Force-sensing transducers, accelerometers, rate sensors, methods of forming force-sensing transducers, and methods of forming vibrating-beam force transducers
First Claim
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1. A method of forming a force-sensing transducer comprising:
- providing a substrate having a force sensing element defining an area over and within which a conductive layer of material is to be formed;
forming a patterned adhesion layer over less than an entirety of the area; and
forming a conductive layer of material over the area, the conductive layer of material being bonded to the substrate through the patterned adhesion layer in a bonding relationship, wherein the area of bonding is less than the area of said conductive layer.
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Abstract
Performance-enhancing, reduced-area metalization adhesion areas in force-sensing transducers are described.
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Citations
15 Claims
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1. A method of forming a force-sensing transducer comprising:
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providing a substrate having a force sensing element defining an area over and within which a conductive layer of material is to be formed;
forming a patterned adhesion layer over less than an entirety of the area; and
forming a conductive layer of material over the area, the conductive layer of material being bonded to the substrate through the patterned adhesion layer in a bonding relationship, wherein the area of bonding is less than the area of said conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming a vibrating-beam force transducer comprising:
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providing a substrate;
etching the substrate sufficient to form a plurality of vibratable beams arranged in a force-sensing configuration;
forming an insulative layer of material over the vibratable beams;
forming an adhesion layer pattern over the vibratable beams, the pattern comprising a plurality of spaced apart pattern components, each beam having three pattern components spaced apart along its length;
forming conductive material over the vibratable beams and the adhesion layer pattern, the conductive material being more fixedly attached to the adhesion layer pattern than to vibratable beam portions not having the adhesion layer pattern thereover; and
temperature cycling the substrate effective to weaken the attachment between the conductive material and the vibratable beam portions not having the adhesion layer pattern thereover. - View Dependent Claims (13, 14, 15)
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Specification