Power module

• US 6,421,244 B1
• Filed: 05/04/2000
• Issued: 07/16/2002
• Est. Priority Date: 12/28/1999
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Yoshida, Takanobu, Shinohara, Toshiaki
• Primary Examiner(s): Gandhi, Jayprakash N.
• Assistant Examiner(s): Tran, Thanh Y.
• Application Number:
  US09/564,547
• Time in Patent Office: 803 Days
• Field of Search: 361/736, 361/804, 361/704, 361/751, 361/770, 361/760-761, 361/783, 361/790, 361/742, 361/796, 361/735, 361/784-785, 361/792-803, 174/138.G, 439/74, 439/507, 257/678
• US Class Current: 361/736
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/24 solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

In a power module, an interconnection terminal (10) is inserted into a through hole (30) and a connector (16) of a control circuit substrate (12) from the side of a lower main surface of the control. circuit substrate (12). Then, the interconnection terminal (10) presses a terminal (17) to displace the terminal (17). Thus, electrical and physical connections are provided between the control circuit substrate (12) and the interconnection terminal (10) in such a manner that the interconnection terminal (10) is held between the terminal (17) and an inner peripheral side surface of the connector (16). The interconnection terminal and the control circuit substrate are fixed. to each other without using solder, whereby the power module which is easy to mount and remove is provided.

Claims

1. A power module comprising:

a first substrate including a power device;

a second substrate opposed to said first substrate and including a semiconductor device for controlling said power device;

an interconnection terminal having a first end electrically connected to said first substrate, and a second end electrically connected to said second substrate; and

a case in which said first substrate, said second substrate and said interconnection terminal are disposed,

wherein said second substrate further includes a connector electrically connected to said semiconductor device, and

wherein said second end of said interconnection terminal is removably connected to said connector.

2. The power module according to claim 1,

wherein said connector is disposed near an outer periphery of said second substrate.

3. The power module according to claim 1,

wherein said connector is formed on a main surface of said second substrate which is on the same side as is said semiconductor device.

4. The power module according to claim 1,

wherein said connector is formed on a main surface of said second substrate which is opposed to said first substrate.

5. The power module according to claim 1,

wherein said case includes a positioning structure for defining a mounting position of said second substrate in said case.

6. The power module according to claim 1,

wherein at least a connection between said second substrate and said interconnection terminal is sealed with resin.

13. The power module according to claim 1,

wherein said connector includes:

a connector base material formed on said second substrate and including first and second side surfaces opposed to each other; and

a conductive terminal projecting from said first side surface, said conductive terminal being electrically connected to said semiconductor device and having elasticity,

wherein said second end of said interconnection terminal is connected to said connector by being inserted between said first side surface and said second side surface to be sandwiched between said terminal and said second side surface.

7. A power module comprising:

a first substrate including a power device;

a second substrate opposed to said first substrate and including a semiconductor device for controlling said power device;

an interconnection terminal having a first end electrically connected to said first substrate, and a second end electrically connected to said second substrate; and

a case in which said first substrate, said second substrate and said interconnection terminal are disposed,

wherein said second end of said interconnection terminal has elasticity, and

wherein said second substrate further includes a conductor pattern formed on a main surface of said second substrate which is opposed to said first substrate, said conductor pattern being electrically connected to said semiconductor device and contacting said second end of said interconnection terminal,

said power module further comprising

fastening means for removably fixing said case and said second substrate to each other, with said second end of said interconnection terminal displaced upon being pressed by said conductor pattern.

8. The power module according to claim 7,

wherein said case includes a receiving surface for placing said second substrate thereon, and

wherein said fastening means includes:

a first threaded hole formed in said receiving surface;

a second threaded hole formed in said second substrate in a position corresponding to said first threaded hole; and

a screw configured to be screwed into said first and second threaded holes.

9. The power module according to claim 7,

wherein at least a connection between said second substrate and said interconnection terminal is sealed with resin.

10. A power module comprising:

a first substrate including a power device;

a second substrate opposed to said first substrate and including a semiconductor device for controlling said power device;

an interconnection terminal having a first end electrically connected to said first substrate, and a second end electrically connected to said second substrate; and

a case in which said first substrate, said second substrate and said interconnection terminal are disposed,

wherein said second substrate further includes a through hole electrically connected to said semiconductor device, and

wherein said second end of said interconnection terminal has elasticity in a widthwise direction thereof, and is removably fitted in said through hole.

11. The power module according to claim 10,

wherein said case includes a positioning structure for defining a mounting position of said second substrate in said case.

12. The power module according to claim 10,

wherein at least a connection between said second substrate and said interconnection terminal is sealed with resin.