Power inverter with heat dissipating assembly

• US 6,411,514 B1
• Filed: 03/08/2001
• Issued: 06/25/2002
• Est. Priority Date: 03/08/2001
• Status: Expired due to Fees

• Current Assignee: Rally Manufacturing Incorporated
• Original Assignee: Rally Manufacturing Incorporated
• Inventors: Hussaini, Saied
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US09/800,492
• Time in Patent Office: 474 Days
• Field of Search: 361/690, 361/695, 361/694, 361/704, 361/707, 361/709, 361/710, 361/719, 361/720, 165/80.1, 165/80.3, 165/104.33, 165/185, 174/16.1, 174/16.3
• US Class Current: 361/704
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

The invention is a power inverter having a heat dissipating assembly. A heat sink plate is supported on the printed circuit board in a spaced configuration so that a space exists between the heat sink plate and the outer housing. The printed circuit board assembly includes mosfets inserted into the printed circuit board and electrically connected thereto. The heat sink plate abuts against a first side of the mosfets at an upper end of the mosfets to directly absorb heat from the mosfets. The exterior surface of the housing is provided with a plurality of heat dissipating fins to further enable heat dissipation.

Claims

1. A power inverter having a heat dissipating assembly, comprising:

a housing having a top wall and two opposing side walls;

a printed circuit board assembly supported within said housing, said printed circuit board assembly comprising a printed circuit board equipped with power inverting components; and

a heat sink plate supported on said printed circuit board and adapted to absorb heat therefrom wherein a space exists between the heat sink plate and the housing such that the heat sink plate does not contact the housing,

wherein said printed circuit board assembly includes a plurality of mosfets connected to said printed circuit board and extending therefrom, said plurality of mosfets being connected to circuitry of the power inverting components, said heat sink plate abuts against a first side of each of said plurality of mosfets to absorb heat directly therefrom, and said heat sink being connected to said mosfets such that a space that exists between the heat sink plate and the printed circuit board, and

wherein said heat sink plate is secured to said first side of the mosfets by a support bar abutting against an opposing side of each of said plurality of mosfets by screws passing through the support bar and the heat sink plate.

2. The power inverter according to claim 1, wherein said heat sink plate is L-shaped and a side wall of the heat sink plate is mounted perpendicularly to the printed circuit board and a top wall of the heat sink plate extends above the printed circuit board assembly parallel to the printed circuit board, and wherein an interior top surface of the top wall of the housing is substantially parallel to the top wall of the heat sink plate and a ventilation space exists between the entire top wall of the heat sink plate and the interior top surface of the housing to allow heat from the heat sink plate to dissipate to air in the ventilation space before dissipating to the housing.

3. The power inverter according to claim 2, further comprising a ventilation space between the side wall of the heat sink plate and an interior surface of the side wall of the housing adjacent thereto.

4. The power inverter according to claim 3, further comprising a front end plate and a rear end plate secured to said housing in a manner so as to enclose said printed circuit board assembly and said heat sink plate, wherein at least one of said front end plate and said rear end plate having a plurality of ventilation holes through which air can pass to and from the interior of the housing.

5. The power inverter according to claim 4, further comprising an intake fan mounted to one of said front end plate and said rear end plate to intake cooling air and circulate air within the housing to increase heat dissipation from the heat sink plate to the air and then to the housing.

6. The power inverter according to claim 3, wherein said side wall of said heat sink plate comprises heat dissipating fins extending out from the side wall of the heat sink plate toward the interior surface of the side wall of the housing within said ventilation space existing therebetween.

7. The power inverter according to claim 4, further comprising one of said front end plate and said rear end plate provided with electrical outlets, and on/off switch, and a fuse.

8. The power inverter according to claim 1, further comprising a front end plate and a rear end plate secured to said housing in a manner so as to enclose said printed circuit board assembly and said heat sink plate, wherein at least one of said front end plate and said rear end plate having a plurality of ventilation holes through which air can pass to and from the interior of the housing.

9. The power inverter according to claim 1, wherein an exterior surface of said housing is provided with a plurality of heat dissipating fins.

10. The power inverter according to claim 4, further comprising a base plate mounted to bottom edges of the two opposing side walls of said housing in a manner so as to enclose said printed circuit board assembly and. said heat sink plate within said housing, said front end plate, and said rear end plate.

11. A power inverter having a heat dissipating assembly, comprising:

a housing having a top wall and two opposing side walls;

a printed circuit board assembly supported within said housing, said printed circuit board assembly comprising a printed circuit board equipped with power inverting components, said power inverter components including a plurality of mosfets extending upward from said printed circuit board; and

a heat sink plate connected directly to mosfets for absorbing heat generated there from, said heat sink plate being arranged within said housing such that a space exists between the heat sink plate and the housing without contacting the housing,

wherein said heat sink plate is spaced apart from said printed circuit board, and

wherein said heat sink plate is secured to a first side of the mosfets by a support bar abutting against an opposing side of each of said plurality of mosfets by screws passing through the support bar and the heat sink plate.

12. The power inverter according to claim 11, wherein said heat sink plate is L-shaped and a side wall of the heat sink plate is mounted perpendicularly to the printed circuit board and a top wall of the heat sink plate extends above the printed circuit board assembly parallel to the printed circuit board, and wherein an interior top surface of the top wall of the housing is substantially parallel to the top wall of the heat sink plate and a ventilation space exists between the entire top wall of the heat sink plate and the interior top surface of the housing to allow heat from the heat sink plate to dissipate to air in the ventilation space before dissipating to the housing.

13. The power inverter according to claim 12, further comprising a ventilation space between the side wall of the heat sink plate and an interior surface of the side wall of the housing adjacent thereto.