Apparatus for laser stripping coated cables for endocardial defibrillation leads and method of manufacture of such leads

• US 6,401,334 B1
• Filed: 02/18/1999
• Issued: 06/11/2002
• Est. Priority Date: 02/18/1999
• Status: Expired due to Fees

• Current Assignee: Intermedics Incorporated
• Original Assignee: Intermedics IND
• Inventors: Reddy, G. Shantanu, McLean, Arthur G. N.
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Kim, Paul D.
• Application Number:
  US09/252,420
• Time in Patent Office: 1,209 Days
• Field of Search: 29/33, 297/45, 297/55, 297/60, 298/68, 297/47, 298/60
• US Class Current: 29/860
• CPC Class Codes: H02G 1/128 using radiant energy, e.g. a laser beam
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49179 by metal fusion bonding
• CPC Class Codes: Y10T 29/49187 with forming eyelet from elongated conductor
• CPC Class Codes: Y10T 29/49192 with insulation removal
• CPC Class Codes: Y10T 29/49194 Assembling elongated conductors, e.g., splicing, etc.
• CPC Class Codes: Y10T 29/51 Plural diverse manufacturing apparatus including means for metal shaping or assembling
• CPC Class Codes: Y10T 29/532 Conductor
• CPC Class Codes: Y10T 29/53209 Terminal or connector
• CPC Class Codes: Y10T 29/53243 Multiple, independent conductors
• CPC Class Codes: Y10T 29/53265 with work-holder for assembly

Abstract

An apparatus and method for laser stripping coated cables for endocardial defibrillation leads comprising a jig for holding at least one insulated wire, the jig having a base plate, a linear stripping area on the plate, a first clasp mounted on the plate for holding a first end of the wire, at least two primary pins mounted on the plate on a first side of the linear stripping area, at least one secondary pin mounted on the plate on a second side of the linear stripping area, and a second clasp mounted on the plate for holding a second end of the wire; and a laser effective to remove insulation from the insulated wire, the laser being mounted to effectively remove insulation in the linear stripping area.

Claims

1. An apparatus for preparing insulated wires for assembly in an implantable lead, said apparatus comprising:

a jig for holding at least one insulated wire, said jig having

a base plate,

a linear stripping area on said plate, wherein said linear stripping area comprises a slot,

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire; and

a laser effective to remove insulation from said insulated wire, said laser being mounted to effectively remove insulation in said linear stripping area;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin.

2. The apparatus according to claim 1, further comprising at least one tertiary pin mounted on said plate on said second side of said linear stripping area between said secondary pin and said linear stripping area.

3. The apparatus according to claim 2 wherein said first and second clasps are mounted on said second side.

4. The apparatus according to claim 3 wherein said at least one secondary pin comprises a set containing a plurality of secondary pins, each secondary pin being a first common distance from said linear stripping area, said at least one tertiary pin comprises a plurality of tertiary pins, each tertiary pin being a third common distance from said linear stripping area, and said primary pins comprise at least one more pin than the sum of said plurality of secondary pins in said set and said tertiary pins and each of said primary pins is a second common distance from said linear stripping area.

5. The apparatus according to claim 4 wherein said set of secondary pins comprises a plurality of sets of pins, each pin in a set being mounted at a common distance away from said linear stripping area and pins in different sets being mounted at different distances from said linear stripping area.

6. The apparatus according to claim 1 wherein said at least one secondary pin comprises a set of pins, each pin in said set being mounted at a different distance away from said linear stripping area.

7. The apparatus according to claim 1 wherein said at least one secondary pin comprises a set containing a plurality of secondary pins, each secondary pin in said set being a first common distance from said linear stripping area, a nd said primary pins comprise at least one more pin than said plurality of secondary pins and each of said primary pins is a second common distance from said linear stripping area.

8. The apparatus according to claim 7 wherein said set of secondary pin comprises a plurality of sets of pins, each pin in a set being mounted at a common distance away from said linear stripping area.

9. The apparatus according to claim 1, wherein said linear stripping area includes a first shield mounted on said first side of said slot and a second shield mounted on said second side.

10. An apparatus for preparing insulated wires for assembly in an implantable lead, said apparatus comprising:

a jig for holding at least one insulated wire, said jig having

a base plate,

a linear stripping area on said plate, wherein said linear stripping area comprises a shield;

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire; and

a laser effective to remove insulation from said insulated wire, said laser being mounted to effectively remove insulation in said linear stripping area;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin.

11. An apparatus for preparing insulated wires for assembly in an implantable lead, said apparatus comprising:

a jig for holding at least one insulated wire, said jig having

a base plate,

a linear stripping area on said plate,

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire; and

a laser effective to remove insulation from said insulated wire, said laser being mounted to effectively remove insulation in said linear stripping area;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin, wherein the laser is located on a different side of the base plate than the insulated wire when the insulated wire is mounted on the jig.

12. A jig for holding at least one insulated wire for stripping insulation from selected sections of said wire by laser emissions, said jig having:

a base plate,

a linear stripping area on said plate, the linear stripping area configured for providing exposure of said wire to said laser emissions, wherein said linear stripping area comprises a slot;

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin.

13. The jig according to claim 12, further comprising at least one tertiary pin mounted on said plate on said second side of said linear stripping area between said secondary pin and said linear stripping area.

14. The jig according to claim 13 wherein said first and second clasps are mounted on said second side.

15. The jig according to claim 14 wherein said at least one secondary pin comprises a set containing a plurality of secondary pins, each secondary pin being a first common distance from said linear stripping area, said at least one tertiary pin comprises a plurality of tertiary pins, each tertiary pin being a third common distance from said linear stripping area, and said primary pins comprise at least one more pin than the sum of said plurality of secondary pins in said set and said tertiary pins and each of said primary pins is a second common distance from said linear stripping area.

16. The jig according to claim 15 wherein said set of secondary pins comprises a plurality of sets of pins, each pin in a set being mounted at a common distance away from said linear stripping area and pins in different sets being mounted at different distances from said linear stripping area.

17. The jig according to claim 12 wherein said at least one secondary pin comprises a set of pins, each pin in said set being mounted at a different distance away from said linear stripping area.

18. The jig according to claim 12 wherein said at least one secondary pin comprises a set containing a plurality of secondary pins, each secondary pin in said set being a first common distance from said linear stripping area, and said primary pins comprise at least one more pin than said plurality of secondary pins and each of said primary pins is a second common distance from said linear stripping area.

19. The jig according to claim 18 wherein said set of secondary pin comprises plurality of sets of pins, each pin in a set being mounted at a common distance away from said linear stripping area.

20. The jig according to claim 12, wherein said linear stripping area includes a shield.

21. A jig for holding at least one insulated wire for stripping insulation from selected sections of said wire by laser emissions, said jig having:

a base plate,

a linear stripping area on said plate, the linear stripping area configured for providing exposure of said wire to said laser emissions wherein said linear stripping area comprises a shield;

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the

linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin.

22. The jig of claim 21, wherein said shield is mounted on said first side of said slot and a second shield is mounted on said second side.

23. An apparatus for preparing insulated wires for assembly in an implantable lead, said apparatus comprising

a jig for holding at least one insulated wire, said jig having

a base plate,

a linear stripping area on said plate, wherein said linear stripping area comprises a shield and at least one fastener removably connecting said base plate and said shield,

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire;

and

a laser effective to remove insulation from said insulated wire, said laser being mounted to effectively remove insulation in said linear stripping area;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin.

24. The apparatus according to claim 23, wherein said linear stripping area comprises a slot.

25. The apparatus according to claim 24, wherein said shield is mounted on said first side of said slot and a second shield is mounted on said second side.

26. A jig for holding at least one insulated wire for stripping insulation from selected sections of said wire by laser emissions, said jig having

a base plate,

a linear stripping area on said plate, the linear stripping area configured for providing exposure of said wire to said laser emissions, wherein said linear stripping area comprises a shield and at least one fastener removably connecting said base plate and said shield;

a first clasp mounted on said plate for holding a first end of said wire,

at least two primary pins mounted on said plate on a first side of said linear stripping area,

at least one secondary pin mounted on said plate on a second side of said linear stripping area, and

a second clasp mounted on said plate for holding a second end of said wire;

wherein, the at least two primary pins and the at least one secondary pin are located on said plate so that one or more selected sections of the insulated wire are located over the linear stripping area when the insulated wire is mounted to the at least two primary pins and the at least one secondary pin.

27. The jig according to claim 26, wherein said linear stripping area comprises a slot.

28. The jig according to claim 27, wherein said shield is mounted on said first side of said slot and a second shield is mounted on said second side.