Layered arrangements of lithium electrodes
First Claim
1. A method of fabricating an active metal electrode, the method comprising:
- (a) providing a barrier layer laminate comprising (i) a barrier layer disposed on a substrate, the barrier layer forming a substantially impervious layer which is conductive to ions of the active metal, and (ii) a foil bonding layer disposed on the barrier layer, the foil bonding layer capable of forming a bond with the active metal; and
(b) bonding active metal to the foil bonding layer.
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Accused Products
Abstract
A method employing a bonding layer is used to form active metal electrodes having barrier layers. Active metals such as lithium are highly reactive in ambient conditions. The method involves fabricating a lithium electrode or other active metal electrode without depositing the barrier layer on a layer of metal. Rather a smooth barrier layer is formed on a smooth substrate such as a web carrier or polymeric electrolyte. A bonding or alloying layer is formed on top of the barrier layer. Lithium or other active material is then attached to the bonding layer to form the active metal electrode. A current collector may also be attached to the lithium or active metal during the process.
311 Citations
59 Claims
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1. A method of fabricating an active metal electrode, the method comprising:
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(a) providing a barrier layer laminate comprising (i) a barrier layer disposed on a substrate, the barrier layer forming a substantially impervious layer which is conductive to ions of the active metal, and (ii) a foil bonding layer disposed on the barrier layer, the foil bonding layer capable of forming a bond with the active metal; and
(b) bonding active metal to the foil bonding layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
wherein the barrier layer laminate further comprises an active metal layer that is disposed on a side of the foil bonding layer that is opposite the barrier layer, and wherein bonding the active metal to the foil bonding layer comprises bonding the active metal to the active metal layer of the barrier layer laminate.
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28. A method of fabricating an active metal electrode, the method comprising:
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(a) providing a barrier layer laminate comprising a barrier layer disposed on a substrate, the barrier layer forming a substantially impervious layer which is conductive to ions of active metal;
(b) attaching a foil bonding layer to the barrier layer of the barrier layer laminate, wherein the foil bonding layer comprises a material capable of forming a bond with active metal; and
(c) bonding active metal to the foil bonding layer.
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29. A barrier layer laminate for use in fabricating an active metal electrode, the barrier layer laminate comprising:
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(i) a substantially smooth and flat substrate;
(ii) a barrier layer disposed on the substrate, the barrier layer forming a substantially impervious layer which is conductive to ions of the active metal, and (iii) a foil bonding layer disposed on the barrier layer, wherein the foil bonding layer comprises a material capable of forming a bond with the active metal. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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45. An active metal electrode capable of serving as a negative electrode in a battery, the active metal electrode comprising:
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(i) a barrier layer forming a substantially impervious layer which is conductive to ions of the active metal;
(ii) a first active metal layer having a first side disposed on to the barrier layer;
(iii) a bonding layer disposed on a second side, opposite the first side, of the active metal layer, the bonding layer material being capable of forming a bond with the active metal; and
(iv) a second active metal layer disposed on the bonding layer, wherein the bonding layer is sandwiched between the first and second active metal layers. - View Dependent Claims (46, 47)
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48. A method of fabricating an active metal electrode, the method comprising:
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(a) providing a barrier layer laminate comprising a barrier layer disposed on a substrate, the barrier layer forming a substantially impervious layer which is conductive to ions of the active metal;
(b) providing an active metal laminate comprising at least one active metal layer and a bonding layer affixed to one another, wherein the bonding layer is capable of forming a bond with the active metal; and
(c) bonding at least the active metal laminate and the barrier layer laminate to form an electrode structure in which (i) the bonding layer is sandwiched between two separate active metal layers, at least one of which was provided in the active metal laminate, and (ii) one of the two separate active metal layers is affixed to the barrier layer provided in the barrier layer laminate. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56)
wherein the active metal laminate consists essentially of the bonding layer and a single active metal layer, and wherein bonding at least the active metal laminate and the barrier layer laminate comprises (a) bonding a second active metal layer to the bonding layer of the active metal laminate and (b) bonding the barrier layer of the barrier layer laminate to the single active metal layer of the active metal laminate. -
51. The method of claim 48, wherein the barrier layer laminate further comprises a second active metal layer disposed on a side of the barrier layer opposite the substrate.
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52. The method of claim 51,
wherein the active metal laminate comprises the bonding layer and a single active metal layer, and wherein bonding at least the active metal laminate and the barrier layer laminate comprises bonding the second active metal layer to the bonding layer of the active metal laminate. -
53. The method of claim 52, wherein the active metal laminate further comprises a current collector affixed to a side of the single active metal layer that is opposite the bonding layer.
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54. The method of claim 48,wherein the barrier layer laminate further comprises (a) a second active metal layer disposed on a side of the barrier layer opposite the substrate and (b) a second bonding layer disposed on a side of the second active metal layer opposite the barrier layer.
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55. The method of claim 54,
wherein the active metal laminate comprises the bonding layer and a single active metal layer, and wherein bonding at least the active metal laminate and the barrier layer laminate comprises bonding the second bonding layer of the barrier layer laminate to the bonding layer of the active metal laminate. -
56. The method of claim 55, wherein the active metal laminate further comprises a current collector affixed to a side of the single active metal layer that is opposite the bonding layer.
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57. A method of fabricating an active metal electrode including a barrier layer forming a substantially impervious layer which is conductive to ions of the active metal, the method comprising:
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(a) forming the barrier layer on a metal bonding layer to create a barrier layer laminate, the bonding layer being capable of forming a bond with the active metal; and
(b) bonding the barrier layer laminate to a layer of active metal by affixing the active metal layer to the bonding layer of the barrier layer laminate. - View Dependent Claims (58, 59)
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Specification