Optical waveguide element and method for manufacturing optical waveguide element

• US 6,411,765 B1
• Filed: 03/23/2000
• Issued: 06/25/2002
• Est. Priority Date: 05/11/1999
• Status: Expired due to Term

• Current Assignee: NeoPhotonics Corporation (Lumentum Holdings Inc.)
• Original Assignee: OKI Electric Industry Company Limited
• Inventors: Ono, Hideki
• Primary Examiner(s): Healy, Brian
• Application Number:
  US09/533,737
• Time in Patent Office: 824 Days
• Field of Search: 385/14, 385/129, 385/130, 385/131, 385/132, 385/141, 385/39, 653/85, 653/86
• US Class Current: 385/131
• CPC Class Codes: G02B 2006/12147 Coupler
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/125 Bends, branchings or intersections

Abstract

According to the present invention, which provides a optical waveguide element achieving high performance and high yield, that makes it possible to form a complex light-wave circuit structure without requiring a larger mounting area and a optical waveguide element manufacturing method, a optical waveguide element 100 is provided with an Si substrate 102 and a first light-wave circuit layer 112 and a second light-wave circuit layer 120 sequentially laminated on the substrate 102. At the first light-wave circuit layer 112, a first optical waveguide structure constituted of a first clad layer 104 formed toward the substrate 102, a first core portion 108 and a second clad layer 110 formed toward the second light-wave circuit layer 120 is achieved. In addition, at the second light-wave circuit layer 120, a second optical waveguide structure constituted of a second core portion 116 and a third clad layer 118 at the second light-wave circuit layer 120 is achieved. Since the first light-wave circuit layer 112 and the second light-wave circuit layer 120 are directly laminated, a directional optical coupling is induced between the first core portion 108 and the second core portion 116.

Claims

1. A optical waveguide element, having n substantively planar light-wave circuit layers, each constituted of a core portion for receiving and guiding a light signal and a clad layer covering said core portion, that are sequentially laminated to achieve a multilayer structure (n represents an integer equal to or larger than 2);

and wherein at least a linear portions of a specific length of the core portions in at least two contiguous light wave circuit layers are aligned parallel to one another in a common plane extending substantially perpendicular to the planes of the light-wave circuit layers to produce optical coupling between the respective linear potions of the aligned core portions.

2. An optical waveguide element according to claim 1, wherein:

said core portion is formed as a channel.

3. An optical waveguide element according to claim 1, wherein:

at least either said core portion or said clad layer has SiO2 as a main constituent thereof.

4. An optical waveguide element according to claim 1, having a substrate constituted of Si to support said n light-wave circuit layers.

7. An optical waveguide element according to claim 1, wherein only a portion of each of said core portions is aligned in said common plane.

8. An optical waveguide element according to claim 7, wherein linear core portions of three contiguous light-ware circuit layers are aligned in said common plane with each core portion receiving a respective input signal.

9. An optical waveguide element according to claim 8, wherein the thickness of the respective layers is such that coupling exists only between each of the linear core portions of the outermost two layers and the central layer of the three contiguous layers.

10. An optical waveguide element according to claim 9, wherein:

one end of each of the core portions of the outermost two layers exits the element at a respective edge surface of the element to receive a respective input signal and the core portion of the central layer is terminated wholly within the central layer, whereby the aligned linear core portions of the two outermost layers are coupled to each other via the aligned linear core portion of the central layer.

11. An optical wave guide element according to claim 7, wherein one end of each of the core portions of the two contiguous light-wave circuit layers extends to a respective end surface of the element to receive a respective different input light signal at the end surface.

12. An optical wave guide element according to claim 1, wherein one end of each of the core portions of the two contiguous light-wave circuit layers extends to a respective end surface of the element to receive a respective different input light signal at the end surface.

5. A optical waveguide element manufacturing method comprising:

a first step in which a first clad layer is formed;

a second step in which a kth core portion is formed on a kth clad layer (k is an integer equal to or larger than 1 and equal to or smaller than n, which is an integer equal to or larger than

     2);

a third step in which a (k+1)th clad layer is formed to cover said kth core portion; and

a fourth step in which said second step and said third step are repeated alternately n times; and

, wherein;

said third step comprises

a process in which a source material layer to constitute said kth core portion is formed on said kth clad layer, and

a process in which said kth core portion is formed by removing any unnecessary portions of said source layer through reactive ion etching.

6. A optical waveguide element manufacturing method, comprising:

a first step in which a first clad layer is formed;

a second step in which a kth core portion is formed on a kth clad layer (k is an integer equal to or larger than 1 and equal to or smaller than n which is an integer equal to or larger than

     2);

a third step in which a (k+1)th clad layer is formed to cover said kth core portion; and

a fourth step in which said second step and said third step are repeated alternately n times; and

, wherein;

said third step comprises

process in which a source material layer to constitute said kth core portion is formed on said kth clad layer, and

a process in which said kth core portion is formed by removing any unnecessary portions of said source layer through reactive ion etching; and

said kth clad layer is formed through chemical vapor deposition.