Semiconductor substrate and method of manufacturing the same

• US 6,417,108 B1
• Filed: 01/28/1999
• Issued: 07/09/2002
• Est. Priority Date: 02/04/1998
• Status: Expired due to Term

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Atoji, Tadashi, Akino, Yutaka
• Primary Examiner(s): GOUDREAU, GEORGE A
• Application Number:
  US09/238,571
• Time in Patent Office: 1,258 Days
• Field of Search: 438/149, 438/455, 438/479, 438/151, 438/734, 438/690, 438/751, 438/753, 257/52, 257/347, 156/60, 156/150, 216/56, 216/20, 216/33, 216/36, 216/52, 216/93, 216/99
• US Class Current: 438/690
• CPC Class Codes: H01L 21/2007 Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer H01L21/2011 takes precedence; bonding of semiconductor wafers to semiconductor wafers for junction formation H01L21/187
• CPC Class Codes: H01L 21/7624 using semiconductor on insulator [SOI] technology H01L21/76297 takes precedence; manufacture of integrated circuits on insulating substrates H01L21/84; silicon on sapphire [SOS] technology H01L21/86
• CPC Class Codes: H01L 21/76251 using bonding techniques
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 156/1043 Subsequent to assembly
• CPC Class Codes: Y10T 156/1052 with cutting, punching, tearing or severing

Abstract

A method of manufacturing a semiconductor substrate can effectively prevent a chipping phenomenon and the production of debris from occurring in part of the insulation layer and the semiconductor by removing a outer peripheral portion of the semiconductor substrate so as to make the outer peripheral extremity of the insulation layer to be located between the outer peripheral extremity of the semiconductor layer and that of the support member and hence the semiconductor layer and the insulation layer produce a stepped profile.

Claims

1. A method of manufacturing a semiconductor substrate comprising a support member, an insulation layer arranged on the support member and a semiconductor layer arranged on the insulation layer, the outer peripheral extremity of the semiconductor layer being located inside the outer peripheral extremity of the insulation layer and the outer peripheral extremity of the insulation layer being located inside between the outer peripheral extremity of the semiconductor layer and that of the support member so that the outer peripheral portion of the semiconductor substrate including the insulation layer and the semiconductor layer shows a stepped profile, comprising steps of removing an extreme portion from the insulation layer and also an extreme portion from the semiconductor layer so as to make both the outer peripheral extremity of the insulation layer and that of the semiconductor layer to be located inside the outer peripheral extremity of the support member and removing an extreme portion from the semiconductor layer so as to make the outer peripheral extremity of the semiconductor layer to be located inside the outer peripheral extremity of the insulation layer.

4. A method of manufacturing a semiconductor substrate according to claim 1 or 2, further comprising steps of preparing a first member having a porous single crystal silicon layer and a non-porous single crystal silicon layer, bonding said first member and a second member with an insulation layer interposed therebetween so as to produce a multilayer structure with said non-porous single crystal silicon layer located inside and removing said porous single crystal silicon layer from said multilayer structure, said steps being conducted prior to said step of removing said extreme portions.

5. A method of manufacturing a semiconductor substrate according to claim 1 or 2, further comprising steps of:

forming a silicon oxide layer on the surface of a single crystal silicon wafer substrate, forming a micro-bubble layer in the inside of said single crystal silicon wafer by implanting ions selected from hydrogen ions and rare gas ions from the side of said silicon oxide layer and bonding said silicon oxide layer to a separate support member, said steps being conducted prior to said step of removing extreme portions.

6. A method of manufacturing a semiconductor substrate according to claim 1 or 2, wherein the difference between the width of the etching mask used for the step of removing an extreme portion from said semiconductor layer so as to make the outer peripheral extremity of said semiconductor layer to be located inside the outer peripheral extremity of said insulation layer and that of the etching mask used for the step of removing an extreme portion from said insulation layer is not smaller than 5 microns and not greater than 1 mm.

7. A method of manufacturing a semiconductor substrate according to claim 1 or 2, wherein the difference between the width of the etching mask used for the step of removing an extreme portion from said semiconductor layer so as to make the outer peripheral extremity of said semiconductor layer to be located inside the outer peripheral extremity of said insulation layer and that of the etching mask used for the step of removing an extreme portion from said insulation layer is not smaller than 100 microns and not greater than 500 microns.

8. A method of manufacturing a semiconductor substrate according to claim 1 or 2, wherein said step of removing an extreme portion from said semiconductor layer and also an extreme portion from said insulation layer includes a step of bonding an etching mask tape, an etching step and a step of peeling off the tape.

9. A method of manufacturing a semiconductor substrate according to claim 1 or 2, wherein said step of removing an extreme portion from said semiconductor layer and also an extreme portion from said insulation layer is conducted by means of an edge etcher or an edge polisher.

2. A method of manufacturing a semiconductor substrate comprising a support member, an insulation layer arranged on the support member and a semiconductor layer arranged on the insulation layer, the outer peripheral extremity of the semiconductor layer being located inside the outer peripheral extremity of the insulation layer and the outer peripheral extremity of the insulation layer being located between the outer peripheral extremity of the semiconductor layer and that of the support member so that the outer peripheral portion of the semiconductor substrate including the insulation layer and the semiconductor layer shows a stepped profile, comprising steps of removing an extreme portion from the semiconductor layer so as to make the outer peripheral extremity of the semiconductor layer to be located inside the outer peripheral extremity of the support member and also inside the outer peripheral extremity of the insulation layer and removing an extreme portion of the insulation layer so as to make the outer peripheral extremity of the insulation layer to be located between the outer peripheral extremity of the semiconductor layer and that of the support member such that the offset between the bottom of the outer peripheral extremity of the semiconductor layer and the top of the outer peripheral extremity of the insulation layer is not smaller than 2 microns and the lateral surface of the outer peripheral portion of the insulation layer is inclined to show an obtuse angle with the top surface thereof.

3. A method of manufacturing a semiconductor substrate according to claim 2, wherein said step of removing an extreme portion from said semiconductor layer and an extreme portion from said insulation layer include a resist application step and an etching step.

12. A method according to claim 2, wherein said step of removing an extreme portion of the insulation layer is carried out by means of isotropic etching.

10. A method of manufacturing a semiconductor substrate comprising a support member, an insulation layer arranged on the support member and a semiconductor layer arranged on the insulation layer, said method comprising steps of removing each extreme portion from the insulation layer and the semiconductor layer so as to make both the outer peripheral extremity of the insulation layer and that of the semiconductor layer to be located inside the outer peripheral extremity of the support member and removing an extreme portion from the semiconductor layer so as to make the outer peripheral extremity of the semiconductor layer to be located inside the outer peripheral extremity of the insulation layer.

13. A method according to claim 10, wherein said step of removing an extreme portion of the insulation layer is carried out by means of isotropic etching.

15. A method according to claim 10, further comprising steps of preparing a first member having a porous single crystal silicon layer and a non-porous single crystal silicon layer, bonding the first member and a second member with an insulation layer interposed therebetween so as to produce a multilayer structure with the non-single crystal, silicon layer located inside, and removing the porous single crystal layer from the multilayer structure, said further steps being conducted prior to said steps of removing the extreme portions.

17. A method according to claim 10, further comprising steps of forming a silicon oxide layer on the surface of a single crystal silicon wafer substrate which is to become the support member, forming a micro-bubble layer in the inside of the single crystal silicon wafer by implanting ions selected from hydrogen ions and rare gas ions from the side of the silicon oxide layer, and bonding the silicon oxide layer to a separate support member, said further steps being conducted prior to said steps of removing extreme portions.

11. A method of manufacturing a semiconductor substrate comprising a support member, an insulation layer arranged on the support member and a semiconductor layer arranged on the insulation layer, said method comprising steps of removing each extreme portion from the insulation layer and the semiconductor layer so as to make both the outer peripheral extremity of the insulation layer and that of the semiconductor top layer to be located inside the outer peripheral extremity of the support member and removing an extreme portion from the semiconductor layer so as to make the outer peripheral extremity of the semiconductor layer to be located inside the outer peripheral extremity of the insulation layer such that the offset between the bottom of the outer peripheral extremity of the semiconductor layer and the top of the outer peripheral extremity of the insulation layer is not smaller than 2 microns and the lateral surface of the outer peripheral portion of the insulation layer is inclined to show an obtuse angle with the top surface thereof.

14. A method according to claim 11, wherein said step of removing an extreme portion of the insulation layer is carried out by means of isotropic etching.

16. A method according to claim 11, further comprising steps of preparing a first member having a porous single crystal, silicon layer and a non-porous single crystal silicon layer, bonding the first member and a second member with an insulation layer interposed therebetween so as to produce a multilayer structure with the non-single crystal silicon layer located inside, and removing the porous single crystal layer from the multilayer structure, said further steps being conducted prior to said steps of removing the extreme portions.

18. A method according to claim 11, further comprising steps of forming a silicon oxide layer on the surface of a single crystal silicon wafer substrate which is to become the support member, forming a micro-bubble layer in the inside of the single crystal silicon wafer by implanting ions selected from hydrogen ions and rare gas ions from the side of the silicon oxide layer, and bonding the silicon oxide layer to a separate support member, said further steps being conducted prior to said steps of removing extreme portions.