Heating element containing sewn resistance material

• US 6,415,501 B1
• Filed: 10/13/1999
• Issued: 07/09/2002
• Est. Priority Date: 10/13/1999
• Status: Expired due to Term

• Current Assignee: Watlow Polymer Technologies
• Original Assignee: Watlow Polymer Technologies
• Inventors: Von Arx, Theodore, Schlesselman, John W., Papenfuss, Ronald E.
• Primary Examiner(s): Vo, Peter
• Assistant Examiner(s): Smith, Sean
• Application Number:
  US09/416,731
• Time in Patent Office: 1,000 Days
• Field of Search: 296/101, 296/11, 219/549, 219/545, 219/528, 219/529, 219/553
• US Class Current: 29/611
• CPC Class Codes: H05B 3/283 the insulating material being an inorganic material, e.g. ceramic
• CPC Class Codes: H05B 3/286 the insulating material being an organic material, e.g. plastic
• CPC Class Codes: H05B 3/30 on or between metallic plates
• CPC Class Codes: Y10T 29/49082 Resistor making
• CPC Class Codes: Y10T 29/49083 Heater type

Abstract

Heating elements, electrical devices and processes for manufacturing these components are provided. The heating elements and electrical components employ a resistance heating material, such as Ni-Cr wire, sewn with a thread to a supporting substrate, such as a non-woven glass mat. The sewn thread supports the relatively thin cross-section of the resistance material when a fusible layer is applied, such as by molding a polymer under pressure.

Claims

1. A method of making an insulated, electrical component, comprising the steps of:

(a) providing an electrical device having a relatively thin cross-section;

(b) sewing said electrical device to a supporting substrate with a thread to form an element precursor having a circuit path;

(c) mechanically deforming at least said circuit path; and

(d) substantially encapsulating at least said circuit path within a fusible layer, whereby said sewn thread supports said electrical device when said fusible layer is applied;

wherein the shape of said circuit path is mechanically deformed prior to the encapsulating step (d).

2. The method of claim 1 wherein said encapsulation step comprises compression molding, injection molding, blow molding, extrusion or rotational molding.

3. The method of claim 1 wherein said supporting substrate comprises a non-woven or woven fibrous mat, having an air permeability rating of at least about 1,000 cubic feet per minute.

4. The method of a claim 3, wherein said electrical device comprises carbon, graphite or Ni-Cr resistance heating wire, and said fusible layer comprises a filled thermosetting resin.

5. The method of claim 3, wherein said encapsulating step flows said fusible layer into a plurality of pores of said non-woven or woven fibrous mat.

6. The method of claim 1, wherein said element precursor comprises a fusible material.

7. The method of claim 1, in which said circuit path is directed by a programmable sewing machine.

8. A method of making a polymeric heating element, comprising;

the steps of;

a. providing a reinforcing support layer having a plurality of open pores;

b. sewing an electrical resistance heating material onto said reinforcing support layer to form an element precursor having a circuit path thereon;

c. mechanically deforming at least said circuit path; and

d. substantially encapsulating said element precursor within a polymeric material whereby a portion of said polymeric material flows into a portion of said open pores of said reinforcing support layer, while preserving the reinforcing capabilities thereof, wherein the shape of said circuit path is mechanically deformed prior to the encapsulating step (d).

9. The method of claim 8 further comprising liquefying said polymeric material.

10. The method of claim 9, wherein said liquefication step comprises the use of heat or pressure or both.

11. The method of claim 8, wherein said element precursor further comprises a fusible material.

12. The method of claim 11, wherein said fusible material and said polymeric material comprise the same polymeric resin.

13. The method of claim 8, wherein said reinforcing support layer comprises one or more materials selected from the group consisting of:

grid, scrim, nonwoven fabric, spun-bonded layer, clay, thermosetting sheet film, thermoplastic sheet film, non-woven fiberglass mat, polymer impregnated fabric, raw printed circuit board laminate, polymer or natural organic fabric weave, porous mica-filled plate or sheet and porous ceramic wafer.

14. The method of claim 8, wherein said reinforcing support layer is at least partially fused, melt-bonded or liquefied during said molding step.

15. A method of making an electrical resistance heater, comprising the steps of:

a. providing a sewable support layer;

b. sewing an electrical resistance heating member onto said sewable support layer to form an element precursor having a circuit path thereon;

c. mechanically deforming at least said circuit path; and

d. electrically insulating said electrical resistance heating member within a thermally conductive material which is capable of forming a fusion bond with said sewable support layer, wherein the shape of the circuit path is mechanically deformed prior to said electrically insulating step (d).

16. The method of claim 15, wherein said element precursor comprises one or more of the materials selected from the group consisting of:

clay, thermoplastic resin, thermosetting resin, glass, ceramic, and printed circuit laminate material.

17. The method of claim 15, wherein said support layer comprises a polymeric material.

18. The method of claim 15, wherein said support layer comprises a metallic film.

19. The method of claim 18, wherein said electrical resistance heating member comprises a wire coated with an electrically insulating coating.