Electro-chemical deposition cell for face-up processing of single semiconductor substrates
First Claim
1. An apparatus for electroplating a met al onto a substrate having a substrate plating surface, comprising:
- a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;
a cathode clamp ring disposed in electrical contact with the substrate plating surface;
an anode disposed above the substrate support member, an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;
a power source connected to the anode and the cathode clamp ring, wherein an electrical contact to the cathode clamp ring is isolated from a region between the substrate support member and the anode, a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and
an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.
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Accused Products
Abstract
The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers. The substrate support member also rotates and vibrates during processing to enhance the electro-deposition onto the substrate plating surface.
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Citations
25 Claims
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1. An apparatus for electroplating a met al onto a substrate having a substrate plating surface, comprising:
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a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;
a cathode clamp ring disposed in electrical contact with the substrate plating surface;
an anode disposed above the substrate support member, an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;
a power source connected to the anode and the cathode clamp ring, wherein an electrical contact to the cathode clamp ring is isolated from a region between the substrate support member and the anode, a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and
an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
a shutter plate disposed between the anode and the substrate surface; and
an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.
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14. The apparatus of claim 1, further comprising:
a rinse spray spout disposed above the substrate plating surface to spray a rinse agent over the substrate surface.
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15. A method for electroplating a metal onto a substrate plating surface, comprising:
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a) holding a substrate with the substrate plating surface face-up on a rotatable substrate support member having means for holding and rotating the substrate during an electroplating process;
b) electrically contacting a cathode clamp ring to the substrate plating surface;
c) positioning an anode above the substrate plating surface;
d) flowing an electroplating solution from the anode to the substrate plating surface;
e) supplying the electroplating solution into a cavity ring disposed above the anode; and
f) moving a shutter plate disposed between the anode and the substrate plating surface.
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16. An apparatus for electroplating a metal onto a substrate having a substrate plating surface, comprising:
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a) a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;
b) a cathode clamp ring disposed in electrical contact with the substrate plating surface;
c) an anode disposed above the substrate support member;
d) an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;
e) a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and
f) an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.
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17. An apparatus for electroplating a metal onto a substrate having a substrate plating surface, comprising:
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a) a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;
b) a cathode clamp ring disposed in electrical contact with the substrate plating surface;
c) an anode disposed above the substrate support member;
d) an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;
e) a shutter plate disposed between the anode and the substrate surface; and
f) an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.
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18. A method for electroplating a metal onto a substrate plating surface, comprising:
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a) holding a substrate on a rotatable support member in a generally face-up orientation;
b) electrically contacting a cathode clamp ring to the plating surface;
c) positioning an anode above the plating surface;
d) flowing an electroplating solution from the anode to the plating surface;
e) supplying the electroplating solution into a cavity ring disposed above the anode; and
f) moving a shutter plate disposed between the anode and the plating surface.
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19. An apparatus for electroplating a metal onto a substratate, comprising;
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a) a rotatable support member having a receiving surface for supporting the substrate, in a generally face-up orientation;
b) a cathode clamp ring disposable in electrical contact with a plating surface of the substrate;
c) an anode disposed above the substrate support member, d) a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and
e) an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.
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20. An apparatus for electroplating a metal onto a substrate plating surface disposed in a generally face-up orientation, comprising:
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a) a rotatable support member, b) a cathode clamp ring disposed in electrical contact with the plating surface;
c) an anode disposed above the substrate support member;
d) an electroplating solution inlet connectable to an electroplating solution supply;
e) a shutter plate disposed between the anode and the plating surface; and
f) an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.
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21. An apparatus for electroplating a metal onto a substrate comprising:
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a) an enclosure;
b) a rotatable support member for supporting the substrate in a face-up processing position, wherein the face comprises a plating surface;
c) a cathode clamp ring adapted to electrically contact the plating surface, wherein the cathode clamp ring comprises one or more locking grooves disposed on a bottom surface thereof, and d) an anode disposed above the substrate support member, wherein an electrical contact to the cathode clamp ring is isolated from the electroplating solution, and wherein the cathode clamp ring is electrically connected to a power source through one or more cathode contacts disposed about the support member. - View Dependent Claims (22, 23)
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24. An apparatus for electroplating a metal onto a substrate having a substrate plating surface, comprising:
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a) a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;
b) a cathode clamp ring disposed in electrical contact with the substrate plating surface;
c) an anode disposed above the substrate support member;
d) an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;
e) a power source connected to the anode and the cathode clamp ring, wherein an electrical contact to the cathode clamp ring is isolated from a region between the substrate support member and the anode;
f) a shutter plate disposed between the anode and the substrate surface; and
g) an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.
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25. An apparatus for electroplating a metal onto a substrate comprising:
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a) an enclosure;
b) a rotatable support member for supporting the substrate in a face-up processing position, wherein the face comprises a plating surface;
c) a cathode clamp ring adapted to electrically contact the plating surface, wherein the cathode clamp ring comprises one to more looking grooves disposed on a bottom surface thereof; and
d) an anode disposed above the substrate support member, wherein an electrical contact to the cathode clamp ring is isolated from the electroplating solution, and e) one or more cathode contacts disposed about the support member and disposable within the locking grooves thereby allowing the cathode clamp ring to rotate with the support member.
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Specification