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Method of forming fine pitch interconnections employing magnetic masks

  • US 6,406,988 B1
  • Filed: 11/12/1998
  • Issued: 06/18/2002
  • Est. Priority Date: 04/24/1998
  • Status: Expired due to Fees
First Claim
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1. A method for forming a pattern of adhesive on a substrate comprising:

  • obtaining a substrate having a pattern of sites thereon on which adhesive is to be deposited;

    obtaining a magnetic mask having a pattern of apertures therethrough corresponding to the pattern of sites, wherein the magnetic mask includes a thin metal membrane and a layer of compressible material having a surface energy less than about 50 dyne/cm formed on at least one side of the thin metal membrane, one of the thin metal membrane and the compressible material having ferromagnetic properties, and wherein ones of the apertures in the layer of compressible material are substantially larger than corresponding ones of the apertures in the thin metal membrane;

    positioning the substrate and the magnetic mask proximate each other with the compressible layer against the substrate so that the pattern of sites and the pattern of apertures correspond;

    controllably energizing an electromagnet to generate a magnetic field to hold the substrate and the compressible layer of the magnetic mask in close contact;

    applying adhesive onto the pattern of sites of the substrate through the apertures of the magnetic mask;

    controllably de-energizing the electromagnet; and

    removing the magnetic mask to leave the adhesive on the pattern of sites on the substrate.

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