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Pressure sensing semiconductor device comprising a semiconductor chip which has a diaphragm formed with piezoresistance

  • US 6,401,542 B1
  • Filed: 07/11/2000
  • Issued: 06/11/2002
  • Est. Priority Date: 01/24/2000
  • Status: Expired due to Fees
First Claim
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1. A pressure sensing semiconductor device comprising:

  • a semiconductor chip having a diaphragm formed with piezoresistance;

    a seating having a first main surface to which said semiconductor chip is fixed and in which a through hole is located at a point facing said diaphragm;

    a pressure leading-in tube of metal having a cylinder leading to said through hole in said seating and a flange having a first main surface fixed to a second main surface of said seating on the opposite side of said first main surface of said seating; and

    a metal substrate having a through hole in which said cylinder is inserted and a control circuit electrically connected to said semiconductor chip, said metal substrate being jointed to said flange by welding.

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