Multiple-fan modular cooling component

• US 6,414,845 B2
• Filed: 02/08/2001
• Issued: 07/02/2002
• Est. Priority Date: 05/24/1999
• Status: Expired due to Fees

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Bonet, Sandra E.
• Primary Examiner(s): TOLIN, GERALD P
• Application Number:
  US09/780,593
• Publication Number:
  US 20010024358A1
• Time in Patent Office: 509 Days
• Field of Search: 417/360, 417/423.5, 417/423.7, 415/178, 415/213.1, 415/214.1, 454/184, 165/80.3, 165/121-126, 174/15-- 1, 312/236, 361/687, 361/690, 361/694, 361/695, 361/717-719
• US Class Current: 361/695
• CPC Class Codes: H05K 7/20581 Cabinets including a drawer for fans

Abstract

A modular cooling component for installation in multi-component-bay electronic devices. The modular cooling component includes multiple cooling fans, each positioned to produce an air stream within a component bay of a multi-component-bay electronic device. The cooling fans are internally wired and interconnected to signal lines and power supply lines of the electronic device through a plastic plug-type electrical connector. The modular cooling component is held in place by a thumbscrew.

Claims

1. A cooling system that cools components of a multi-component electronic device, the cooling system comprising:

two or more separate component bays within the multi-component electronic device, each separate component bay cooled by a separate stream of air flowing through the component bay;

a transverse external opening in a side of the multi-component electronic device aligned transverse to two or more component bays within the multi-component electronic device, said external opening spans the number of separate component bays;

a modular cooling component slideably mounted through said transverse external opening in a direction approximately orthogonal to the side of the multi-component electronic device within the multi-component electronic device and positioned within said two or more component bays and therefore spanning the number of separate component bays, the modular cooling component including a cooling fan positioned within each of the number of component bays, each cooling fan positioned within a single component bay to create the separate stream of air flowing within the component bay, the modular cooling component including an end plate, orthogonal to the direction in which the nodular cooling component is slideably mounted, extending above a top surface of the modular cooling component to form a mounting plate;

a first electrical connector affixed to the mounting plate; and

a second, complementary electrical connector mounted within the multi-component electronic device coupled to the first electrical connector in order to provide electrical power from the multi-component electronic device to the modular cooling component, the first electrical connector slideably mating with the second, complementary electrical connector as the modular cooling component is inserted into a final position within the multi-component electronic device.

2. The cooling system of claim 1 wherein the number of separate component bays within the multi-component electronic device are parallel to one another and separated from one another by internal walls within the multi-component electronic device.

3. The cooling system of claim 2 wherein the modular cooling component is position substantially perpendicular to the internal walls and substantially perpendicular to long dimensions of the number of component bays.

4. The cooling system of claim 1 wherein the modular cooling component includes internal power lines that couple motors that drive the cooling fans to the first electrical connector.

5. The cooling system of claim 1 wherein the modular cooling component includes a substantially rectangular housing, the housing comprising:

a front surface including apertures, to each of which a cooling fan is mounted;

a top surface substantially orthogonal to the front surface;

an end plate orthogonal to both the front surface and the top surface, the end plate including a molded handle and extending above a plane of the top surface to form a mounting plate to which the first electrical connector is mounted.

6. The cooling system of claim 5 wherein the modular cooling component housing is formed from a single sheet of rigid material.

7. The cooling system of claim 5 wherein the modular cooling component housing is cut and from a single sheet of metal and folded and shaped to form the front surface, top surface, and end plate.

8. A method for cooling a multi-component electronic device using a modular, slideably insertable and slideably extractable modular cooling component, the method comprising;

providing a transverse external opening in the multi-component electronic device in a side of the multi-component electronic device with dimensions slightly larger than those of an end of the modular cooling component;

providing two or more separate component bays within the multi-component electronic device, each separate component bay cooled by a separate stream of air flowing through the component bay, the number of component bays spanned by one or more internal openings aligned with the external opening; and

sliding a modular cooling component into the multi-component electronic device through the transverse external opening in a direction approximately orthogonal to the side of the multi-component electronic device within the multi-component electronic device so that the modular cooling component is positioned within said two or more component bays, thereby spanning the number of separate component bays, the modular cooling component including a cooling fan positioned within each of the member of component bays, each cooling fan positioned, following insertion of the modular cooling component, within a single component bay to create the separate stream of air flowing within the component bay, the modular cooling component including an end plate, orthogonal to the direction in which the modular cooling component is slideably mounted, extending above a top surface of the modular cooling component, to form a mounting plate and a first electrical connector affixed to the mounting plate that slideably mates to a second, complementary electrical connector mounted within the multi-component electronic device to provide electrical power from the multi-component electronic device to the modular cooling component.