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System and method for automatic analysis of defect material on semiconductors

  • US 6,407,386 B1
  • Filed: 02/23/1999
  • Issued: 06/18/2002
  • Est. Priority Date: 02/23/1999
  • Status: Expired due to Term
First Claim
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1. A method for automatic material analysis of an object within a background, comprising the steps of:

  • automatically determining a desired location on the object for spectrum acquisition;

    acquiring an object spectrum in accordance with said determining;

    obtaining a background spectrum;

    obtaining count numbers from the object spectrum, corresponding to elements present in the object;

    obtaining count numbers from the background spectrum, corresponding to elements present in the background;

    analyzing the count numbers of the object spectrum to determine whether a count number appearing in the object spectrum is a non-present element in the object;

    analyzing the count numbers of the background spectrum to determine whether a count number appearing in the background spectrum is a non-present element in the background;

    standardizing the spectra count of the object according to the count of said non-present element to obtain a net object count; and

    analyzing the net object count to determine the material composition of the object.

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