Electronic component package assembly and method of manufacturing the same

• US 6,403,881 B1
• Filed: 08/26/1999
• Issued: 06/11/2002
• Est. Priority Date: 08/26/1998
• Status: Expired due to Fees

• Current Assignee: Thales Optronique SA (Thales SA)
• Original Assignee: Elliott Industries Limited (B. Elliott Ltd.)
• Inventors: Hughes, John E
• Primary Examiner(s): Wong, Peter S.
• Assistant Examiner(s): Laxton, Gary L.
• Application Number:
  US09/383,748
• Time in Patent Office: 1,020 Days
• Field of Search: 174/52.3, 257/704, 257/778, 257/789, 257/794, 257/796
• US Class Current: 174/559
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/85205 Ultrasonic bonding
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An electronic component package assembly includes a substantially planar base substrate having a plurality of cavities each defined by a frame; an electronic component attached to the base substrate within each cavity; and a lid fixed to the frame such that, in combination, the base, the lid and each frame define an enclosed volume housing the electronic component.

Claims

1. An electronic component package assembly separable into a plurality of electronic component packages, the package assembly comprising:

a substantially planar base substrate;

a frame layer comprising a laminate material formed with a plurality of cavities, the frame layer being attached to the planar base substrate, and a raised member upstanding from the frame layer;

a plurality of electronic components, each component being attached to the base substrate within one of the plurality of cavities; and

a lid covering and spaced apart from the frame layer by the raised member to create a predetermined gap between the lid and the frame layer, wherein the gap is filled with an adhesive to fix the lid to the frame layer such that, in combination, the base substrate, the lid and each of the cavities in the frame layer define a plurality of electronic component packages each of which is separable from the electronic component package assembly and has an enclosed volume which houses one of the electronic components.

2. A package assembly according to claim 1, wherein the cavities are arranged in an array in the frame layer.

3. A package assembly according to claim 1, wherein the base substrate comprises further layers of a laminate material.

4. A package assembly according to claim 1, wherein the frame layer comprises one or more layers of a laminate material.

5. A package assembly according to claim 1, wherein each cavity is of a substantially rectangular configuration.

6. A package assembly according to claim 1, wherein the lid is manufactured from a transparent material.

7. A package assembly according to claim 6, wherein the transparent material has a selected transmissivity.

8. A package assembly according to claim 6, wherein the electronic components are optical devices.

9. A package assembly according to claim 1, wherein the lid is manufactured from glass.

10. A package assembly according to claim 1, wherein each of the enclosed volumes housing one of the electronic components also includes a protective compound.

11. A package assembly according to claim 10, wherein the protective compound is a UV-cured acrylic.

12. A package assembly according to claim 1, wherein the base substrate has at least one etched electrically conducting surface and the electronic components are electrically connected to the surface.

13. A package assembly according to claim 1, wherein the frame layer has at least one etched surface.

14. A package assembly according to claim 1, wherein the base substrate includes a plurality of conducting layers and at least one via to interconnect the conducting layers through the base substrate.

15. A package assembly according to claim 1, wherein the frame layer has a plurality of conducting layers and at least one via to interconnect the conducting layers through the frame layer.

16. A package assembly according to claim 1, wherein thermal vias are provided through the base substrate to dissipate heat from the electronic components.

17. A package according to claim 1, wherein the electronic components are flip-chips each of which has an optical surface, the base substrate being formed with a plurality of cut-outs each of which is substantially adjacent the optical surface of a respective flip-chip, the cut-outs being covered with a transparent material.

18. The assembly of claim 17 further comprising a via formed through the substrate and centered along the cut line.

20. The assembly of claim 1 wherein the raised member is located in alignment with a cut line, along which cut line an electronic component package is separable from the assembly.

19. A method of manufacturing an electronic component package, the method comprising the steps of:

providing a substantially planar base substrate and a frame layer comprising a laminate material formed with a plurality of cavities, and a raised member upstanding from the frame layer;

attaching the frame layer to the planar base substrate;

attaching a plurality of electronic components to the base substrate, each component being attached to the base substrate within one of the plurality of cavities;

locating a lid over the frame layer and spaced apart from the frame layer by the raised member to create a predetermined gap between the lid and the frame layer;

filling the gap with an adhesive to fix the lid to the frame thereby producing an electronic component package assembly such that, in combination, the base substrate, the lid and each of the cavities in the frame layer define a plurality of electronic component packages each of which is separable from the electronic component package assembly and has an enclosed volume which houses one of the electronic components; and

separating from the electronic component package assembly a plurality of electronic component packages.