Method and apparatus for marking and identifying a defective die site
First Claim
1. A method for identifying at least one defective die site on a substrate, comprising:
- providing a substrate with an array of semiconductor die sites configured on a surface thereof;
evaluating said array of semiconductor die sites for defects; and
encoding information relating to at least one semiconductor die site of said array of semiconductor die sites on an off-site surface portion of said substrate.
8 Assignments
0 Petitions
Accused Products
Abstract
The present invention comprises methods and apparatus relating to the marking and identification of defective die sites on a mounting substrate. In this regard, a mounting substrate is provided which is inspected and tested for visual and electrical defects. The inspection and testing data are then compiled and correlated with individual die sites. Information relating to the functionality and/or various defects of one or more die sites is then encoded in the form of a designator placed on the substrate. Other information, such as the manufacturing process history of the mounting substrate may also be encoded on the designator. The information encoded on the designator may then be read or scanned by, for example, by computer driven video equipment, and used in a die attach process to discriminately place semiconductor dice only on known good die sites, as indicated by the inspection and testing data. The designator preferably comprises information encoded in the form of a bar code, or a series of identifying marks. The designator also preferably comprises a strip of magnetic tape with information programmed thereon. The encoded information may also be correlated with a computerized map of a mounting substrate. Correlated data regarding die site functionality can then be electronically transferred to a die bonding apparatus.
90 Citations
63 Claims
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1. A method for identifying at least one defective die site on a substrate, comprising:
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providing a substrate with an array of semiconductor die sites configured on a surface thereof;
evaluating said array of semiconductor die sites for defects; and
encoding information relating to at least one semiconductor die site of said array of semiconductor die sites on an off-site surface portion of said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A die-attach process, comprising:
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providing a mounting substrate having at least one semiconductor die site configured thereon;
evaluating said at least one semiconductor die site for defects;
encoding information relating to one or more defects of said at least one semiconductor die site on an off-site surface portion of said mounting substrate;
reading said encoded information in furtherance of a die attach process; and
attaching a semiconductor die to known good die sites of said at least one semiconductor die site. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A method of assembling a semiconductor device package comprising:
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providing a semiconductor substrate having a first surface and a second surface, at least one of said first surface and said second surface comprising a plurality of semiconductor die sites;
evaluating said plurality of semiconductor die sites for defects;
correlating information obtained from said evaluating said plurality of semiconductor die sites with at least some of said plurality of semiconductor die sites on one of said first surface and said second surface of said semiconductor substrate;
encoding information relating to at least one of said plurality of semiconductor die sites on an off-site surface portion of said semiconductor substrate;
reading said encoded information from said off-site surface portion of said semiconductor substrate; and
attaching a semiconductor die to known good semiconductor die sites of said plurality of semiconductor die sites. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. A method for identifying at least one defective semiconductor die site on a substrate comprising:
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providing a substrate with an array of semiconductor die sites configured on a surface thereof;
evaluating said array of semiconductor die sites for defects; and
encoding information relating to at least one semiconductor die site of said array of semiconductor die sites off-site of said substrate. - View Dependent Claims (42, 43, 44, 45)
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46. A designator located on a semiconductor device mounting substrate comprising:
encoded information placed on an off-site surface portion of a semiconductor device mounting substrate, said semiconductor device mounting substrate having at least one semiconductor die site configured on a surface thereof, said encoded information including information related to performance characteristics of at least one of said at least one semiconductor die site. - View Dependent Claims (47, 48, 49, 50, 51, 52, 53, 54)
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55. A substrate for mounting at least one semiconductor die thereon, comprising:
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a substrate having a first surface and a second surface, at least one of said first surface and said second surface comprising at least one semiconductor die site; and
a designator located on an off-site surface portion of said substrate, said designator comprising encoded information relating to performance characteristics of at least one of said at least one semiconductor die site. - View Dependent Claims (56, 57, 58, 59, 60, 61, 62, 63)
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Specification