Method for manufacturing build-up multi-layer printed circuit board by using yag laser

• US 6,405,431 B1
• Filed: 12/20/1999
• Issued: 06/18/2002
• Est. Priority Date: 06/27/1996
• Status: Expired due to Term

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Shin, Young Hwan, Sun, Byung Kook, Shin, Dong, Park, Keon Yang, Joung, Jae Heun
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US09/467,780
• Time in Patent Office: 911 Days
• Field of Search: 298/30, 298/46, 298/52, 427/96, 427/97, 427/98
• US Class Current: 29/852
• CPC Class Codes: H05K 2201/0358 Resin coated copper [RCC]
• CPC Class Codes: H05K 2201/09518 Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
• CPC Class Codes: H05K 3/0035 of blind holes, i.e. having a metal layer at the bottom
• CPC Class Codes: H05K 3/0038 combined with laser drilling through a metal layer
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

A method for manufacturing a build-up multi-layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi-layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and a high speed of signal process would be ensured. The method for manufacturing a build-up multi-layer printed circuit board includes the steps of: forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, the CCL having a copper foil on the one face thereof; stacking a resin-coated (on one face) copper foil (RCC) on the CCL with the first printed circuit pattern formed thereon, and heating and pressing this structure; irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC; carrying out an electroless and electro copper plating on the board with the via hole formed therein to form a plated layer; and forming a second printed circuit pattern on said plated layer to electrically connect the layers on which the first and second printed circuit patterns are formed.

Claims

1. A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, said CCL having a copper foil on the one face thereof;

stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern farmed thereon, and heating and pressing this structure;

irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC;

carrying out an electroless and electro copper plating on said board with via hole formed therein, to form a plated layer; and

forming a second printed circuit pattern on said plated layer so as to electrically connect said first and second printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μ

m, the thickness of said RCC is 40-100 μ

m, the process conditions of said YAG laser should satisfy the output power of preferably 300-2000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μ

m and the depth of 20-100 μ

m, and said electroplated layer is formed in thickness of 7-25 μ

m.

2. The method as defined in claim 1, wherein said resin comprises a semi-curing resin and a curing resin.

3. The method as defined in claim 1, wherein said resin has a transition temperature of 130°

C. or over.

4. A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process, said CCL having a copper foil on the one face thereof;

primarily stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon, and heating and pressing this structure;

forming a second printed circuit pattern on the board with said RCC primarily stacked thereon by applying the general photo-etching process;

secondarily stacking RCC on the board with said second printed circuit pattern formed thereon, and heating and pressing this structure;

irradiating a YAG laser to the board with said RCC stacked secondarily so as to form a via hole at a predetermined position by removing said RCC stacked primarily and secondarily;

carrying out an electroless and electro copper plating on the board with said via hole formed therein, to form a plated layer; and

forming a third printed circuit pattern on said plated layer so as to electrically connect the layers on which said first to third printed circuit patterns are formed, wherein the thickness of the copper foil constituting said CCL is 3-35 μ

m, the thickness of said RCC is at least 40-100 μ

m, the process conditions of said YAG laser should satisfy the output of preferably 300-5000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μ

m and the depth of 40-300 μ

m, and said electroplated layer is formed in thickness of 7-25 μ

m.

5. The method as defined in claim 4, wherein said printed circuit board further comprises a via hole for electrically connecting the layers with said first and third printed circuit patterns formed thereon.

6. The method as defined in claims 4 or 5, wherein said printed circuit board further comprises a via hole for electrically connecting the layers with said first and second printed circuit patterns formed thereon or said second and third printed circuit patterns formed thereon.

7. The method as defined in claim 4, wherein said resin comprises a semi-curing resin and a curing resin.

8. The method as defined in claim 7, wherein said resin has a transition temperature of 130°

C. or over.

9. A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process respectively, said CCL having copper foils on both faces thereof;

stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon respectively, and heating and pressing this structure;

irradiating a YAG laser to the board with said RCC stacked so as to form a via hole at a predetermined position by removing said RCC respectively;

carrying out an electroless and electro copper plain on the board with said via holes formed therein to form a plated layer;

forming a second printed circuit pattern on said plated layer so as to electrically connect the layers on which said first and second printed circuit patterns are formed; and

continuously stacking said RCC on the board formed according to said steps to form n printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μ

m, the thickness of said RCC is 40-100 μ

m, the process conditions of said YAG laser should satisfy the output power of preferably 300-2000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μ

m and the depth of 20-100 μ

m, and said electroplated layer is formed in thickness of 7-25 μ

m.

10. The method as defined in claim 9, wherein said resin comprises a semi-curing resin and a curing resin.

11. The method as defined in claim 9, wherein said resin has a transition temperature of 130°

C. or over.

12. A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process respectively, said CCL having a copper foil on both faces thereof;

primarily stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon respectively, and heating and pressing this structure;

forming a second printed circuit pattern on the board with said RCC primarily formed thereon by applying the general photo-etching process;

secondarily stacking RCC on said second printed circuit pattern formed thereon respectively, and heating and pressing this structure;

irradiating a YAG laser to the board so as to form a via hole at a predetermined position by removing said RCC stacked primarily and secondarily;

carrying out an electroless and electro copper plating on the board with said via holes formed therein to form a plated layer;

forming a third printed circuit pattern on said plated layer so as to electrically connect the layers on which said first to printed circuit patterns are formed; and

continuously stacking said RCC on the board formed according to said steps to form n printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μ

m, the thickness of said RCC is at least 40-100 μ

m, the process conditions of said YAG laser should satisfy the output of preferably 300-5000 mW and the wavelength of preferably 200-1,500 nm, said via hole is formed in the diameter of 25-200 μ

m and the depth of 40-300 μ

m, and said electroplated layer is formed in thickness of 7-25 μ

m.

13. The method as defined in claim 12, wherein said printed circuit board further comprises a via hole for electrically connecting the layers with said first and third printed circuit patterns formed thereon.

14. The method as defined in claims 12 or 13, wherein said printed circuit board further comprises a via hole for electrically connecting the adjacent layers with printed circuit patterns formed thereon.

15. The method as defined in claim 12, wherein said resin comprises a semi-curing resin and a curing resin.

16. The method as defined in claims 12 or 15, wherein said resin has a transition temperature of 130°

C. or over.

17. A method for manufacturing a build-up multi-layer printed circuit board, said method comprising the steps of:

forming a first printed circuit pattern on a copper clad laminate (CCL) by applying a general photo-etching process respectively, said CCL having a copper foil on both faces thereof;

primarily stacking a resin-coated (on one face) copper foil (RCC) on said CCL with said first printed circuit pattern formed thereon respectively, and heating and pressing this structure;

irradiating a YAG laser to the board with said RCC stacked so as to form a plated through hole(PTH) at a predetermined position by removing said RCC stacked and said CCL;

carrying out an electroless and electro copper plating on the board with said PTH formed therein to form a plated layer respectively;

forming a second printed circuit pattern on said plated layer to electrically connect the upper and lower portions of said second printed circuit pattern;

secondarily stacking RCC on said second printed circuit pattern formed thereon respectively, and heating and pressing this structure;

forming a third printed circuit pattern on the board with said RCC stacked secondarily thereon; and

continuously stacking said RCC on the board formed according to said steps to form n printed circuit patterns, wherein the thickness of the copper foil constituting said CCL is 3-35 μ

m, the thickness of said RCC is at least 40-100 μ

m, the process conditions of said YAG laser should satisfy the output of preferably 300-5000 mW and the wavelength of preferably 200-1,500 nm, said PTH is formed in the diameter of 25-200 μ

m and the depth of 400-800 μ

m, and said electroplated layer is formed in thickness of 7-25 μ

m.

18. The method as defined in claim 17, wherein said printed circuit board further comprises a via hole for electrically connecting the adjacent layers with printed circuit patterns formed thereon.

19. The method as defined in claims 17 or 18, wherein said printed circuit board further comprises a via hole for electrically connecting three printed circuit layers with printed circuit patterns formed thereon.

20. The method as defined in claim 17, wherein said resin comprises a semi-curing resin and a curing resin.

21. The method as defined in claim 17, wherein said resin of said RCC stacked on the top portion of said PTH comprises only a semi-curing resin.

22. The method as defined in claim 20, wherein said resin has a transition temperature of 130°

C. or over.