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Heatsink with embedded heat pipe for thermal management of CPU

  • US 6,424,528 B1
  • Filed: 06/20/1997
  • Issued: 07/23/2002
  • Est. Priority Date: 06/20/1997
  • Status: Expired due to Term
First Claim
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1. A heatsink for dissipating thermal energy generated by an integrated circuit, said heatsink comprising:

  • a thermally conductive base including a substantially planar lower surface for abutting against the integrated circuit, wherein said base defines a first channel, proximal to said lower surface extending from a first side of said base to a second side of said base;

    a plurality of thermally conductive fins extending from an opposite upper surface of said base; and

    a heat pipe contained within said first channel, wherein said heat pipe comprises an elongated casing containing a heat transfer-medium and a wick immersed in said medium and extending along a major axis of said heat pipe, and wherein one end of said heat pipe terminates within said base proximate to the first side and a second end of said heat pipe terminates within said base proximate to the second side.

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