Heatpipesink having integrated heat pipe and heat sink

• US 6,410,982 B1
• Filed: 11/12/1999
• Issued: 06/25/2002
• Est. Priority Date: 11/12/1999
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Brownell, Michael Philip, Maveety, James G.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Doan, Theresa T.
• Application Number:
  US09/432,578
• Publication Number:
  US 20020056908A1
• Time in Patent Office: 956 Days
• Field of Search: 257/712, 257/713, 257/714, 257/715, 257/717, 257/718, 257/719, 257/722, 257/675, 257/706, 257/687, 361/695, 361/697, 361/701, 361/702, 361/703, 361/689, 361/698, 361/699
• US Class Current: 257/714
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/046 characterised by the material or the construction of the capillary structure
• CPC Class Codes: F28F 2215/06 Hollow fins; fins with internal circuits
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0209 External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings

Abstract

Embodiments of the present invention can dissipate heat and include a top wall including a plurality of hollow fins, a bottom wall, and a plurality of side walls that define an inner cavity. A plurality of condenser regions can be located within the inner cavity, and each one of the plurality of condenser regions can be located within one of the plurality of hollow fins. The inner cavity also can include an evaporator region adjacent said bottom wall.

Claims

1. A circuit board assembly, comprising:

a circuit board; and

a semiconductor package coupled to said circuit board, said semiconductor package including an integrated circuit device, a substrate, and a package cover, said package cover including

a top wall including a plurality of hollow fins,

a bottom wall, said integrated circuit device thermally coupled to said bottom wall,

a plurality of side walls, and

a plurality of channels,

said top wall, including said plurality of hollow fins, and said bottom wall being attached to said plurality of side walls to define an inner cavity,

said inner cavity including

a plurality of condenser regions, each one of said plurality of condenser regions located within one of said plurality of hollow fins, and

an evaporator region adjacent said bottom wall,

said plurality of channels attached to and extending from the interior surface of said inner cavity within said condenser and evaporator regions,

wherein said bottom wall and said substrate are attached to said plurality of side walls to enclose said integrated circuit device.

2. The circuit board assembly of claims 1, further comprising a two-phase fluid disposed within said inner cavity.

3. The circuit board assembly of claim 1, further comprising a wick disposed within said inner cavity.

4. The circuit board assembly of claim 1, further comprising a plenum cover attached to said package cover.

5. The circuit board assembly of claim 4, wherein said plenum cover includes an aperture in a wall of said plenum cover, said plenum cover and said package cover define a plenum chamber, and said plenum chamber includes a plenum working fluid received through said aperture.