Method for patterning devices
First Claim
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1. A method of fabricating a device, comprising the steps of:
- (a) fabricating a standoff on a substrate;
(b) positioning a shadow mask in a first position over the substrate and placing the shadow mask onto the standoff;
(c) performing a first process on the substrate through the shadow mask;
(d) after performing the first process, moving the shadow mask to a second position over the substrate, and placing the shadow mask onto the standoff; and
(e) after moving the shadow mask to a second position, performing a second process on the substrate through the shadow mask.
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Abstract
A method of fabricating a device is provided. A shadow mask is positioned in a first position over a substrate. A first process is performed on the substrate through the shadow mask. After the first process is performed, the shadow mask is moved to a second position over the substrate, measured relative to the first position. After the shadow mask is moved to the second position, a second process is performed on the substrate through the shadow mask.
144 Citations
20 Claims
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1. A method of fabricating a device, comprising the steps of:
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(a) fabricating a standoff on a substrate;
(b) positioning a shadow mask in a first position over the substrate and placing the shadow mask onto the standoff;
(c) performing a first process on the substrate through the shadow mask;
(d) after performing the first process, moving the shadow mask to a second position over the substrate, and placing the shadow mask onto the standoff; and
(e) after moving the shadow mask to a second position, performing a second process on the substrate through the shadow mask. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of fabricating a device, comprising the steps of:
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(a) fabricating a standoff on a substrate having first, second, third and fourth contact pads;
(b) after step (a), positioning a shadow mask in a first position over a substrate by placing the shadow mask onto the standoff;
(c) after step (b), depositing a first organic layer through the shadow mask, such that the first organic layer substantially covers the first contact pad;
(d) after step (c), moving the shadow mask to a second position, and placing the shadow mask onto the standoff;
(e) after step (d) depositing a first electrode through the shadow mask, such that the first electrode contacts the second contact pad, has a substantial overlap with the first organic layer, and does not contact any object selected from the group consisting of the first, third and fourth contact pads;
(f) after step (e), moving the shadow mask back to the first position, and placing the shadow mask onto the standoff;
(g) after step (f), depositing a second organic layer through the shadow mask;
(h) after step (g), moving the shadow mask to a third position, and placing the shadow mask onto the standoff;
(i) after step (h), depositing a second electrode through the shadow mask, such that the second electrode contacts the third contact pad, has a substantial overlap with the second organic layer, and does not contact any object selected from the group consisting of the first, second and fourth contact pads, and the first electrode;
(j) after step (i), moving the shadow mask back to the first position, and placing the shadow mask onto the standoff;
(k) after step (i), depositing a third organic layer through the shadow mask;
(l) after step (k), moving the shadow mask to a fourth position, and placing the shadow mask onto the standoff;
(m) after step (l), depositing a third electrode through the shadow mask, such that the third electrode contacts the fourth contact pad, has a substantial overlap with the third organic layer, and does not contact any object selected from the group consisting of the first, second and third contact pads, and the first and second electrodes.
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20. A method of fabricating a device, comprising the steps of:
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(a) fabricating a standoff on a substrate having first, second, third and fourth contact pads;
(b) after step (a), positioning a shadow mask in a first position over a substrate by placing the shadow mask onto the standoff;
(c) after step (b), depositing a first organic layer through the shadow mask, such that the first organic layer substantially covers the first contact pad;
(d) after step (c), moving the shadow mask to a second position, and placing the shadow mask onto the standoff;
(e) after step (d), depositing a first electrode through the shadow mask, such that the first electrode contacts the second contact pad, has a substantial overlap with the first organic layer, and does not contact any object selected from the group consisting of the first, third and fourth contact pads;
(f) after step (e), moving the shadow mask to a third position, and placing the shadow mask onto the standoff;
(g) after step (f), depositing a second organic layer through the shadow mask;
(h) after step (g), moving the shadow mask to a fourth position, and placing the shadow mask onto the standoff;
(i) after step (h), depositing a second electrode through the shadow mask, such that the second electrode contacts the third contact pad, has a substantial overlap with the second organic layer, and does not contact any object selected from the group consisting of the first, second and fourth contact pads, and the first electrode;
(j) after step (i), moving the shadow mask back to a fifth position, and placing the shadow mask onto the standoff;
(k) after step (j), depositing a third organic layer through the shadow mask;
(l) after step (k), moving the shadow mask to a sixth position, and placing the shadow mask onto the standoff;
(m) after step (l), depositing a third electrode through the shadow mask, such that the third electrode contacts the fourth contact pad, has a substantial overlap with the third organic layer, and does not contact any object selected from the group consisting of the first, second and third contact pads, and the first and second electrodes.
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Specification