METHOD OF MOUNTING A SEMICONDUCTOR CHIP, CIRCUIT BOARD FOR FLIP-CHIP CONNECTION AND METHOD OF MANUFACTURING THE SAME, ELECTROMAGNETIC WAVE READABLE DATA CARRIER AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE FOR AN ELECTROMAGNETIC WAVE READABLE DATA CARRIER

• US 6,406,990 B1
• Filed: 11/21/2000
• Issued: 06/18/2002
• Est. Priority Date: 11/24/1999
• Status: Expired due to Term

• Current Assignee: Omron Corporation
• Original Assignee: Omron Corporation
• Inventors: Kawai, Wakahiro
• Primary Examiner(s): Nelms, David
• Assistant Examiner(s): Le, Thao P
• Application Number:
  US09/716,289
• Time in Patent Office: 574 Days
• Field of Search: 438/612, 438/613, 438/614, 438/615, 257/737, 257/778, 257/777
• US Class Current: 438/612
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 24/83 using a layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 1/09 : Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0129 : Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections
• CPC Class Codes: H05K 2203/0285 : Using ultrasound, e.g. for cleaning, soldering or wet treatment
• CPC Class Codes: H05K 2203/1189 : Pressing leads, bumps or a die through an insulating layer
• CPC Class Codes: H05K 3/061 : Etching masks
• CPC Class Codes: H05K 3/328 : by welding

Abstract

To provide a semiconductor chip mounting method by a flip-chip connection method in which a semiconductor chip can be mounted on a circuit board promptly, electrically and mechanically surely and further at a low cost, a process for pushing a melted thermoplastic resin coat aside by pressing a bump of the bare semiconductor chip on the melted thermoplastic resin coat applying an ultrasonic wave in a state in which the thermoplastic resin coat covering an electrode area on a wiring pattern is heated and melted and touching the bump and the electrode area, a process for bonding the bump and the electrode area by continuously applying an ultrasonic wave in a state in which the bump and the electrode area are touched and a process for cooling and solidifying the melted thermoplastic resin coat and bonding the body of the bare semiconductor chip on the circuit board are provided.

Claims

1. A method of mounting a semiconductor chip on a circuit board, said semiconductor chip having a terminal bump, said circuit board having a wiring pattern with an electrode area and a thermoplastic resin coat covering the electrode area of the wiring pattern, said method comprising the steps of:

heating and melting the thermoplastic resin coat of said circuit board;

pressing the terminal bump of said semiconductor chip on the thus melted thermoplastic resin coat while applying an ultrasonic wave to the terminal bump so that the terminal bump penetrates the melted thermoplastic resin coat and comes into contact with the electrode area;

bonding the terminal bump and the electrode area by continuously applying an ultrasonic wave to the terminal bump while in contact with the electrode area; and

cooling and solidifying the melted thermoplastic resin coat so as to securely mount said semiconductor chip on said circuit board.

2. The method of mounting the semiconductor chip on the circuit board according to claim 1, wherein said heating and melting step heats the thermoplastic resin coat at 150°

C.

3. The method of mounting the semiconductor chip on the circuit board according to claim 1, wherein said pressing step applies the ultrasonic wave of an ultrasonic vibration of a frequency of 63 kHz under pressure of a range of 0.1-0.3 kg/mm².

4. A method of manufacturing an electromagnetic wave readable data carrier having a body of a data carrier and an electronic component module, said body of the data carrier having an insulating base material and a conductive pattern held on the insulating base material, said electronic component module having a circuit board and a semiconductor chip with a terminal bump mounted on the circuit board, said circuit board having a wiring pattern with an electrode area and a thermoplastic resin coat covering the electrode area of the wiring pattern, said method comprising the steps of:

manufacturing the electronic component module by mounting the semiconductor chip on the wiring pattern, said electronic component module manufacturing step comprising the substeps of;

heating and melting the thermoplastic resin coat of said circuit board;

pressing the terminal bump of said semiconductor chip on the thus melted thermoplastic resin coat while applying an ultrasonic wave to the terminal bump so that the terminal bump penetrates the melted thermoplastic resin coat and comes into contact with the electrode area;

bonding the terminal bump and the electrode area by continuously applying an ultrasonic wave to the terminal bump while the terminal bump is in contact with the electrode area;

cooling and solidifying the melted thermoplastic resin coat so as to securely mount said semiconductor chip on said circuit board; and

integrating the electronic component module with the body of the data carrier.

5. The method of manufacturing the electromagnetic wave readable data carrier according to claim 4, wherein the insulating base material and the conductive pattern of said body of the data carrier are respectively a thin resin base material and a metal foil pattern, and the wiring pattern of said circuit board is an aluminum foil wiring pattern disposed on a thin resin base material.