Wafer processing system

• US 6,410,455 B1
• Filed: 11/30/1999
• Issued: 06/25/2002
• Est. Priority Date: 11/30/1999
• Status: Expired due to Fees

• Current Assignee: WaferMasters, Inc.
• Original Assignee: Tokyo Electron Limited, WaferMasters, Inc.
• Inventors: Kuribayashi, Hiromitsu, Yoo, Woo Sik
• Primary Examiner(s): Ghyka, Alexander G.
• Application Number:
  US09/451,677
• Time in Patent Office: 938 Days
• Field of Search: 438/908, 438/758, 414/217, 118/729
• US Class Current: 438/758
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67748 horizontal transfer of a single workpiece
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67772 involving removal of lid, door, cover
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: Y10S 438/908 Utilizing cluster apparatus

Abstract

A wafer processing system occupies minimal floor space by using vertically mounted modules such as reactors, load locks, and cooling stations. Further saving in floor space is achieved by using a loading station which employs rotational motion to move a wafer carrier into a load lock. The wafer processing system includes a robot having extension, rotational, and vertical motion for accessing vertically mounted modules. The robot is internally cooled and has a heat resistant end-effector, making the robot compatible with high temperature semiconductor processing.

Claims

1. A wafer processing system comprising:

a loading station having a platform for rotating a wafer carrier from a first position to a second position, the loading station having an elevator for raising the wafer carrier into a load lock;

a first reactor; and

,

a robot having extension, rotational, and vertical motion, the robot being operable to move a wafer from the wafer carrier to the first reactor.

2. The system of claim 1 further comprising a cooling station for cooling the wafer, the cooling station being vertically mounted with respect to the load lock.

3. The system of claim 1 further comprising a second reactor which is vertically mounted with respect to the first reactor.

4. The system of claim 1 wherein the first reactor is a rapid thermal processing reactor.

5. The system of claim 1 wherein the wafer carrier is fixedly attached to the platform.

6. The system of claim 1 wherein the elevator includes a pneumatic cylinder.

7. A wafer processing system comprising:

a loading station having a platform for rotating a wafer carrier from a first position to a second position, the loading station having an elevator for raising the wafer carrier into a load lock;

means for moving a wafer carrier into said load lock; and

,

means for moving a wafer from the wafer carrier into a first reactor.

8. The system of claim 7 further comprising a means for cooling the wafer after the wafer is processed in the first reactor.

9. In a wafer processing system, a loading station comprising:

a platform for supporting a wafer carrier thereon;

a motor for rotating the platform from a first position to a second position; and

an elevator for raising the platform into a load lock,

wherein said wafer carrier can be enclosed within said load lock while the platform is in the load lock.

10. The loading station of claim 9 wherein the elevator includes a pneumatic cylinder.

11. The loading station of claim 9 wherein the wafer carrier is fixedly attached to the platform.