Article having an embedded electronic device, and method of making same

• US 6,404,643 B1
• Filed: 10/04/1999
• Issued: 06/11/2002
• Est. Priority Date: 10/15/1998
• Status: Expired due to Fees

• Current Assignee: Avante International Technology
• Original Assignee: Amerasia International Technology, Inc.
• Inventors: Chung, Kevin Kwong-Tai
• Primary Examiner(s): Gandhi, Jayprakash N.
• Assistant Examiner(s): DINH, TUAN T
• Application Number:
  US09/412,058
• Time in Patent Office: 981 Days
• Field of Search: 361/736, 361/737, 361/760-765, 361/777, 361/783, 361/784, 361/793, 257/679, 257/683, 174/52.2, 174/52.3, 156/224.12
• US Class Current: 361/737
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2309/12 Pressure
• CPC Class Codes: B32B 2425/00 Cards, e.g. identity cards, credit cards
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 3/08 characterised by added members at particular parts layer formed of separate pieces of material which are juxtaposed side-by-side B32B3/14, B32B3/18
• CPC Class Codes: B32B 33/00 Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
• CPC Class Codes: B32B 37/203 One or more of the layers being plastic
• CPC Class Codes: B32B 7/12 using interposed adhesives or interposed materials with bonding properties
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05664 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05669 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/16237 : the bump connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/45124 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 : Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 : TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06582 : Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 2225/06586 : Housing with external bump or bump-like connectors
• CPC Class Codes: H01L 23/055 : the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/4985 : Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01021 : Scandium [Sc]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/013 : Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15174 : in different layers of the multilayer substrate
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01Q 1/2225 : used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/36 : Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewithH01Q1/08, H01Q1/14 take precedence
• CPC Class Codes: H01Q 1/38 : formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 23/00 : Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 : Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 7/005 : with variable reactance for tuning the antenna
• CPC Class Codes: H05K 1/0393 : Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/113 : Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/165 : incorporating printed inductors
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/0394 : Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/1453 : Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/423 : characterised by electroplating method
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 : by metal fusion
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.
• CPC Class Codes: Y10T 29/49149 : by metal fusion bonding
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

A card has an electronic device, such as an integrated circuit, a conductive, resistive or capacitive network, or other electronic device, embedded therein. The card, sometimes referred to as a “smart card,” has the electronic device mounted to a substrate, generally by electrical connections formed of solder, electrically-conductive adhesive or flexible electrically-conductive adhesive. The substrate is covered by a layer of melt-flowable adhesive of thickness sufficient to cover the electronic device mounted thereon. The substrate is attached to a card blank to which it is bonded by melt flowing the melt-flowable adhesive. In one embodiment, the card blank has a cavity into which the electronic device and substrate are placed. In another embodiment, the substrate is of the same size and shape as is the card blank and the space therebetween is filled with melt flowable adhesive to bond them together and embed the electronic device therebetween. Further, the substrate may have a pattern of conductive adhesive deposited thereon, such as to form a loop antenna, which also serves to form electrical connections to the electronic device.

Claims

1. An article having an electronic device embedded therein comprising:

a substrate having first and second opposing substantially parallel broad planar surfaces and having at least two electrical contacts on the first broad planar surface thereof;

an electronic device mounted on the first broad planar surface of said substrate and having at least first and second electrical contacts connected respectively to the at least two electrical contacts of said substrate;

a layer of melt-flowable adhesive on the first broad planar surface of said substrate covering said electronic device, wherein said layer of melt-flowable adhesive is of substantially uniform thickness; and

a card blank having first and second opposing substantially parallel broad planar surfaces, wherein the first broad planar surface thereof is bonded to the first broad planar surface of said substrate by said layer of melt-flowable adhesive, wherein said electronic device is disposed between said substrate and said card blank and is encapsulated by said layer of melt-flowable adhesive.

2. The article of claim 1 wherein said substrate includes at least two electrical contacts on the second surface thereof, and wherein said two electrical contacts are electrically connected to said electronic device.

3. The article of claim 2 wherein said substrate includes at least two electrical contacts on the first surface thereof to which respective contacts of said electronic device are electrically connected, and wherein the two electrical contacts on the first surface of said substrate are electrically connected respectively to the two electrical contacts on the second surface thereof.

4. The article of claim 3 wherein the two electrical contacts on the second surface of said substrate are electrically connected to corresponding contacts on said electronic device by an interconnection selected from the group consisting of solder connections, conductive adhesive connections and flexible conductive adhesive connections.

5. The article of claim 1 wherein said substrate includes on the first surface thereof an elongated electrical conductor having first and second ends electrically connected to said electronic device.

6. The article of claim 5 wherein said elongated electrical conductor is formed by depositing a pattern of conductive adhesive on the first surface of said substrate.

7. The article of claim 6 wherein said deposited pattern includes at least one contact that provides a conductive adhesive connection to said electronic device.

8. The article of claim 6 wherein said deposited pattern includes a loop antenna.

9. The article of claim 1 wherein said card blank has a cavity therein for receiving said electronic device and at least part of said layer of melt-flowable adhesive that covers said electronic device.

10. The article of claim 1 further including a second substrate, wherein said layer of melt-flowable adhesive is applied to said second substrate, wherein said card blank has a cavity therein for receiving said electronic device, and wherein said electronic device is inserted into the cavity of said card blank and into said melt-flowable adhesive on said second substrate to be covered thereby.

11. The article of claim 1 wherein said substrate and said card blank have substantially the same size and shape, and wherein said layer of melt-flowable adhesive substantially fills a volume between said substrate and said card blank defined by the size and shape thereof.

12. The article of claim 1 wherein said card blank is bonded to said substrate by said electronic device being bonded to said substrate and said electronic device being bonded to said card blank by said layer of melt-flowable adhesive.

13. The article of claim 1 wherein said layer of melt-flowable adhesive is one of a laminated sheet and a deposited layer, wherein the deposited layer is deposited by one of roll coating, screen printing, stenciling, masking, and ink-jet printing.

14. The article of claim 1 wherein said melt-flowable adhesive has a bond strength greater than about 200 psi (14 kg/cm²) at temperatures less than about 45°

C.

15. The article of claim 1 wherein at least one of said substrate and said card blank is of a material selected from the group consisting of polyvinyl chloride, acrylonitrile-butadiene-styrene polymer, high-impact polystyrene, polyester, and polyimide.

16. The article of claim 1 wherein the adhesive of the layer of melt-flowable adhesive is utilized to attach said article to an object.

17. The article of claim 1 further comprising a layer of adhesive on the second surface of said substrate adapted for attaching said article to an object.

18. An article comprising:

a plastic blank having first and second opposing substantially parallel broad planar surfaces;

a substrate opposing said plastic blank, said substrate having first and second opposing substantially parallel broad planar surfaces and having at least two electrical contacts on the first broad planar surface thereof,

an electronic device attached to the first broad planar surface of said substrate and having at least two electrical contacts connected respectively to the at least two electrical contacts of said substrate, wherein said electronic device is attached to said substrate between said substrate and said plastic blank;

a layer of melt-flowable adhesive of substantially uniform thickness attaching the first broad planar surface of said plastic blank and the first broad planar surface of said substrate, and substantially filling the space therebetween to substantially encapsulate said electronic device.

19. The article of claim 18 wherein said plastic blank has a cavity into which said electronic device is positioned to contact said melt-flowable adhesive.

20. The article of claim 19 wherein said layer of melt flowable adhesive has a thickness sufficient to cover said electronic device.

21. The article of claim 18 wherein said layer of melt flowable adhesive has a thickness sufficient to cover said electronic device.

22. The article of claim 18 including a plurality of electrical contacts on an exposed surface of said substrate, wherein said plurality of electrical contacts are electrically connected to said electronic device.

23. The article of claim 18 including an electrically-conductive pattern on said substrate having at least one connection to said electronic device.

24. The article of claim 23 wherein said electrically-conductive pattern including said at least one connection is formed of an electrically conductive adhesive deposited on said substrate.

25. The article of claim 18 wherein said plastic blank has a cavity for receiving at least part of said electronic device.

26. A card comprising:

a card-sized substrate having first and second substantially parallel broad planar surfaces;

an elongated electrical conductor on the first broad planar surface of said substrate,

said elongated electrical conductor having first and second terminals and being formed of a pattern of electrically-conductive adhesive;

an electronic device having first and second contacts attached respectively to the electrically conductive adhesive of the first and second terminals of said elongated electrical conductor on the first broad planar surface of said card-sized substrate in flip chip manner;

a card-sized plastic blank opposing said card-sized substrate and having first and second substantially parallel broad surfaces disposed substantially parallel to the first and second broad surfaces of said substrate; and

a layer of melt-flowable adhesive between said cad-sized substrate and said card-sized plastic blank attaching said card-sized plastic blank and said substrate, and

said layer of melt-flowable adhesive substantially filling the space therebetween to encapsulate said electronic device.

27. The card of claim 26 wherein said melt-flowable adhesive includes one of:

a melt-flowable adhesive having a melt-flow temperature of less than 120°

C.,

a melt-flowable adhesive having a melt-flow temperature in the range of about 70-90°

C.,

a melt-flowable adhesive having a melt-flow temperature in the range of about 65-75°

C., and

a melt-flowable adhesive having a modulus of elasticity of about 10,000 psi.

28. A contact card comprising:

a card-sized substrate having first and second substantially parallel broad planar surfaces;

a card-sized plastic blank opposing said card-sized substrate and having first and second substantially parallel broad surfaces disposed substantially parallel to the first and second broad surfaces of said substrate,

said card-sized plastic blank having a cavity therein;

a layer of melt-flowable adhesive attaching the first broad planar surface of said card-sized substrate and the first broad planar surface of said card-sized plastic blank, and substantially filling the space therebetween;

an electronic substrate having opposing first and second broad planar surfaces and first and second terminals formed of a pattern of electrically-conductive adhesive on the first broad planar surface thereof and electrically connected to first and second metal contacts, respectively, on the second broad planar surface thereof,

wherein said electronic substrate is disposed in the cavity of said card-sized plastic blank with the respective second broad planar surfaces thereof being substantially co-planar;

an electronic device having first and second contacts attached respectively to the first and second terminals of said electronic substrate on the first broad planar surface thereof in flip chip manner,

wherein said electronic device is embedded in said layer of melt flowable adhesive for holding the second broad planar surface of said electronic substrate in the cavity substantially co-planar.

29. The contact card of claim 28 wherein said melt-flowable adhesive includes one of:

a melt-flowable adhesive having a melt-flow temperature of less than 120°

C.,

a melt-flowable adhesive having a melt-flow temperature in the range of about 70-90°

C.,

a melt-flowable adhesive having a melt-flow temperature in the range of about 65-75°

C., and

a melt-flowable adhesive having a modulus of elasticity of about 10,000 psi.

30. A card comprising:

a card-sized substrate having first and second substantially parallel broad planar surfaces and at least two electrical contacts on the first broad planar surface;

a card-sized plastic blank opposing said card-sized substrate and having first and second substantially parallel broad surfaces disposed substantially parallel to the first and second broad surfaces of said substrate,

a layer of melt-flowable adhesive attaching the first broad planar surface of said card-sized substrate and the first broad planar surface of said card-sized plastic blank and substantially filling the space therebetween; and

an electronic device having first and second contacts attached respectively to the at least two electrical contacts on the first broad planar surface of said card-sized substrate in flip chip manner,

wherein said electronic device is embedded in said layer of melt flowable adhesive substantially filling the space between said card-sized substrate and the card-sized plastic blank.

31. The card of claim 30 wherein said melt-flowable adhesive includes one of:

a melt-flowable adhesive having a melt-flow temperature of less than 120°

C.,

a melt-flowable adhesive having a melt-flow temperature in the range of about 70-90°

C.,

a melt-flowable adhesive having a melt-flow temperature in the range of about 65-75°

C., and

a melt-flowable adhesive having a modulus of elasticity of about 10,000 psi.

32. The card of claim 30 wherein said card-sized plastic blank has a cavity in the first broad planar surface thereof, and wherein said electronic device is disposed in the cavity of said card-sized plastic blank.

33. The card of claim 30 wherein said card-sized substrate includes on the first broad planar surface thereof an elongated electrical conductor electrically connected to said two electrical contacts.

34. The card of claim 33 wherein said elongated electrical conductor and/or said two electrical contacts are formed by depositing a pattern of conductive adhesive on the first surface of said card-sized substrate.

35. The card of claim 33 wherein said elongated electrical conductor defines a loop antenna.