Method of making light emitting diode displays

• US 6,403,985 B1
• Filed: 12/23/1994
• Issued: 06/11/2002
• Est. Priority Date: 01/18/1991
• Status: Expired due to Term

• Current Assignee: Kopin Corporation
• Original Assignee: Kopin Corporation
• Inventors: Dingle, Brenda, Shastry, Shambhu, Spitzer, Mark B., McClelland, Robert W., Fan, John C. C.
• Primary Examiner(s): Jackson, Jr., Jerome
• Application Number:
  US08/363,150
• Time in Patent Office: 2,727 Days
• Field of Search: 257/88
• US Class Current: 257/88
• CPC Class Codes: G02B 2027/0132 comprising binocular systems
• CPC Class Codes: G02B 2027/0138 comprising image capture systems, e.g. camera
• CPC Class Codes: G02B 2027/0187 slaved to motion of at least a part of the body of the user, e.g. head, eye
• CPC Class Codes: G02B 2027/0198 System for aligning or maintaining alignment of an image in a predetermined direction
• CPC Class Codes: G02B 27/0093 with means for monitoring data relating to the user, e.g. head-tracking, eye-tracking
• CPC Class Codes: G02B 27/017 Head mounted
• CPC Class Codes: G02B 27/0172 characterised by optical features
• CPC Class Codes: G02B 5/30 Polarising elements light-modulating devices with active elements G02F1/00
• CPC Class Codes: G02F 1/13336 Combining plural substrates to produce large-area displays, e.g. tiled displays
• CPC Class Codes: G02F 1/13454 Drivers integrated on the active matrix substrate G02F1/136277 takes precedence
• CPC Class Codes: G02F 2202/105 single crystal Si
• CPC Class Codes: G09G 2300/023 Display panel composed of stacked panels
• CPC Class Codes: G09G 2370/042 for monitor identification
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: G09G 3/36 using liquid crystals
• CPC Class Codes: G09G 3/3607 for displaying colours or for displaying grey scales with a specific pixel layout, e.g. using sub-pixels display of colours in flat matrix panels other than liquid crystal displays G09G3/2003; grey scales specific for television H04N3/127
• CPC Class Codes: G09G 3/3648 using an active matrix G09G3/367 - G09G3/3696 take precedence
• CPC Class Codes: H01L 21/8221 Three dimensional integrated circuits stacked in different levels
• CPC Class Codes: H01L 21/84 the substrate being other than a semiconductor body, e.g. being an insulating body
• CPC Class Codes: H01L 2221/68359 used as a support during manufacture of interconnect decals or build up layers
• CPC Class Codes: H01L 2221/68363 : used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0756 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 : Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 27/0688 : Integrated circuits having a three-dimensional layout
• CPC Class Codes: H01L 27/1214 : comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
• CPC Class Codes: H01L 27/1266 : the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
• CPC Class Codes: H01L 27/156 : two-dimensional arrays
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01012 : Magnesium [Mg]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01072 : Hafnium [Hf]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/10336 : Aluminium gallium arsenide [AlGaAs]
• CPC Class Codes: H01L 2924/10349 : Aluminium gallium indium phosphide [AlGaInP]
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 33/0062 : for devices with an active region comprising only III-V compounds
• CPC Class Codes: H01L 33/10 : with a light reflecting structure, e.g. semiconductor Bragg reflector
• CPC Class Codes: H01L 33/405 : Reflective materials
• CPC Class Codes: H01L 33/465 : with a resonant cavity structure
• CPC Class Codes: H01S 5/0217 : Removal of the substrate
• CPC Class Codes: H01S 5/423 : having a vertical cavity
• CPC Class Codes: H04N 5/7441 : the modulator being an array of liquid crystal cells
• CPC Class Codes: H04N 5/7491 : of head mounted projectors
• CPC Class Codes: H04N 9/3141 : Constructional details thereof details not peculiar to the presence of an electronic spatial light modulator G03B21/14
• CPC Class Codes: H05B 33/12 : Light sources with substantially two-dimensional radiating surfaces
• CPC Class Codes: Y10S 438/928 : Front and rear surface processing
• CPC Class Codes: Y10S 438/977 : Thinning or removal of substrate

Abstract

Light emitting diodes (LEDs) and LED bars and LED arrays formed of semiconductive material, such as III-V, and particularly AlGaAs/CaAs material, are formed in very thin structures using organometallic vapor deposition (OMCVD). Semiconductor p-n junctions are formed as deposited using carbon as the p-type impurity dopant. Various lift-off methods are described which permit back side processing when the growth substrate is removed and also enable device registration for LED bars and arrays to be maintained.

Claims

1. A light emitting video display device comprising:

a plurality of light emitting pixel elements formed from a light emitting material, the pixel elements positioned to form an array of columns and rows of an integrated circuit video display device, each pixel element having an area of less than 30 μ

m²;

a column driver circuit formed from a semiconductor material and monolithically connected to the columns of pixel elements;

a row driver circuit formed from a semiconductor material and monolithically connected to the rows of pixel elements;

a common transparent substrate to which the array of pixel elements, the column driver circuit and the row driver circuit are bonded with a bonding layer; and

a display control circuit connected to the column driver circuit and the row driver circuit, the display control circuit selectively actuating the pixel elements to display video images.

2. The light emitting video display device of claim 1 further comprising a first plurality of pixel elements emitting at a first wavelength and a second plurality of pixel elements emitting at a second wavelength to provide a multicolor display.

3. The light emitting video display device of claim 1 further comprising a support that mounts the display device on a user'"'"'s head.

4. The light emitting video display device of claim 1 wherein the light emitting material comprises gallium arsenide.

5. The light emitting video display device of claim 1 wherein the row driver circuit an the column driver circuit are formed from a silicon structure.

6. The light emitting video display device of claim 1 wherein the control circuit comprises a microprocessor.

7. The light emitting video display device of claim 1 wherein there are more than about 1000 pixel elements.

8. The light emitting video display device of claim 1 wherein the column driver circuit and the row driver circuit are formed from a common layer of semiconductor material.

9. The light emitting video display device of claim 1 wherein the common substrate is a silicon substrate.

10. A light emitting display device comprising:

a plurality of light emitting pixel elements formed from a light emitting material, the pixel elements positioned to form an array of columns and rows of a display panel, each pixel element having an area of less than 30 μ

m²;

a column driver circuit formed from a layer of semiconductor material and connected to the columns of pixel elements;

a row driver circuit formed from the layer of semiconductor material and connected to the rows of pixel elements;

a common optically transparent substrate to which the array of pixel element, the column driver circuit and the row driver circuit are bonded with a bonding layer; and

a display control circuit connected to the column driver circuit and the row driver circuit, the display control circuit selectively actuating the pixel elements to display an image.

11. A light emitting display device comprising:

a plurality of light emitting diode (LED) pixel elements formed from a III-V material, the pixel elements positioned to form an array of columns and rows of a display panel, each pixel element having an area of less than 30 μ

m²;

a column driver circuit formed from a layer of silicon semiconductor material and connected to the columns of pixel elements;

a row driver circuit formed from the layer of silicon semiconductor material and connected to the rows of pixel elements;

an optically transparent substrate to which the array of pixel elements, the column driver circuit and the row driver circuit are mounted with an adhesive material; and

a display control circuit connected to the column driver circuit an the row driver circuit, the display control circuit selectively actuating the pixel elements to display an image.

12. The device of claim 11 wherein the substrate comprises glass.

13. The device of claim 11 wherein the device comprises a personal communications device.

14. The device of claim 11 wherein the device comprises a telephone.

15. The device of claim 11 wherein the column driver and the row driver are connected to a microprocessor circuit.

16. The device of claim 11 further comprising a display input circuit formed with the layer of semiconductor material.

17. The device of claim 11 further comprising a lens to magnify an image generated on the display.