Method and means for decoupling a printed circuit board

• US 6,418,031 B1
• Filed: 05/01/2000
• Issued: 07/09/2002
• Est. Priority Date: 05/01/2000
• Status: Expired due to Term

• Current Assignee: X Corp. (f/k/a Twitter, Inc.) (X Holdings Corp.)
• Original Assignee: International Business Machines Corporation
• Inventors: Archambeault, Bruce Roy
• Primary Examiner(s): Gaffin, Jeffrey
• Assistant Examiner(s): BUI, HUNG S
• Application Number:
  US09/564,394
• Time in Patent Office: 799 Days
• Field of Search: 361/762, 361/719, 361/734, 361/735, 361/738, 361/748, 361/763, 361/780, 361/794, 361/753, 361/736, 361/808, 361/795, 361/792, 361/793, 361/782, 174/255, 333/12, 333/246, 333/247, 333/204, 333/238, 333/236, 333/219, 333/219.1, 333/212, 333/24.C
• US Class Current: 361/762
• CPC Class Codes: H05K 1/0225 Single or multiple openings in a shielding, ground or power plane H05K1/0227 takes precedence
• CPC Class Codes: H05K 1/023 using auxiliary mounted passive components or auxiliary substances printed passive components H05K1/16
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 2201/093 Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein reduction of cross-talk, noise or interference by patterned shielding planes, ground planes or power planes H05K1/0224
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/09663 Divided layout, i.e. conductors divided in two or more parts branched layout H05K2201/09254
• CPC Class Codes: H05K 2201/10022 Non-printed resistor

Abstract

An improved method and means for decoupling a printed circuit board are disclosed. A power plane is included having a peripheral edge. The power plane includes a first region and a second region which is separate from and contiguous to the first region. The first region is located from the peripheral edge to a middle portion of the power plane. The first region includes a peripheral portion of the power plane. The second region includes only the middle portion of the power plane. A ground plane is coupled in parallel to the power plane. The ground plane has a peripheral edge. The ground plane includes a first region, and a second region which is separate from and contiguous to the first region. The first region includes the peripheral edge and includes a peripheral portion of the ground plane. The second region includes a middle portion of the ground plane. A first plurality of decoupling elements are connected to the first region of the power plane and to the first region of the ground plane. A second plurality of decoupling elements are connected to the second region of the power plane and to the second region of the ground plane. The first and second plurality of decoupling elements are utilized to decouple the power plane and ground plane pair.

Claims

1. A printed circuit board, comprising:

a power plane including a first region and a second region;

a ground plane located parallel to said power plane, said ground plane including a first region and a second region;

a first plurality of decoupling elements connected to said first region of said power plane and said first region of said ground plane; and

a second plurality of decoupling elements connected to said second region of said power plane and said second region of said ground plane.

2. The printed circuit board according to claim 1, further comprising said second region of said power plane being separate from and contiguous to said first region of said power plane.

3. The printed circuit board according to claim 2, further comprising said power plane having a peripheral edge, wherein said first region is located from said peripheral edge to a middle portion of said power plane, said first region including a peripheral portion of said power plane, and said second region including said middle portion of said power plane.

4. The printed circuit board according to claim 3, further comprising said ground plane having a peripheral edge, said ground plane including a first region and a second region which is separate from and contiguous to said first region, said first region including said peripheral edge and including a peripheral portion of said ground plane, said second region including a middle portion of said ground plane.

5. The printed circuit board according to claim 4, wherein said first plurality of decoupling elements further comprises a first plurality of a first type of decoupling capacitors.

6. The printed circuit board according to claim 5, wherein said first type of decoupling capacitors further comprises a plurality of low equivalent series resistance capacitors.

7. The printed circuit board according to claim 6, wherein said second plurality of decoupling elements further comprises a second plurality of said first type of decoupling capacitors and a plurality of a second type of decoupling capacitors.

8. The printed circuit board according to claim 7, wherein said second type of decoupling capacitors further comprises a plurality of lossy capacitors.

9. The printed circuit board according to claim 8, wherein each of said plurality of lossy capacitors includes a resistor and capacitor coupled together in series.

10. The printed circuit board according to claim 9, wherein a first half of said second plurality of decoupling elements further includes low equivalent series resistance capacitors and a second half of said second plurality of decoupling elements further includes a plurality of lossy capacitors.

11. The printed circuit board according to claim 1, wherein said first plurality of decoupling elements further comprises a first plurality of a first type of decoupling capacitors.

12. The printed circuit board according to claim 11, wherein said first type of decoupling capacitors includes low equivalent series resistance capacitors.

13. The printed circuit board according to claim 12, wherein said second plurality of decoupling elements further comprises a second plurality of said first type of decoupling capacitors and a plurality of a second type of decoupling capacitors.

14. The printed circuit board according to claim 13, wherein said second type of decoupling capacitors further comprises lossy capacitors.

15. The printed circuit board according to claim 14, wherein each of said lossy capacitors includes a resistor and capacitor coupled together in series.

16. The printed circuit board according to claim 15, wherein a first half of said second plurality of decoupling elements further includes equivalent series resistance capacitors and a second half of said second plurality of decoupling elements further includes lossy capacitors.

17. The printed circuit board of claim 1, further comprising said power plane having a plurality of portions removed from a conductor of said power plane.

18. The printed circuit board of claim 17, further comprising each one of said plurality of portions of said conductor removed from said power plane being generally rectangularly shaped.

19. The printed circuit board of claim 17, further comprising each one of said plurality of portions of said conductor removed from said power plane being generally parallel to all others of said plurality of portions of said conductor removed from said power plane.

20. The printed circuit board of claim 19, further comprising said ground plane having a plurality of portions removed from a conductor of said ground plane.

21. The printed circuit board of claim 20, further comprising each one of said plurality of portions of said conductor removed from said power plane being generally rectangularly shaped.

22. The printed circuit board of claim 21, further comprising each one of said plurality of portions of said conductor removed from said ground plane being generally rectangularly shaped.

23. The printed circuit board of claim 22, further comprising each one of said plurality of portions of said conductor removed from said ground plane being generally parallel to all others of said plurality of portions of said conductor removed from said ground plane.

24. The printed circuit board of claim 23, further comprising each one of said plurality of portions of said conductor removed from said power plane being generally perpendicular to each one of said plurality of portions of said conductor removed from said ground plane.

25. A method for decoupling a pair of planes included within a printed circuit board, said method comprising the steps of:

establishing a power plane including a first region and a second region;

establishing a ground plane located parallel to said power plane, said ground plane including a first region and a second region;

establishing a first plurality of decoupling elements connected to said first region of said power plane and said first region of said ground plane; and

establishing a second plurality of decoupling elements connected to said second region of said power plane and said second region of said ground plane.

26. The method according to claim 25, further comprising establishing said second region being separate from and contiguous to said first region.

27. The method according to claim 26, further comprising establishing said power plane having a peripheral edge, wherein said first region is located from said peripheral edge to a middle portion of said power plane, said first region including a peripheral portion of said power plane, and said second region including said middle portion of said power plane.

28. The method according to claim 27, further comprising establishing said ground plane having a peripheral edge, said ground plane including a first region and a second region which is separate from and contiguous to said first region, said first region including said peripheral edge and including a peripheral portion of said ground plane, said second region including a middle portion of said ground plane.

29. The method according to claim 28, wherein said step of establishing said first plurality of decoupling elements further comprises the step of establishing a first plurality of a first type of decoupling capacitors.

30. The method according to claim 29, wherein said step of establishing said first type of decoupling capacitors further comprises the step of establishing said first type of decoupling capacitors including low equivalent series resistance capacitors.

31. The method according to claim 30, wherein said step of establishing said second plurality of decoupling elements further comprises the step of establishing a second plurality of said first type of decoupling capacitors and a plurality of a second type of decoupling capacitors.

32. The method according to claim 31, wherein said step of establishing said second type of decoupling capacitors further comprises the step of establishing said second type of decoupling capacitors including lossy capacitors.

33. The method according to claim 32, further comprising the step of establishing said second type of decoupling capacitors including lossy capacitors, each of said lossy capacitors including a resistor and capacitor coupled together in series.

34. The method according to claim 33, further comprising the step of establishing said power plane having a plurality of portions of removed from a conductor of said power plane.

35. The method according to claim 34, further comprising the step of establishing each one of said plurality of portions of said conductor removed from said power plane being generally rectangularly shaped.

36. The method according to claim 35, further comprising the step of establishing each one of said plurality of portions of said conductor removed from said power plane being generally parallel to all others of said plurality of portions of said conductor removed from said power plane.

37. The method according to claim 36, further comprising the step of establishing said ground plane having a plurality of portions of a conductor removed from said ground plane.

38. The method according to claim 37, further comprising the step of establishing each one of said plurality of portions of said conductor removed from said power plane being generally rectangularly shaped.

39. The method according to claim 38, further comprising the step of establishing each one of said plurality of portions of said conductor removed from said ground plane being generally rectangularly shaped.

40. The method according to claim 39, further comprising the step of establishing each one of said plurality of portions of said conductor removed from said ground plane being generally parallel to all others of said plurality of portions of said conductor removed from said ground plane.

41. The method according to claim 40, further comprising the step of establishing each one of said plurality of portions of said conductor removed from said power plane being generally perpendicular to each one of said plurality of portions of said conductor removed from said ground plane.

42. A printed circuit board, comprising:

a power plane having a peripheral edge and including a first region and a second region, said second region being separate from and contiguous to said first region of said power plane, said first region being located from said peripheral edge to a middle portion of said power plane, said first region including a peripheral portion of said power plane, and said second region including said middle portion of said power plane;

a ground plane located parallel to said power plane, said ground plane having a peripheral edge and including a first region and a second region separate from and contiguous to said first region, said first region including said peripheral edge and including a peripheral portion of said ground plane, said second region including a middle portion of said ground plane;

a first plurality of decoupling elements connected to said first region of said power plane and said first region of said ground plane, a first half of said first plurality of decoupling elements including a plurality of lossy capacitors and a second half of said first plurality of decoupling elements including a plurality of low equivalent series resistance capacitors;

a second plurality of decoupling elements connected to said second region of said power plane and said second region of said ground plane, said second plurality of decoupling elements further comprising a plurality of lossy capacitors;

each of said plurality of lossy capacitors of said first and second plurality of decoupling elements including a resistor and capacitor coupled together in series;

said power plane having a plurality of generally rectangularly shaped portions removed from a conductor of said power plane, each one of said plurality of portions of said conductor removed from said power plane being generally parallel to all others of said plurality of portions of said conductor removed from said power plane;

said ground plane having a plurality of generally rectangular shaped portions removed from a conductor of said ground plane, each one of said plurality of portions of said conductor removed from said ground plane being generally rectangularly shaped;

each one of said plurality of portions of said conductor removed from said ground plane being generally parallel to all others of said plurality of portions of said conductor removed from said ground plane; and

each one of said plurality of portions of said conductor removed from said power plane being generally perpendicular to each one of said plurality of portions of said conductor removed from said ground plane.