Methods of manufacturing microfabricated substrates
First Claim
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1. A method of fabricating microfluidic devices, comprising:
- providing a first substrate having a first surface and a plurality of discrete groove networks disposed on the first surface, each of the plurality of discrete groove networks comprising at least two intersecting grooves;
bonding a second substrate to the first surface of the first substrate, wherein the second substrate comprises a plurality of apertures disposed through it from a first surface of the second substrate to a second surface of the second substrate, said bonding comprising first applying a vacuum to said apertures and mating the second substrate with the first surface of the first substrate to create a bonded substrate wherein the intersecting grooves are sealed to produce a plurality of discrete channel networks, the plurality of apertures being positioned in the second substrate to be in fluid communication with the discrete channel networks; and
separating a first portion of the bonded substrate containing at least a first discrete channel network from a second portion of the bonded substrate containing at least a second discrete channel network.
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Abstract
The present invention is directed to improved methods and apparatuses for manufacturing microfabricated devices, and particularly, microfluidic devices. In general the methods and apparatuses of the invention provide improved methods of bonding substrates together by applying a vacuum to the space between the substrates during the bonding process.
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17 Claims
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1. A method of fabricating microfluidic devices, comprising:
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providing a first substrate having a first surface and a plurality of discrete groove networks disposed on the first surface, each of the plurality of discrete groove networks comprising at least two intersecting grooves;
bonding a second substrate to the first surface of the first substrate, wherein the second substrate comprises a plurality of apertures disposed through it from a first surface of the second substrate to a second surface of the second substrate, said bonding comprising first applying a vacuum to said apertures and mating the second substrate with the first surface of the first substrate to create a bonded substrate wherein the intersecting grooves are sealed to produce a plurality of discrete channel networks, the plurality of apertures being positioned in the second substrate to be in fluid communication with the discrete channel networks; and
separating a first portion of the bonded substrate containing at least a first discrete channel network from a second portion of the bonded substrate containing at least a second discrete channel network. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification