Power inverter with heat dissipating assembly
First Claim
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1. A power inverter having a heat dissipating assembly, comprising:
- a housing having a top wall and two opposing side walls;
a printed circuit board assembly supported within said housing, said printed circuit board assembly comprising a printed circuit board equipped with power inverting components; and
a heat sink plate supported on said printed circuit board and adapted to absorb heat therefrom wherein a space exists between the heat sink plate and the housing such that the heat sink plate does not contact the housing, wherein said printed circuit board assembly includes a plurality of mosfets connected to said printed circuit board and extending therefrom, said plurality of mosfets being connected to circuitry of the power inverting components, said heat sink plate abuts against a first side of each of said plurality of mosfets to absorb heat directly therefrom, and said heat sink being connected to said mosfets such that a space that exists between the heat sink plate and the printed circuit board, and wherein said heat sink plate is secured to said first side of the mosfets by a support bar abutting against an opposing side of each of said plurality of mosfets by screws passing through the support bar and the heat sink plate.
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Abstract
The invention is a power inverter having a heat dissipating assembly. A heat sink plate is supported on the printed circuit board in a spaced configuration so that a space exists between the heat sink plate and the outer housing. The printed circuit board assembly includes mosfets inserted into the printed circuit board and electrically connected thereto. The heat sink plate abuts against a first side of the mosfets at an upper end of the mosfets to directly absorb heat from the mosfets. The exterior surface of the housing is provided with a plurality of heat dissipating fins to further enable heat dissipation.
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Citations
13 Claims
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1. A power inverter having a heat dissipating assembly, comprising:
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a housing having a top wall and two opposing side walls;
a printed circuit board assembly supported within said housing, said printed circuit board assembly comprising a printed circuit board equipped with power inverting components; and
a heat sink plate supported on said printed circuit board and adapted to absorb heat therefrom wherein a space exists between the heat sink plate and the housing such that the heat sink plate does not contact the housing, wherein said printed circuit board assembly includes a plurality of mosfets connected to said printed circuit board and extending therefrom, said plurality of mosfets being connected to circuitry of the power inverting components, said heat sink plate abuts against a first side of each of said plurality of mosfets to absorb heat directly therefrom, and said heat sink being connected to said mosfets such that a space that exists between the heat sink plate and the printed circuit board, and wherein said heat sink plate is secured to said first side of the mosfets by a support bar abutting against an opposing side of each of said plurality of mosfets by screws passing through the support bar and the heat sink plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A power inverter having a heat dissipating assembly, comprising:
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a housing having a top wall and two opposing side walls;
a printed circuit board assembly supported within said housing, said printed circuit board assembly comprising a printed circuit board equipped with power inverting components, said power inverter components including a plurality of mosfets extending upward from said printed circuit board; and
a heat sink plate connected directly to mosfets for absorbing heat generated there from, said heat sink plate being arranged within said housing such that a space exists between the heat sink plate and the housing without contacting the housing, wherein said heat sink plate is spaced apart from said printed circuit board, and wherein said heat sink plate is secured to a first side of the mosfets by a support bar abutting against an opposing side of each of said plurality of mosfets by screws passing through the support bar and the heat sink plate. - View Dependent Claims (12, 13)
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Specification