Thin film capacitors

• US 6,404,615 B1
• Filed: 02/16/2000
• Issued: 06/11/2002
• Est. Priority Date: 02/16/2000
• Status: Expired due to Fees

• Current Assignee: Intarsia Corp. (Dow, Inc.)
• Original Assignee: Intarsia Corp. (Dow, Inc.)
• Inventors: Sasagawa, Teruo, Wijeyesekera, Sunil D., Jing, Jing, Benson, Donald C.
• Primary Examiner(s): Dinkins, Anthony
• Application Number:
  US09/505,491
• Time in Patent Office: 846 Days
• Field of Search: 361/306.1, 361/306.2, 361/306.3, 361/307, 361/309, 361/310, 361/311-313, 361/303, 257/301, 257/305, 257/303, 257/306, 257/310, 257/532
• US Class Current: 361/306.1
• CPC Class Codes: H01L 27/0805 Capacitors only
• CPC Class Codes: H01L 28/40 Capacitors

Abstract

A thin film capacitor and methods for forming the same are described. The capacitor has dielectric layer with a first face, a second face, and at least one edge. The first terminal of the capacitor covers at least a portion of the first face of the dielectric layer, covers at least a portion of one edge of the dielectric layer, and covers a portion of the second face of the dielectric layer. The second terminal of the capacitor covers a portion of the second face of the dielectric layer and does not contact the first terminal. A method for forming the thin film capacitor includes hard baking photoresist at an elevated temperature and anodizing an exposed metal area using the photoresist as a mask.

Claims

1. A structure comprising:

(1) a dielectric layer having a first face, a second face, and at least one edge;

(2) a common interconnect for a first capacitor and a second capacitor, wherein the common interconnect covers at least a portion of the first face of the dielectric layer, covers at least one edge of the dielectric layer, and covers a portion of the second face of the dielectric layer;

(3) a terminal of the first capacitor, wherein the terminal of the first capacitor covers a first portion of the second face of the dielectric layer and does not contact the common interconnect;

(4) a terminal of the second capacitor, wherein the terminal of the second capacitor covers a second portion of the second face of the dielectric layer and does not contact the common interconnect and the terminal of the first capacitor.

2. The structure of claim 1, wherein the common interconnect is coupled to a substrate.

3. The structure of claim 1, wherein the common interconnect is comprised of a material that is anodizable and electrically conductive.

4. The structure of claim 1, wherein the dielectric layer is an anodization layer.

5. The structure of claim 1, wherein the dielectric layer is not an anodization layer.

6. A capacitor comprising:

(1) a dielectric layer having a first face, a second face, and at least one edge;

(2) a first terminal having a first conductive layer that covers at least a portion of the first face of the dielectric layer, and a second conductive layer that covers a portion of the second face of the dielectric layer and all edges of the dielectric layer;

(3) a second terminal that covers a portion of the second face of the dielectric layer and does not contact the first terminal.

7. The capacitor of claim 6, wherein the first terminal covers substantially all of the first face of the dielectric layer.

8. The capacitor of claim 6, wherein the second conductive layer covers the portion of the second face of the dielectric layer at the perimeter region of the second face of the dielectric layer.

9. The capacitor of claim 6, wherein the first and second conductive layers are made of a same material.

10. The capacitor of claim 6, wherein the first and second conductive layers are made of different materials.

11. The capacitor of claim 6, wherein the first terminal is coupled to a substrate.

12. The capacitor of claim 11, wherein the substrate is comprised of a material selected from a group consisting of a silicon, a ceramic, a glass, a plastic, and a semiconductor.

13. The capacitor of claim 11, wherein the substrate is a silicon wafer having an insulating layer in contact with the first terminal.

14. The capacitor of claim 13, wherein the insulating layer is an oxide of silicon.

15. The capacitor of claim 6, wherein the first terminal is comprised of a material that is anodizable and electrically conductive.

16. The capacitor of claim 15, wherein the first terminal is comprised of a material selected from a group consisting of aluminum, tantalum, and alloys thereof.

17. The capacitor of claim 6, wherein the dielectric layer is an anodization layer.

18. The capacitor of claim 17, wherein the dielectric layer is comprised of aluminum oxide.

19. The capacitor of claim 6, wherein the dielectric layer is comprised of tantalum oxide.

20. The capacitor of claim 6, wherein the dielectric layer is not an anodization layer.

21. The capacitor of claim 20, wherein the dielectric layer is comprised of silicon nitride.