Electro-chemical deposition cell for face-up processing of single semiconductor substrates

• US 6,416,647 B1
• Filed: 04/19/1999
• Issued: 07/09/2002
• Est. Priority Date: 04/21/1998
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Dordi, Yezdi, Sugarman, Michael, Denome, Mark, Stevens, Joe, Edwards, Roy, Lowrance, Bob
• Primary Examiner(s): Valentine, Donald R.
• Assistant Examiner(s): TRAN, THAO T
• Application Number:
  US09/294,240
• Time in Patent Office: 1,177 Days
• Field of Search: 204/225, 204/212, 204/275.1, 204/278, 204/282, 204/284, 204/222, 204/297.03, 205/80, 205/143, 205/137
• US Class Current: 205/137
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/004 Sealing devices
• CPC Class Codes: C25D 17/005 Contacting devices
• CPC Class Codes: C25D 17/08 Supporting racks , i.e. not for suspending
• CPC Class Codes: C25D 21/00 Processes for servicing or operating cells for electrolytic coating
• CPC Class Codes: C25D 21/18 of electrolytes C25D21/22 takes precedence
• CPC Class Codes: C25D 5/20 Electroplating using ultrasonics , vibrations
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/6715 Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 21/68792 characterised by the construction of the shaft

Abstract

The invention provides an electro-chemical deposition cell for face-up processing of semiconductor substrates comprising a substrate support member, a cathode connected to the substrate plating surface, an anode disposed above the substrate support member and an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface. Preferably, the anode comprises a consumable metal source disposed in a liquid permeable structure, and the anode and a cavity ring define a cavity for holding and distributing the electroplating solution to the substrate plating surface. Preferably, the substrate support member comprises a vacuum chuck having vacuum ports disposed on the substrate supporting surface that serves to provide suction during processing and to provide a blow-off gas flow to prevent backside contamination during substrate transfers. The substrate support member also rotates and vibrates during processing to enhance the electro-deposition onto the substrate plating surface.

Claims

1. An apparatus for electroplating a met al onto a substrate having a substrate plating surface, comprising:

a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;

a cathode clamp ring disposed in electrical contact with the substrate plating surface;

an anode disposed above the substrate support member,

an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;

a power source connected to the anode and the cathode clamp ring, wherein an electrical contact to the cathode clamp ring is isolated from a region between the substrate support member and the anode,

a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and

an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.

2. The apparatus of claim 1 wherein the substrate support member comprises a vacuum chuck.

3. The apparatus of claim 2 wherein the substrate support member includes an annular seal on a substrate receiving surface for receiving the substrate.

4. The apparatus of claim 1 wherein the substrate support member is a rotatable member adapted to rotate between about 10 rpm and about 50 rpm during the electroplating process.

5. The apparatus of claim 1 wherein the substrate support member is a vibrational member.

6. The apparatus of claim 1 wherein the substrate support member includes a gas outlet disposed adjacent a peripheral portion of the substrate supporting surface.

7. The apparatus of claim 1 wherein the cathode clamp ting, comprises a conductive annular clamp ring.

8. The apparatus of claim 1 wherein the cathode clamp ring is fixedly connected to a cathode power supply.

9. The apparatus of claim 1 wherein the substrate support member includes a cathode contact disposed in selective engagement with the cathode.

10. The apparatus of claim 1 wherein the anode comprises a perforated plate.

11. The apparatus of claim 1 wherein the anode comprises a consumable metal source disposed in a liquid permeable enclosure.

12. The apparatus of claim 1 wherein the anode is a non-consumable anode.

13. The apparatus of claim 1, further comprising:

a shutter plate disposed between the anode and the substrate surface; and

an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.

14. The apparatus of claim 1, further comprising:

a rinse spray spout disposed above the substrate plating surface to spray a rinse agent over the substrate surface.

15. A method for electroplating a metal onto a substrate plating surface, comprising:

a) holding a substrate with the substrate plating surface face-up on a rotatable substrate support member having means for holding and rotating the substrate during an electroplating process;

b) electrically contacting a cathode clamp ring to the substrate plating surface;

c) positioning an anode above the substrate plating surface;

d) flowing an electroplating solution from the anode to the substrate plating surface;

e) supplying the electroplating solution into a cavity ring disposed above the anode; and

f) moving a shutter plate disposed between the anode and the substrate plating surface.

16. An apparatus for electroplating a metal onto a substrate having a substrate plating surface, comprising:

a) a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;

b) a cathode clamp ring disposed in electrical contact with the substrate plating surface;

c) an anode disposed above the substrate support member;

d) an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;

e) a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and

f) an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.

17. An apparatus for electroplating a metal onto a substrate having a substrate plating surface, comprising:

a) a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;

b) a cathode clamp ring disposed in electrical contact with the substrate plating surface;

c) an anode disposed above the substrate support member;

d) an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;

e) a shutter plate disposed between the anode and the substrate surface; and

f) an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.

18. A method for electroplating a metal onto a substrate plating surface, comprising:

a) holding a substrate on a rotatable support member in a generally face-up orientation;

b) electrically contacting a cathode clamp ring to the plating surface;

c) positioning an anode above the plating surface;

d) flowing an electroplating solution from the anode to the plating surface;

e) supplying the electroplating solution into a cavity ring disposed above the anode; and

f) moving a shutter plate disposed between the anode and the plating surface.

19. An apparatus for electroplating a metal onto a substratate, comprising;

a) a rotatable support member having a receiving surface for supporting the substrate, in a generally face-up orientation;

b) a cathode clamp ring disposable in electrical contact with a plating surface of the substrate;

c) an anode disposed above the substrate support member,

d) a cavity ring disposed below the electroplating solution inlet, the cavity ring and the anode defining a cavity for holding the electroplating solution; and

e) an actuator connected to the cavity ring to move the cavity ring about a substantially horizontal plane.

20. An apparatus for electroplating a metal onto a substrate plating surface disposed in a generally face-up orientation, comprising:

a) a rotatable support member,

b) a cathode clamp ring disposed in electrical contact with the plating surface;

c) an anode disposed above the substrate support member;

d) an electroplating solution inlet connectable to an electroplating solution supply;

e) a shutter plate disposed between the anode and the plating surface; and

f) an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.

21. An apparatus for electroplating a metal onto a substrate comprising:

a) an enclosure;

b) a rotatable support member for supporting the substrate in a face-up processing position, wherein the face comprises a plating surface;

c) a cathode clamp ring adapted to electrically contact the plating surface, wherein the cathode clamp ring comprises one or more locking grooves disposed on a bottom surface thereof, and

d) an anode disposed above the substrate support member, wherein an electrical contact to the cathode clamp ring is isolated from the electroplating solution, and wherein the cathode clamp ring is electrically connected to a power source through one or more cathode contacts disposed about the support member.

22. The method of claim 21, wherein the cathode clamp ring comprises a contact portion directly in contact with a peripheral portion of the plating surface.

23. The apparatus of claim 22, wherein the cathode clamp ring is rotatable with the substrate support due to a frictional force between the contact portion of the clamp ring and the plating surface of the substrate.

24. An apparatus for electroplating a metal onto a substrate having a substrate plating surface, comprising:

a) a rotatable substrate support member having means for holding and rotating the substrate with the substrate plating surface facing upward during an electroplating process;

b) a cathode clamp ring disposed in electrical contact with the substrate plating surface;

c) an anode disposed above the substrate support member;

d) an electroplating solution inlet supplying an electroplating solution fluidly connecting the anode and the substrate plating surface;

e) a power source connected to the anode and the cathode clamp ring, wherein an electrical contact to the cathode clamp ring is isolated from a region between the substrate support member and the anode;

f) a shutter plate disposed between the anode and the substrate surface; and

g) an actuator connected to the shutter plate to move the shutter plate about a substantially horizontal plane.

25. An apparatus for electroplating a metal onto a substrate comprising:

a) an enclosure;

b) a rotatable support member for supporting the substrate in a face-up processing position, wherein the face comprises a plating surface;

c) a cathode clamp ring adapted to electrically contact the plating surface, wherein the cathode clamp ring comprises one to more looking grooves disposed on a bottom surface thereof; and

d) an anode disposed above the substrate support member, wherein an electrical contact to the cathode clamp ring is isolated from the electroplating solution, and

e) one or more cathode contacts disposed about the support member and disposable within the locking grooves thereby allowing the cathode clamp ring to rotate with the support member.