Methods for using a support backer board system for siding

• US 6,418,610 B2
• Filed: 03/22/2001
• Issued: 07/16/2002
• Est. Priority Date: 03/02/1999
• Status: Expired due to Fees

• Current Assignee: Pactiv
• Original Assignee: Pactiv
• Inventors: Hebert, Gregg A., Lubker, John W. II
• Primary Examiner(s): Hughes, S. Thomas
• Assistant Examiner(s): Blount, Steven A
• Application Number:
  US09/815,081
• Publication Number:
  US 20010010116A1
• Time in Patent Office: 481 Days
• Field of Search: 298/973.2, 294/191, 298/973.3, 295/250.1, 428/458, 428/457, 428/461, 523/098, 523/091.6
• US Class Current: 29/525.01
• CPC Class Codes: B29C 48/07 Flat, e.g. panels
• CPC Class Codes: B29C 48/08 flexible, e.g. films
• CPC Class Codes: B29C 48/18 the components being layers
• CPC Class Codes: B29C 51/002 characterised by the choice of material
• CPC Class Codes: B29C 51/10 Forming by pressure difference, e.g. vacuum
• CPC Class Codes: B29C 51/14 using multilayered preforms or sheets
• CPC Class Codes: B29L 2031/10 Building elements, e.g. bricks, blocks, tiles, panels, posts, beams frameless domes B29L2025/00, doors B29L2031/724
• CPC Class Codes: B29L 2031/108 Roofs
• CPC Class Codes: E04F 13/0864 composed of superposed elements which overlap each other and of which the flat outer surface includes an acute angle with the surface to cover
• CPC Class Codes: E04F 13/18 of organic plastics with or without reinforcements or filling materials of plastic-bound fibres or chips E04F13/16 or with an outer layer of organic plastics with or without reinforcements or filling materials; plastic tiles E04F13/0864 takes precedence
• CPC Class Codes: Y10T 29/49629 Panel
• CPC Class Codes: Y10T 29/49801 Shaping fiber or fibered material
• CPC Class Codes: Y10T 29/49826 Assembling or joining
• CPC Class Codes: Y10T 29/49947 by applying separate fastener
• CPC Class Codes: Y10T 29/49963 Threaded fastener

Abstract

A method for using a support backer board system and siding. The support backer board system comprises at least a first layer. The first layer is made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof. The board system is thermoformed into a desired shape with the desired shape being generally contour to the selected siding. The siding is attached to the board system so as to provide support thereto. In one process, the siding may be vinyl.

Claims

1. A method for using a support backer board system and siding, said support backer board system comprising at least a first layer, the method comprising the steps of:

providing siding;

extruding a first layer, said first layer being made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof;

thermoforming said board system into a desired shape, said desired shape being generally contour to said siding; and

attaching said siding to said board system so as to provide support to said siding.

2. The method of claim 1, wherein said siding is made from vinyl or polymeric materials.

3. The method of claim 1, wherein said thermoforming step is performed as in-line process.

4. The method of claim 1, wherein said thermoforming step comprising placing the extrudated board system in a mold and forming the board system into the desired shape under pressure.

5. The method of claim 1, wherein said thermoforming step is performed as an off-line process.

6. The method of claim 5, wherein said thermoforming step comprises heating the extrudated board system, placing the heated extrudated board system in a mold, and forming the board system into the desired shape under pressure.

7. The method of claim 1, wherein the first layer ia an alkenyl aromatic polymer.

8. The method of claim 7, wherein the alkenyl aromatic polymer is polystyrene.

9. The method of claim 1, wherein said board system further comprises a second layer, said second layer being made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, and combinations thereof.

10. The method of claim 9, wherein said board system further comprises a third layer, said third layer being made from a material selected from the group consisting of alkenyl aromatic polymers, polyolefins, polyethylene terephthalate, polyesters, adhesives, and combinations thereof.

11. The method of claim 10, wherein said second and third layers are made of high impact polystyrene.

12. The method of claim 1, wherein said board system comprises a first layer, a second layer, a third layer, and a fourth layer, said first layer being comprised of a polystyrene, said second layer being comprised of a polystyrene or a polyolefin, said third layer being comprised of an adhesive, and said fourth layer being comprised of a polystyrene or a polyolefin.

13. The method of claim 1, wherein the step of attaching includes using nails, screws, staples, or a combination thereof.

14. The method of claim 1, wherein said board system has a thickness from about 125to about 500 mils.

15. The method of claim 1, further comprising the steps of providing a material selected from plywood, orientated strand board, foamed sheathings, beadboard, hardboard, blackboard, fiberboard, and existing siding, and attaching said board system and said material.

16. A method for using a support backer board system and siding, said support backer board system comprising at least a first layer, the method comprising the steps of:

providing siding;

extruding a first layer to form said board system, said first layer being made from at least one alkenyl aromatic polymer;

thermoforming said board system into a desired shape, said desired shape being generally contour to said siding; and

attaching said siding to said board system so as to provide support to said siding.

17. The method of claim 16, wherein said alkenyl aromatic polymer is polystyrene.

18. The method of claim 17, wherein said siding is made from vinyl or polymeric materials.

19. The method of claim 16, wherein said thermoforming step comprises placing the extrudated board system in a mold and forming the board system into the desired shape under pressure.