Structure of printed circuit board with stacked daughter board
First Claim
1. A structure of a printed circuit board, the structure comprising:
- a motherboard having a first signal layer, a first ground layer, a first power layer, a second signal layer and isolation layers, wherein the first signal layer is a top surface and the second signal layer is a bottom surface of the motherboard and first contacts are formed on the top surface; and
a daughter board having a third signal layer, a second ground layer, a second power layer, a fourth signal layer and isolation layers, wherein a bottom surface of the daughter board having second contacts is selected from either the second ground layer or the second power layer, grooves are formed on a pair of opposite sides of the daughter board, an inner surface of each groove and a region around each groove are covered by a conductive layer, the daughter board is stacked on a region of the top surface of the motherboard and the grooves are coupled with the first contacts;
wherein the first contacts are coupled with the grooves by a conductive material; and
wherein the conductive material comprises a solder paste.
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Abstract
A structure of a printed circuit board with stacked daughter board. The structure has a motherboard and at least a daughter board. The motherboard has a first signal layer, a second signal layer, a first power layer, a first ground layer and isolation layers between every layer. The first signal layer and the second signal layer serve as surfaces of the motherboard and first contacts are formed on the first signal layer. The daughter board includes a third signal layer, a fourth signal layer, a second power layer, a second ground layer and isolation layers between every layer. The second power layer or the second ground layer serves as a surface of the daughter board and second contacts are formed on the surface. The daughter board is stacked on the motherboard and the second contacts are coupled with the first contacts.
130 Citations
19 Claims
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1. A structure of a printed circuit board, the structure comprising:
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a motherboard having a first signal layer, a first ground layer, a first power layer, a second signal layer and isolation layers, wherein the first signal layer is a top surface and the second signal layer is a bottom surface of the motherboard and first contacts are formed on the top surface; and
a daughter board having a third signal layer, a second ground layer, a second power layer, a fourth signal layer and isolation layers, wherein a bottom surface of the daughter board having second contacts is selected from either the second ground layer or the second power layer, grooves are formed on a pair of opposite sides of the daughter board, an inner surface of each groove and a region around each groove are covered by a conductive layer, the daughter board is stacked on a region of the top surface of the motherboard and the grooves are coupled with the first contacts;
wherein the first contacts are coupled with the grooves by a conductive material; and
wherein the conductive material comprises a solder paste. - View Dependent Claims (2, 3)
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4. A structure of a printed circuit board, the structure comprising:
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a motherboard having first signal layers, at least a first ground layer, at least a first power layer, and isolation layers, wherein one of the first signal layers serves as a top surface of the motherboard and first contacts are formed on the top surface; and
a daughter board having second signal layers, at least a second ground layer, at least a second power layer, and isolation layers, wherein a bottom surface of the daughter board having second contacts is selected from either the second ground layer or the second power layer, an inner surface of each groove and a region around each groove are covered by a conductive layer, the daughter board is stacked on a region of the top surface of the motherboard and the grooves are coupled with the first contacts;
wherein the first contacts are coupled with the grooves by a conductive material; and
wherein the conductive material comprises a solder paste. - View Dependent Claims (5, 6)
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7. In combination,
a motherboard, comprising: -
a first signal layer having at least one first signal trace thereon, said signal trace being adapted to transmit data signals to and from an associated electronic device, said signal layer forming a top surface of said motherboard;
first contacts formed on said signal layer;
a first ground layer coupled to said signal layer and serving as a ground potential; and
a first power layer coupled to said signal layer for providing power; and
a daughter board stacked over said motherboard, and comprising;
a second signal layer having at least one second signal trace thereon, said second signal trace being adapted to transmit data signals;
a further layer comprising either a second ground layer coupled to said second signal layer and serving as a ground potential, or a second power layer coupled to said second signal layer for providing power; and
second contacts formed on said further layer, said second contacts being coupled with said first contacts;
wherein said further layer forms a bottom surface of said daughter board; and
wherein said first signal layer is separated from said second signal layer by said further layer to prevent a crosstalk effect between said first signal layer and said second signal layer. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification