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Layer insulating film for multilayer interconnection, resin used therefor and process for producing the same

  • US 6,423,815 B1
  • Filed: 08/29/2000
  • Issued: 07/23/2002
  • Est. Priority Date: 08/30/1999
  • Status: Expired due to Fees
First Claim
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1. A process for producing a fluorine-containing polyhydroxyamide resin having the structure represented by the formula (1) which comprises reacting a dicarboxylic acid diester obtained by purifying a product obtained by the reaction of 2,2′

  • -bis(trifluoromethyl)-4,4′

    -biphenyldicarboxylic acid with one kind of compound selected from the group of compounds represented by the formulas (2), with 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane embedded imagewherein m is an integer of 10-500, embedded image

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