System for chemical mechanical planarization

• US 6,413,873 B1
• Filed: 05/03/2000
• Issued: 07/02/2002
• Est. Priority Date: 05/03/1999
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Tietz, James V., Birang, Manoocher, White, John M., Li, Shijian, Emami, Ramin, Rosenberg, Lawrence M., Scales, Martin
• Primary Examiner(s): Smith, Matthew
• Assistant Examiner(s): Anya, Igwe U.
• Application Number:
  US09/563,550
• Time in Patent Office: 790 Days
• Field of Search: 438/711, 438/692, 438/691, 438/693, 438/745, 156/345, 451/41, 451/285, 451/287, 451/289, 451/59, 451/36, 451/178, 451/286
• US Class Current: 438/711
• CPC Class Codes: B24B 1/04 subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency polishing or abrading surfaces on work by means of tumbling apparatus B24B31/00, involving oscillating or vibrating containers B24B31/06; superfinishing surfaces on work, e.g. by means of abrading blocks reciprocating with high frequency, B24B35/00
• CPC Class Codes: B24B 21/04 for grinding plane surfaces
• CPC Class Codes: B24B 21/18 Accessories
• CPC Class Codes: B24B 37/12 Lapping plates for working plane surfaces
• CPC Class Codes: B24B 37/16 characterised by the shape of the lapping plate surface, e.g. grooved
• CPC Class Codes: B24B 37/20 Lapping pads for working plane surfaces
• CPC Class Codes: B24B 49/14 taking regard of the temperature during grinding
• CPC Class Codes: B24B 55/02 Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant cooling or lubricating during dressing operation B24B53/095; incorporated in grinding wheels B24D
• CPC Class Codes: B24B 57/02 for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
• CPC Class Codes: H01L 21/30625 With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Abstract

A semiconductor substrate processing system for polishing a substrate that generally includes a platen and a web of polishing material disposed thereon. Embodiments of the system include a disposable cartridge for housing the web of polishing material, a shield member disposed proximate the web for preventing contamination of the unused portion of the web, a fluid delivery for fixing and freeing the web from the platen, apparatus for controlling the lateral movement of the web, and an apparatus for providing more linear feet of polishing material per height of a roll.

Claims

1. Apparatus for semiconductor substrate polishing comprising:

a polishing platen;

a web of polishing material having at least a first portion disposed on the polishing platen; and

a shield member disposed adjacent the polishing platen and defining a slot there between, the web disposed through the slot.

2. The apparatus of claim 1, wherein the shield member further comprises:

a wiper, the web disposed between the wiper and the platen.

3. Apparatus for semiconductor substrate polishing comprising:

a polishing platen;

a web of polishing material having at least a first portion disposed on the polishing platen;

a polishing head disposed proximate the platen and having a conventional polishing motion therebetween; and

a vibrational energy source having a predetermined frequency and adapted to provide a movement between the polishing head and the platen in addition to the conventional polishing motion.