package comprising:

a frame of insulating material having four side portions with at least one opening extending along at least a portion of the length of the respective side portion and vertically through the respective side portion, said side portions defining a central cavity sized to receive said integrated circuit package;

a contact assembly mounted to said frame, said contact assembly having an array of conductive columns having respective contact ends and an insulative sheet in which the conductive columns are mounted, said array being arranged in a predetermined pattern to mate with corresponding contacts on said integrated circuit package; and

a conductive member disposed in said at least one opening of each of said side portions and extending at least partially along the length of the respective side portion;

said socket configured to be mountable to an associated printed circuit board such that each conductive member contacts a conductive area coupled to a ground plane when the socket is disposed in a mounting position on said printed circuit board so as to provide EMI shielding for said integrated circuit package when said package is mounted within said socket.

2. The shielded socket of claim 1 wherein said frame includes first elements for alignment of said contact assembly to said frame and for alignment of said socket assembly to said printed circuit board, and second elements for alignment of said integrated circuit package with respect to said socket assembly.

3. The shielded socket of claim 1 wherein said conductive members comprise resilient conductive shielding members.

4. The shielded socket of claim 1 wherein said conductive members comprise metallic shielding members.

5. The shielded socket of claim 1 further including a conductive cap, wherein said conductive cap is mounted atop said frame and electrically coupled to said conductive members.

6. The shielded socket of claim 5 wherein said conductive cap comprises a heat sink, said heat sink having a lower surface configured to be in abutting relation with said integrated circuit package when said heat sink is mounted atop said socket assembly.

7. The shielded socket of claim 6 wherein said heat sink is mounted in heat conducting relation to said integrated circuit package when said integrated circuit package is mounted within said central cavity of said shielded socket.

8. A reduced EMI packaging assembly comprising:

an integrated circuit device having a plurality of contacts disposed on one surface of said device in a predetermined contact array pattern;

a socket assembly comprising a frame and a contact assembly, said frame of insulating material having four side portions with at least one opening extending along at least a portion of the length of the respective side portion and vertically through the respective side portion, said side portions defining a central cavity sized to receive said integrated circuit device, said contact assembly mounted to said frame, said contact assembly having an array of conductive columns having respective contact ends and an insulative sheet in which the conductive columns are mounted, said array being arranged in said predetermined contact pattern;

a conductive shielding member disposed in said at least one opening in each of said side portions and extending at least partially along the length of the respective side portion; and

a printed circuit board having a plurality of conductive areas disposed thereon, wherein said traces are configured to be coupled to ground potential in an operational electronic device;

said integrated circuit device being mounted within said socket assembly and said socket assembly being mounted to said printed circuit board in a socket assembly mounting position with said conductive shielding members in electrically conductive abutting relation with corresponding conductive areas of said circuit board so as to provide EMI shielding of said integrated circuit device.

9. The packaging assembly of claim 8 further including an electrically conductive heat sink mounted to said socket assembly in electrically abutting relation with said conductive shielding members so as to form a shielding enclosure for said integrated circuit device comprising said heat sink and said conductive shielding members.

10. The packaging assembly of claim 9 further including a mounting member disposed on a first side of said printed circuit board, said mounting member having a plurality of upstanding posts extending therefrom and through corresponding holes in said printed circuit board, said socket assembly being mounted on a second side of said printed circuit board and said upstanding posts extending through corresponding holes in said frame of said socket assembly and through corresponding holes in said heat sink, said packaging assembly being retained in assembled relation via fasteners that engage respective upstanding posts.

11. The packaging assembly of claim 8 wherein said frame further includes first elements for alignment of said contact assembly with respect to said frame and for alignment of said socket assembly with respect to said printed circuit board, and second elements for alignment of said integrated circuit package with respect to said socket assembly.

12. The packaging assembly of claim 8 wherein said conductive shielding members comprise resilient conductive shielding members.

13. The packaging assembly of claim 8 wherein said conductive shielding members comprise metallic shielding members.

14. The packaging assembly of claim 8 further including a conductive cap, wherein said conductive cap is mounted above said socket assembly and is electrically coupled to said conductive members.