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Wiring substance and semiconductor

  • US 6,403,895 B1
  • Filed: 02/04/2000
  • Issued: 06/11/2002
  • Est. Priority Date: 02/10/1999
  • Status: Expired due to Fees
First Claim
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1. A wiring substrate comprising:

  • a wiring pattern formed on a substrate, the wiring pattern provided with at least one wiring and a plurality of separate and distinct conductive lands, each land covering a perforation defined in the substrate, each perforation for mounting an external terminal, each said lands being provided on a side of the substrate on which a semiconductor chip is mounted, wherein the wiring includes a first one of the lands and a plurality of electrode terminals provided for a wire, the electrode terminals of said wiring being spaced from one another and being electrically connected to one another, and wherein at least one of the plurality of electrode terminals of the wiring is provided in a space between the first land and a second one of the lands, said first and second lands being provided side by side in a direction extending from a mounting area of the semiconductor chip toward an edge of the substrate.

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