Method of manufacturing electronic stripline components

• US 6,420,096 B1
• Filed: 04/03/2000
• Issued: 07/16/2002
• Est. Priority Date: 04/03/1999
• Status: Expired due to Fees

• Current Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Original Assignee: Koninklijke Philips Electronics N.V. (Koninklijke Philips N.V.)
• Inventors: Klee, Mareike, Löbl, Hans-Peter, Fleuster, Martin, Van Oppen, Paul
• Primary Examiner(s): Baxter, Janet
• Assistant Examiner(s): Walke, Amanda C.
• Application Number:
  US09/541,767
• Time in Patent Office: 834 Days
• Field of Search: 430/311, 430/318, 430/313
• US Class Current: 430/313
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/76834 formation of thin insulating films on the sidewalls or on top of conductors H01L21/76831 takes precedence
• CPC Class Codes: H01L 21/76885 By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
• CPC Class Codes: H01L 2223/6627 Waveguides, e.g. microstrip line, strip line, coplanar line
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01023 Vanadium [V]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01072 Hafnium [Hf]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1903 : including wave guides
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01P 11/00 : Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
• CPC Class Codes: H05K 1/0237 : High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0306 : Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0195 : Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 3/108 : by semi-additive methods; masks therefor characterised by metallic etch mask H05K3/062; electroplating methods or apparatus H05K3/241
• CPC Class Codes: H05K 3/28 : Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673
• CPC Class Codes: H05K 3/388 : by the use of a metallic or inorganic thin film adhesion layer
• CPC Class Codes: H05K 3/4685 : Manufacturing of cross-over conductors

Abstract

The invention describes a method of manufacturing an electronic thin-film component comprising at least one stripline. In this method, first a metallic base layer is deposited on a substrate layer, a photoresist layer is applied to this metallic base layer, and structured in accordance with the stripline(s) to be formed. An electroconductive layer is deposited on the exposed regions of the metallic base layer. Subsequently, the photoresist is removed and the metallic base layer is etched. This method has the advantage that less metal is required as compared to other thin-film methods. Overlapping areas of the striplines can be formed readily, economically, and with small current capacitances by means of bridges. By means of the method described herein, passive components, such as thin-film couplers for high-frequency applications or thin-film coils can be readily obtained.

Claims

1. A method of manufacturing electronic components comprising at least one stripline, characterized in that

a metallic base layer (2) is deposited on a substrate layer (1),

a layer of a photoresist (3) is applied to this metallic base layer (2) and provided with a structure,

an electroconductive layer (4) is deposited on the exposed areas of the metallic base layer (2), the photoresist (3) is removed, and

the metallic base layer (2) only is etched.

2. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that the material for the substrate layer (1) is a ceramic material, a ceramic material having a planarizing layer of glass, a glass-ceramic material or a glass material.

3. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that Cr/Cu is used as the material for the metallic base layer (2).

4. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that Cu, Ag, Al or Au is used as the material for the electroconductive layer (4).

5. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that the striplines (9, 10) are situated in one plane when a component comprises two or more striplines.

6. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that the striplines (11, 12) overlap each other at least once in the case of a component comprising two or more striplines.

7. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 6, characterized in that overlapping areas are realized by means of bridges (13) of a conductive material.

8. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that each end of a stripline is in contact with a current supply (8).

9. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that at least one protective layer (5) of an inorganic material and/or organic material is provided on the component.

10. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 1, characterized in that the lower side of the substrate layer is provided with a ground plane.

11. A method of manufacturing electronic components comprising at least one stripline, as claimed in claim 10, characterized in that the ground plane is connected to at least one further current supply.