Method for improving the moisture absorption of porous low dielectric film
First Claim
1. A method for improving the moisture absorption of dielectric film, said method comprising:
- providing a dielectric film having a via hole on a semiconductor substrate, wherein said dielectric film has a plurality of dangling bond and characteristic of said dangling bond is hydrophilic; and
treating said dielectric film with a siloxane solution and an ultrasonic vibration apparatus such that the characteristic of said dielectric film is changed hydrophobic from hydrophilic.
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Abstract
A method for improving the moisture absorption of porous low dielectric film in an interconnect structure is disclosed. The porous low-k dielectric layer such as porous hydrosilsesquioxane (porous HSQ) or porous methyl silsesquioxane (porous MSQ) is spun-on the etching stop layer. After plasma process, the porous low dielectric film has a plurality of dangling bonds. Then, the wafer is placed in the supplementary instrument with hydrophobic reactive solution. Next, the hydrophobic protection film is formed on surface and sidewall of porous low-k dielectric film to improve the moisture absorption of porous low-k dielectric film and the leakage current is reduced in subsequently processes.
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Citations
20 Claims
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1. A method for improving the moisture absorption of dielectric film, said method comprising:
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providing a dielectric film having a via hole on a semiconductor substrate, wherein said dielectric film has a plurality of dangling bond and characteristic of said dangling bond is hydrophilic; and
treating said dielectric film with a siloxane solution and an ultrasonic vibration apparatus such that the characteristic of said dielectric film is changed hydrophobic from hydrophilic. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method for improving the moisture absorption of the low dielectric film, said method comprising:
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placing a low dielectric film in an ultrasonic vibration apparatus, and a siloxane solution and a catalyst therein, wherein said low dielectric layer has a plurality of dangling bonds and the characteristic of said dangling bonds is hydrophilic;
treating said low dielectric film such that said characteristic of said dangling bonds is changed hydrophobic from hydrophilic;
rinsing said low dielectric film such that said siloxane solution remained on said low dielectric film is to be cleaned;
purging said low dielectric film; and
backing said low dielectric film. - View Dependent Claims (10, 11, 12, 13)
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14. A method for improving the moisture absorption of the porous low dielectric film, said method comprising:
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placing a porous low dielectric film in an ultrasonic vibration apparatus and a siloxane solution therein, wherein said porous low dielectric film has a plurality of dangling bonds and the characteristic of said dangling bonds is hydrophilic;
treating said porous low dielectric film such that said characteristic of said dangling bonds is changed hydrophobic from hydrophilic;
rinsing said porous low dielectric film by deionization water such that said siloxane solution remained on said porous low dielectric film is to be cleaned;
purging said porous low dielectric film by nitrogen gas; and
backing said porous low dielectric film in a nitrogen furance. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification