Process for manufacturing a micro-electrode

• US 6,413,440 B1
• Filed: 07/13/1999
• Issued: 07/02/2002
• Est. Priority Date: 07/14/1998
• Status: Expired due to Fees

• Current Assignee: Micronas Gmbh (TDK Corporation)
• Original Assignee: Micronas Gmbh (TDK Corporation)
• Inventors: Igel, Günter
• Primary Examiner(s): GOUDREAU, GEORGE A
• Application Number:
  US09/351,394
• Time in Patent Office: 1,085 Days
• Field of Search: 204/157.15, 204/471, 204/478, 204/479, 205/123, 205/157, 205/91, 205/92, 205/131, 216/99
• US Class Current: 216/99
• CPC Class Codes: G01N 27/30 Electrodes, e.g. test electrodes; Half-cells G01N27/414 takes precedence

Abstract

In a process for manufacturing an electrode (1) on a substrate (2) using a conventional structuring process, an electrically conducting surface structure is created which has at least one tip (3) or edge (4). In the area of the tip (3) or edge (4), an electrode layer (5) is galvanized onto the substrate (2) and/or applied by electrostatic powder coating. Then, a surface area of the substrate (2), which surrounds the electrode layer (5) located on the tip (3) or edge (4), is converted into an insulating layer (8) by a chemical reaction. The electrode layer (5) can also be applied in a manner where, in the area of the tip (3) or edge (4), a chemical is released, which upon irradiation by electromagnetic and/or particle radiation, precipitates an electrically conducting material. This chemical is then impinged in the area of the tip (3) or edge (4) with optical radiation.

Claims

1. A process for manufacturing an electrode (1) comprising creating a surface structure having at least one tip (3) or edge (4) on a substrate (2), forming a supply channel (9) in the substrate (2), such that the supply channel opens in close proximity to the tip (3) or edge (4) on a surface of the substrate, supplying a chemical through the supply channel (9), such that the chemical emerges at the tip (3) or edge (4), the chemical being one which upon irradiation with electromagnetic and/or particle radiation precipitates out an electrically conducting material, and irradiating the chemical in an area of the tip (3) or edge (4) with electromagnetic and/or particle radiation to precipitate out the electrically conducting material at the tip (3) or edge (4).

2. The process according to claim 1, wherein the electromagnetic and/or particle radiation is beamed through the supply channel (9) into the area of the tip (3) or edge (4).

7. The process according to claim 1, wherein when creating the surface structure, at least one electrically conducting coating is applied on the substrate (2), which is arranged on the surface of the surface structure.

8. The process according to claim 1, wherein the substrate (2) is arranged in a first electrolyte (11) at least with one area which has the tip (3) or edge (4), and which does not have, or has only in small concentrations, ions of a galvanized electrode material (5), wherein through the supply channel (9), a second electrolyte (6) is supplied, which emerges at the tip (3) or edge (4) and which has the ions to be applied, and wherein for galvanization of the electrode layer (5) at the tip (3) or edge (4), an electrical voltage is applied between the substrate (2) and the second electrolyte (6).

9. The process according to claim 1, wherein the supply channel (9) is formed in such a manner in the substrate (2) that its cross-section becomes reduced starting from the channel end facing away from the tip (3) or edge (4) to the opening arranged in the area of the tip (3) or edge (4).

10. The process according to claim 1, wherein a semiconductor material is used as the substrate (2).

11. The process according to claim 1, wherein in the area of the tip (3) or edge (4) a noble metal is applied.

12. The process according to claim 1, wherein a recess is made in the electrically insulating material, wherein an electrically conducting material is introduced into the recess, wherein an area of the insulating material surrounding the conducting material is removed by etching until the conducting material forms a tip (3) or edge (4) projecting on the substrate surface, and wherein on the tip (3) or edge (4) at least one electrically conducting electrode layer (5) is galvanized on and/or applied by electrostatic powder coating.

13. The process according to claim 12, wherein after application of the electrode layer (5), an area of the insulating material, which surrounds the conducting material and was introduced into the recess, is again removed and wherein the surface area of the conducting material which is laid bare by the removal is then converted by a chemical reaction into an insulating layer (8) or is provided with an insulating layer (8).

14. The process according to claim 12, wherein the recess made in the substrate (2) is completely filled with the electrically conducting material.

15. The process according to claim 12, wherein the recess made in the substrate (2) is lined with the electrically conducting material.

16. The process according to claim 1, wherein the electrically conducting material comprises a metal.

3. A process for manufacturing an electrode (1) comprising creating a surface structure having at least one tip (3) or edge (4) on a substrate, wherein the surface structure is produced from an electrically conducting material, wherein in the area of the tip (3) or edge (4) at least one electrically conducting electrode layer (5) is galvanized and/or applied by electrostatic powder coating thereon, and wherein a surface area of the substrate (2) surrounding the electrode layer (5) located on the tip (3) or edge (4) is converted by a chemical reaction into an insulating layer (8) or provided with such an insulating layer.

4. The process according to claim 3, wherein for the electrode layer (5) a material is selected which is more resistant to oxidation than a material of the substrate, and wherein the insulating layer (8) is produced by oxidation of a surface area of the substrate (2) surrounding the electrode layer (5).

5. The process according to claim 3, wherein for the electrode layer (5) a material is selected which is more resistant to nitration than a material of the substrate, and wherein the insulating layer (8) is produced by nitration of a surface area of the substrate (2) surrounding the electrode layer (5).

6. The process according to claim 3, wherein the insulating layer (8) is produced by anodic oxidation of a surface area of the substrate (2) surrounding the electrode layer (5).

17. A process for manufacturing an electrode (1) comprising creating a surface structure having at least one tip (3) or edge (4) on a substrate, wherein the surface structure is produced from an electrically conducting material, applying at least one electrically conducting electrode layer (5) in the area of the tip (3) or edge (4) and also onto the substrate outside of the area of the tip (3) or edge (4) by galvanizing and/or applying an electrostatic powder coating thereon, and thereafter removing a portion of the electrically conducting material from the electrode layer (5) by etching until the electrode layer (5) is removed up to a residual area remaining in the area of the tip (3) or edge (4).