Device having an improved connective structure between two electrodes
DC
First Claim
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1. A liquid crystal device comprising:
- a first substrate;
at least one first electrode formed over said first substrate;
a second substrate opposed to said first substrate with a liquid crystal material therebetween;
a circuit for supplying driving signals to said at least one first electrode, said circuit having at least one second electrode; and
an electrically conductive adhesive, through which said first and second electrodes are connected to each other, wherein said adhesive comprises an adhesive resin, resilient conductive particles and hard particles, and a weight proportion of said resilient conductive particles is larger than that of said hard particles.
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Abstract
A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.
69 Citations
25 Claims
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1. A liquid crystal device comprising:
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a first substrate;
at least one first electrode formed over said first substrate;
a second substrate opposed to said first substrate with a liquid crystal material therebetween;
a circuit for supplying driving signals to said at least one first electrode, said circuit having at least one second electrode; and
an electrically conductive adhesive, through which said first and second electrodes are connected to each other, wherein said adhesive comprises an adhesive resin, resilient conductive particles and hard particles, and a weight proportion of said resilient conductive particles is larger than that of said hard particles. - View Dependent Claims (2, 3, 4, 5)
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6. An electronic device comprising:
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a first substrate having at least one first electrode formed over said first substrate;
a circuit for supplying driving signals to said at least one first electrode, said circuit having at least one second electrode; and
,an electrically conductive adhesive, through which said first and second electrodes are connected to each other, wherein said conductive adhesive extends lengthwise beyond each end of the first and second electrodes, and wherein said conductive adhesive comprises resin, and resilient conductive particles, and said first electrode comprises a transparent conductive oxide. - View Dependent Claims (7, 8, 9, 10, 11)
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12. A liquid crystal device comprising:
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a substrate;
a plurality of first electrodes comprising a transparent conductive oxide formed over said substrate;
a member carrying second electrodes thereon, wherein said second electrodes are electrically connected to an integrated circuit chip; and
an electrically conductive adhesive between said first electrodes and said second electrodes, wherein said electrically conductive adhesive comprises an adhesive resin, resilient conductive particles and hard particles and said resilient conductive particles are contained in said adhesive resin at a higher weight proportion than said hard particles. - View Dependent Claims (13, 14, 15, 16)
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17. An electric device comprising:
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a plurality of first electrodes;
a plurality of second electrodes;
an adhesive resin provided between said first and second electrodes, said adhesive resin containing resilient conductive particles and hard particles wherein at least one of said first electrodes is electrically connected to at least one of said second electrodes through at least one of said resilient conductive particles, wherein said resilient conductive particles are contained in the adhesive resin at a higher weight proportion than said hard particles. - View Dependent Claims (18, 19, 20, 21)
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22. An electronic device comprising:
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a substrate;
at least one first electrode comprising transparent conductive oxide formed over said substrate;
a second electrode electrically connected to said first electrode with a resin interposed therebetween wherein said resin includes resilient conductive particles, wherein each of said conductive particles comprises a resilient particle coated with a metal film and each end of said first electrode and said second electrode is completely covered by said resin in a lengthwise direction. - View Dependent Claims (23, 24, 25)
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Specification
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Litigation Data
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Current AssigneeSemiconductor Energy Laboratory Co., Ltd.
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Original AssigneeSemiconductor Energy Laboratory Co., Ltd.
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InventorsMase, Akira
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Primary Examiner(s)Dudek, James A.
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Application NumberUS08/962,448Time in Patent Office1,684 DaysField of Search174/88.R, 252/514, 349/149, 349/155, 349/157, 349/123US Class Current349/149CPC Class CodesG02F 1/13452 Conductors connecting drive...G02F 2203/69 Arrangements or methods for...H01R 4/04 using electrically conducti...H05K 1/0306 Inorganic insulating substr...H05K 1/148 Arrangements of two or more...H05K 2201/0209 Inorganic, non-metallic par...H05K 2201/0212 Resin particlesH05K 2201/0221 Insulating particles having...H05K 2201/0233 Deformable particles insula...H05K 2201/0272 Mixed conductive particles,...H05K 2201/0326 Inorganic, non-metallic con...H05K 2201/2036 Permanent spacer or stand-o...H05K 3/323 by applying an anisotropic ...H05K 3/361 Assembling flexible printed...H05K 3/368 parallel to each other H05K...
