Injection molded integrated circuit chip assembly

• US 6,407,461 B1
• Filed: 06/27/1997
• Issued: 06/18/2002
• Est. Priority Date: 06/27/1997
• Status: Expired due to Term

• Current Assignee: Ultratech Incorporated (Veeco Instruments Incorporated)
• Original Assignee: International Business Machines Corporation
• Inventors: Farquhar, Donald Seton, Papathomas, Konstantinos
• Primary Examiner(s): Williams, Alexander O.
• Application Number:
  US08/884,228
• Time in Patent Office: 1,817 Days
• Field of Search: 257/787, 257/737, 257/738, 257/734, 257/687, 257/693, 257/701, 257/777, 257/778, 257/779, 257/743, 257/790
• US Class Current: 257/787
• CPC Class Codes: B29C 45/34 having venting means
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73203 Bump and layer connectors
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/83102 using surface energy, e.g. capillary forces
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01057 Lanthanum [La]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/351 : Thermal stress
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: Y10T 29/49146 : with encapsulating, e.g., potting, etc.

Abstract

The electrical interconnections between an integrated circuit chip assembly are encapsulated and reinforced with a high viscosity encapsulant material in a single step molding process wherein a mold is placed over an integrated circuit chip assembly and encapsulant material is dispensed through an opening in the mold and forced around and under the integrated circuit chip by external pressure encapsulating the integrated circuit chip assembly. An integrated circuit chip assembly having a reinforced electrical connection which is more resistant to weakening as a result is stress created by differences in coefficient of thermal expansion between the integrated circuit chip and the substrate to which the integrated circuit chip is attached is produced.

Claims

1. An integrated circuit chip assembly, comprising;

an integrated circuit chip having a perimeter, an attachment surface and a remote surface;

a plurality of conductive contacts arranged on said attachment surface, each of said conductive contacts having a standoff connection attached thereto;

a substrate having a mounting surface and a remote surface;

a plurality of electrical contacts arranged on said surface, each of said electrical contacts attached to one of said standoff connections maintaining the attachment surface of said chip spaced from the mounting surface of said substrate;

a unitary single encapsulant completely encasing said integrated circuit chip, including the remote sure and the attachment surface, and covering a portion of said mounting surface beyond said perimeter, said unitary single encapsulant also disposed between and completely filling the space between said mounting surface and said attachment surface, completely encapsulating said stand off connections, said electrical contacts, and said conductive contacts, said encapsulant comprising a high strength thermosetting polymer having a viscosity in the range of 10 to 1,000 Pascal-seconds at dispense temperature.

2. The integrated circuit chip assembly of claim 1 wherein said encapsulant comprises a high strength thermosetting polymer having a viscosity in the range of 10 to 1,000 Pascal-seconds at dispense temperature.

3. The integrated circuit chip assembly of claim 1 wherein said standoff connections comprise solder balls.

4. The integrated circuit chip assembly of claim 3 wherein said substrate comprises a chip carrier.

5. The integrated circuit chip assembly of claim 3 wherein aid substrate comprises a circuit board.