Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom

• US 6,420,476 B1
• Filed: 04/16/1999
• Issued: 07/16/2002
• Est. Priority Date: 04/16/1998
• Status: Expired due to Fees

• Current Assignee: NOF Corporation, TDK Corporation
• Original Assignee: NOF Corporation, TDK Corporation
• Inventors: Yamada, Tomiho, Moriya, Yasuo, Yamada, Michihisa, Yasukawa, Yoshiyuki, Yamada, Toshiaki, Itoh, Tetsuya, Endou, Kenji, Hasegawa, Hiroaki
• Primary Examiner(s): Mulcahy, Peter D.
• Application Number:
  US09/292,842
• Time in Patent Office: 1,187 Days
• Field of Search: 524/575, 524/430, 524/443, 524/444
• US Class Current: 524/575
• CPC Class Codes: H01B 3/442 from aromatic vinyl compounds
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/032 consisting of one material
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles

Abstract

The invention has for its object to provide a composite dielectric material having any desired dielectric constant selectable from a relatively wide range in a high-frequency band and a low dielectric loss tangent, and a film, substrate, electronic part or molded or otherwise formed article using the same. To accomplish this object, there is provided a composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in said composition is at least 99%, and some or all resin molecules have a chemical bond therebetween, and a filler. A film, substrate, electronic part or molded or otherwise formed article is obtained using this composition.

Claims

1. A composite dielectric material composition comprising a heat-resistant, low-dielectric polymeric material (I) that is a resin composition comprising one or two or more resins having a weight-average absolute molecular weight of at least 1,000, wherein the sum of carbon atoms and hydrogen atoms in all of said resins in said dielectric material composition is at least 99% of the total number of atoms in all of said resins, and a filler (II), wherein said heat-resistant, low-dielectric polymeric material is a copolymer in which a non-polar α

-olefin base (co)polymer segment and/or a non-polar conjugated diene base (co)polymer segment are chemically combined with a vinyl aromatic (co)polymer segment containing a monomer of divinylbenzene, and is a thermoplastic resin which shows a multi-phase structure wherein a dispersion phase formed by one segment is finely dispersed in a continuous phase formed by another segment,

and wherein said heat-resistant, low-dielectric polymeric material in pulverized form is insoluble in xylene of 120°

C.

2. The composite dielectric material composition according to claim 1, which is a copolymer with said non-polar α

-olefin base (co)polymer segment chemically combined with said vinyl aromatic (co)polymer segment.

3. The composite dielectric material composition according to claim 1, wherein said heat-resistant, low-dielectric polymeric material further comprises a non-polar α

olefin base (co)polymer containing a monomer of 4-methylpentene-1.

4. The composite dielectric material composition according to claim 1, which has a dielectric constant of at least 1.0 and a Q value of at least 100 in a high-frequency band of at least 1 MHz.

5. The composite dielectric material composition according to claim 1, wherein said filler is in a fibrous state.

6. The composite dielectric material composition according to claim 1, wherein said filler is a non-fibrous state.

7. The composite dielectric material composition according to claim 1, wherein said filler is a high-frequency ceramic dielectric material.

8. The composite dielectric material composition according to claim 7, wherein said high-frequency ceramic dielectric material is a titanium-barium-neodymium base material and/or a lead-calcium base material, and accounts for 50 to 95% by weight of said composite dielectric material composition.

9. A film of at least 20 μ

m in thickness, which is obtained using the composite dielectric material composition according to claim 1.

10. A substrate obtained by lamination of films, each according to claim 9.

11. A substrate obtained by coating a surface of a metal sheet with the composite dielectric material composition according to claim 1.

12. The film according to claim 9, which is used in a high-frequency band of at least 1 MHz.

13. The substrate according to claim 10, which is used in a high-frequency band of at least 1 MHz.

14. An electronic part, which is obtained using the composite dielectric material composition according to claim 1 and used in a high-frequency band of at least 1 MHz.

15. An article obtained by forming the composite dielectric material composition according to claim 1 into a given shape.

16. The composite dielectric material composition according to claim 1, wherein the monomer of divinyl benzene is present in an amount of at least 1% by weight of the vinyl aromatic (co)polymer segment.

17. The composite dielectric material composition according to claim 16, wherein the amount of said monomer of divinyl benzene is no greater than 90% by weight of said vinyl aromatic (co)polymer segment.