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Method for improving the moisture absorption of porous low dielectric film

  • US 6,417,118 B1
  • Filed: 06/26/2001
  • Issued: 07/09/2002
  • Est. Priority Date: 06/26/2001
  • Status: Expired due to Fees
First Claim
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1. A method for improving the moisture absorption of dielectric film, said method comprising:

  • providing a dielectric film having a via hole on a semiconductor substrate, wherein said dielectric film has a plurality of dangling bond and characteristic of said dangling bond is hydrophilic; and

    treating said dielectric film with a siloxane solution and an ultrasonic vibration apparatus such that the characteristic of said dielectric film is changed hydrophobic from hydrophilic.

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