Reconfigurable systems using hybrid integrated circuits with optical ports

• US 6,410,941 B1
• Filed: 06/30/2000
• Issued: 06/25/2002
• Est. Priority Date: 06/30/2000
• Status: Expired due to Term

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Taylor, Michael G., Ooms, William J., Shanley, Charles W.
• Primary Examiner(s): Tran, Minh Loan
• Assistant Examiner(s): Dickey, Thomas L.
• Application Number:
  US09/608,931
• Time in Patent Office: 725 Days
• Field of Search: 257/79-82, 257/84-85, 257/94, 257/103, 257/441, 257/442, 257/444
• US Class Current: 257/84
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission

Abstract

A hybrid integrated circuit is provided that has a monocrystalline substrate such as silicon and a compound semiconductor layer such as gallium arsenide or indium phosphide. An optical communications port may be formed on the hybrid integrated circuit. Electrical equipment may be provided that includes electrical components. At least a given one of the components may be a hybrid integrated circuit. Data used for the operation of one of the given integrated circuit may be provided to the given integrated circuit through the optical communications port on that integrated circuit. The data may be loaded rapidly in real time due to the wide bandwidth of the optical communications port.

Claims

1. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data form the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry, wherein the first electrical component is a memory.

2. The equipment defined in claim 1 wherein the optical component on the second electrical component is an optical source.

3. The equipment defined in claim 1 wherein the optical component on the second electrical component is an optical detector.

4. The equipment defined in claim 1 wherein the first electrical component is based on a hybrid integrated circuit having a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer on the first electrical component is used to form an optical communications port on the first electrical component, and wherein the data from the first electrical component is loaded onto the hybrid integrated circuit of the second electrical component from the hybrid integrated circuit of the first electrical component using both the optical communications port on the first electrical component and the optical communications port on the second electrical component.

5. The equipment defined in claim 1 wherein the optical communications port of the second electrical component receives optical signals from the first electrical component over a free-space optical communications path.

6. The equipment defined in claim 1 further comprising an optical fiber path between the first electrical component and the optical communications port of the second electrical component.

7. The equipment defined in claim 1 further comprising:

a carrier on which the first and second electrical components are mounted; and

an optical waveguide path between the first and second electrical components.

8. The equipment defined in claim 1 wherein the compound semiconductor layer includes gallium arsenide and the monocrystalline semiconductor includes silicon.

30. The equipment defined in claim 1, wherein the monocrystalline semiconductor substrate is made of silicon having a (100) orientation.

32. The equipment defined in claim 1, wherein said optical communications port comprises a light emitting diode.

9. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data form the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the moncrystalline semiconductor substrate has a via hole under the optical component.

10. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein the optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data from the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the first and second components are vertically stacked.

11. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data from the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein multiple components including the first and second optical components are vertically stacked and wherein at least two of these components are configured to communicate optically using light that passes through an intermediate one of the multiple optical components.

12. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data from the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the second electronic component is a processor that receives new microcode through the optical communications port in real time.

13. Electrical equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data form the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the second electronic component is a programmable logic array.

14. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which the first electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data from the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the first electronic component is a memory and the second electronic component is a processor and wherein the compound semiconductor layer includes gallium arsenide and the monocrystalline semiconductor layer includes silicon.

15. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate from the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data form the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the first electrical component includes a hybrid integrated circuit and wherein the first and second electrical components are mounted in opposition to each other and are separated by solder bumps.

16. Electronic equipment comprising:

a first electrical component on which data is stored; and

a second electrical component including a hybrid integrated circuit that is separate form the first electrical component and that has a monocrystalline semiconductor substrate in which electrical circuitry is formed, an accommodating layer formed on the substrate, and at least one compound semiconductor layer on the accommodating layer, wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the data from the first electrical component is loaded onto the second electrical component using the optical communications port of the second electrical component and is used by the electrical circuitry wherein the first electrical component includes a hybrid integrated circuit and wherein the first and second electrical components are mounted in opposition to each other and are separated by solder bumps, such that an optical source on the first electrical component is optically aligned with an optical detector in the optical communications port on the second electrical component.

17. A hybrid integrated circuit that uses data to operate and that may be reconfigured by providing new data, comprising:

a monocrystalline semiconductor substrate in which electrical circuitry is formed;

an accommodating layer formed on the substrate; and

at least one compound semiconductor layer on the accommodating layer;

wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid integrated circuit, and wherein the optical communications port is used to load new data to reconfirm that hybrid integrated circuit and wherein the accommodating layer includes strontium titanate.

18. The hybrid integrated circuit defined in claim 17 wherein the optical port includes an optical source and an optical detector.

19. The hybrid integrated circuit defined in claim 17 further comprising:

at least a first optical source and optical detector and a second optical source and optical detector; and

at least two regions of circuitry, wherein one of the regions of circuitry is served by the first optical source and detector and the other region of circuitry is served by the second optical source and detector.

20. The hybrid integrated circuit defined in claim 17 wherein the optical component includes a gallium arsenide laser.

21. The hybrid integrated circuit defined in claim 17 wherein the optical communications port includes a semiconductor laser.

22. The hybrid integrated circuit defined in claim 17 wherein the optical communications port includes a vertical cavity semiconductor laser.

24. The hybrid integrated circuit defined in claim 17 wherein the optical communications port is configured for coupling to at least two optical fibers.

25. The hybrid integrated circuit defined in claim 17 wherein the optical communications port is configured for coupling to an optical fiber using a vertical coupling arrangement.

26. The hybrid integrated circuit defined in claim 17 wherein the optical communications port is configured for coupling to an optical fiber using a horizontal fiber coupling arrangement.

27. The hybrid integrated circuit defined in claim 17 further comprising at least one optical waveguide for carrying optical signals.

29. The hybrid integrated circuit defined in claim 17 wherein the optical communications port includes a silicon detector for detecting optical signals from an optical fiber.

31. The circuit defined in claim 17, wherein the monocrystalliine semiconductor substrate is made of silicon having a (100) orientation.

33. The circuit defined in claim 17, wherein said optical communications port comprises a light emitting diode.

23. A hybrid integrated circuit that uses data to operate and that may be reconfigured by providing new data, comprising:

a monocrystalline semiconductor substrate in which electrical circuitry is formed;

an accommodating layer formed on the substrate; and

at least one compound semiconductor layer on the accommodating layer;

wherein an optical component that is formed using the compound semiconductor layer is used to form an optical communications port on the hybrid circuit, and wherein the optical communications port is used to loan new data to reconfigure the hybrid integrated circuit and further wherein the optical communications port is configured for coupling to a single optical fiber that handles input and output optical signals.

28. A hybrid integrated circuit that uses data to operate and that may be reconfigured by providing new data, comprising:

a monocrystalline semiconductor substrate in which electrical circuitry is formed;

an accommodating layer formed on the substrate; and

at least one compound semiconductor layer on the accommodating layer;

wherein an optical component that is formed using the compound semiconductor layer is used to form and optical communications port on the hybrid integrated circuit, and wherein the optical communications port is used to loan new data to reconfigure the hybrid integrated circuit wherein said circuit further comprises at least one optical grating.