Wafer scale image sensor package

• US 6,407,381 B1
• Filed: 07/05/2000
• Issued: 06/18/2002
• Est. Priority Date: 07/05/2000
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Glenn, Thomas P., Webster, Steven, Arellano, Tony
• Primary Examiner(s): Kim, Robert H.
• Assistant Examiner(s): Ho, Allen C.
• Application Number:
  US09/610,314
• Time in Patent Office: 713 Days
• Field of Search: 250/208.1, 250/214.1, 250/239, 257/433, 257/434
• US Class Current: 250/239
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 24/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

An image sensor package includes an image sensor having bond pads and an active area on an upper surface of the image sensor. The image sensor package further includes a window support on the upper surface of the image sensor. The window support entirely encloses the upper surface including the active area and the bond pads. A window is in contact with the window support, the window overlying the active area. Generally, the window support and the window entirely enclose, and thus protect, the active area of the image sensor.

Claims

1. A structure comprising:

an image sensor having a bond pad and an active area, said bond pad and said active area being on a first surface of said image sensor;

a window support on said first surface, said window support entirely enclosing said first surface including said active area and said bond pad; and

a window in contact with said window support, said window overlying said active area.

2. The structure of claim 1 wherein said active area is a receiver, transmitter, or transceiver of radiation, said window support being transparent to said radiation.

3. The structure of claim 2 wherein said window is transparent to said radiation.

4. The structure of claim 1 wherein said window support is an epoxy, which has been setup.

5. The structure of claim 1 wherein sides of said image sensor are coplanar with sides of said window support.

6. The structure of claim 1 wherein said window is parallel to said first surface of said image sensor.

7. The structure of claim 1 wherein a first surface of said window is secured to said window support and a second surface of said window is exposed to an ambient environment.

8. The structure of claim 1 wherein a refractive index of said window support is similar to a refractive index of said window.

9. The structure of claim 1 wherein said window support completely fills a region between said window and said active area.

10. The structure of claim 9 wherein said structure is an image sensor package, said image sensor package being a cavityless package.

11. The structure of claim 1 wherein said window comprises a side having a locking feature.

12. The structure of claim 1 wherein said image sensor is one of plurality of image sensors integrally connected together.

13. A structure comprising:

an image sensor substrate comprising a plurality of image sensors integrally connected together, said plurality of image sensors comprising a first image sensor having a first bond pad and an active area;

a window support layer on a first surface of said image sensor substrate, said window support layer covering said first bond pad and said active area; and

a first window in contact with said window support layer, said window support layer supporting said first window above said active area.

14. The structure of claim 13 wherein said plurality of image sensors comprises a second image sensor, a singulation street delineating said first image sensor from said second image sensor.

15. The structure of claim 14 wherein said second image sensor comprises a second bond pad, said first bond pad and said second bond pad being formed directly adjacent to said singulation street and opposite from one another relative to said singulation street.

16. The structure of claim 15 further comprising a window sheet comprising said first window and a second window, a cut in said window sheet delineating said first window from said second window.

17. The structure of claim 16 wherein said cut and said window support layer define a cavity above said singulation street, said first bond pad, and said second bond pad.

18. The structure of claim 16 wherein a first surface of said window sheet is in contact with said window support layer, said cut being in said first surface of said window sheet.