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Integrated power electronics cooling housing

  • US 6,404,628 B1
  • Filed: 07/21/2000
  • Issued: 06/11/2002
  • Est. Priority Date: 07/21/2000
  • Status: Expired due to Term
First Claim
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1. A power electronics cooling housing comprising:

  • a body having a coolant cavity formed in one surface and having a capacitor bus assembly potting cavity formed in an opposite surface and a capacitor bus assembly potting located in the capacitor bus assembly potting cavity;

    a bus bar passthrough opening formed through the body and a bus bar located in the bus bar passthrough;

    a coolant inlet manifold having a coolant cavity inlet and a coolant outlet manifold having a coolant cavity outlet formed in the body that are coupled to respective ends of the coolant cavity; and

    an environmental sealing gasket surrounding the coolant cavity.

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