Layer insulating film for multilayer interconnection, resin used therefor and process for producing the same

• US 6,423,815 B1
• Filed: 08/29/2000
• Issued: 07/23/2002
• Est. Priority Date: 08/30/1999
• Status: Expired due to Fees

• Current Assignee: Sumitomo Bakelite Company Limited
• Original Assignee: Sumitomo Bakelite Company Limited
• Inventors: Nakajima, Michio, Yoshihashi, Saiko, Tokuhiro, Maki, Saito, Hidenori
• Primary Examiner(s): Cain, Edward J.
• Application Number:
  US09/650,703
• Time in Patent Office: 693 Days
• Field of Search: 528/335, 528/337, 528/288
• US Class Current: 528/288
• CPC Class Codes: C08G 73/02 Polyamines
• CPC Class Codes: C08G 73/22 Polybenzoxazoles
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The present invention provides a layer insulating film for multilayer interconnection of semiconductors which is excellent in resistance to heat, resistance to moisture absorption as well as in electric characteristic properties, and a process for producing the film. That is, a layer insulating film for multilayer interconnection of semiconductors which comprises a fluorine-containing polybenzoxazole resin having the structure represented by the formula (6) and obtained by a process which comprises subjecting to heat-dehydrating ring closure a fluorine-containing polyhydroxyamide resin obtained by reacting a dicarboxylic acid diester obtained from one kind of compound selected from the group of compounds represented by the formulas (2) and 2,2′-bis(tri-fluoromethyl)-4,4′-biphenyldicarboxylic acid, with 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane,

(in the formula (6), m is an integer of 10-500).

Claims

1. A process for producing a fluorine-containing polyhydroxyamide resin having the structure represented by the formula (1) which comprises reacting a dicarboxylic acid diester obtained by purifying a product obtained by the reaction of 2,2′

-bis(trifluoromethyl)-4,4′

-biphenyldicarboxylic acid with one kind of compound selected from the group of compounds represented by the formulas (2), with 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane

wherein m is an integer of 10-500,

2. The process for producing a fluorine-containing polyhydroxyamide resin according to claim 1 wherein said dicarboxylic acid diester is a product obtained by replacing less than 50% by mole of 2,2′

-bis(trifluoromethyl)-4,4′

-biphenyldicarboxylic acid diester by a dicarboxylic acid diester obtained by purifying the product obtained by the reaction of a dicarboxylic acid represented by R of the formula (3) with one kind of compound selected from the group of compounds represented by the formulas (2), and wherein less than 50% by mole of said 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane is replaced by a bisaminophenol represented by R′

of the formula (3)

wherein X and Y each independently represent a structure selected from the formulas (4)

wherein Z represents a structure selected from the formulas (5), provided that the hydrogen atom(s) on the benzene ring in these structures may be substituted with at least one member selected from the group consisting of methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, t-butyl group, fluorine atom and trifluoromethyl group,

3. The process for producing a fluorine-containing polyhydroxyamide resin according to claim 1 wherein said one kind of compound selected from the group of compounds represented by the formulas (2) is 1-hydroxybenzotriazole.

4. A fluorine-containing polyhydroxyamide resin having a repeating unit of the formula (1) which is obtained by the process according to claim 1

wherein m is an integer of 100-500.

5. A fluorine-containing polyhydroxyamide resin obtained by the process according to claim 2.

6. A fluorine-containing polybenzoxazole resin having the structure represented by the formula (6)

wherein m is an integer of 10-500, which is obtained by subjecting to heat-dehydrating ring closure the fluorine-containing polyhydroxyamide resin obtained by the process according to claim 1.

7. A fluorine-containing polybenzoxazole resin which is obtained by subjecting to heat-dehydrating ring closure the fluorine-containing polyhydroxyamide resin obtained by the process according to claim 2.

8. A fluorine-containing polybenzoxazole resin which is obtained by subjecting to heat-dehydrating ring closure the fluorine-containing polyhydroxyamide resin obtained by the process according to claim 3.

9. A layer insulating film for multilayer interconnection of semiconductors which comprises a polybenzoxazole resin having the structure represented by the formula (6) obtained by subjecting to heat-dehydrating ring closure the fluorine-containing polyhydroxyamide resin obtained by the process according to claim 1.

10. A layer insulating film for multilayer interconnection of semiconductors which comprises a polybenzoxazole resin obtained by subjecting to heat-dehydrating ring closure the fluorine-containing polyhydroxyamide resin obtained by the process according to claim 2.

11. A layer insulating film for multilayer interconnection of semiconductors which comprises a polybenzoxazole resin obtained by subjecting to heat-dehydrating ring closure the fluorine-containing polyhydroxyamide resin obtained by the process according to claim 3.