Moldable pressure sensitive adhesive for automotive trim panels

• US 6,426,130 B2
• Filed: 07/14/1998
• Issued: 07/30/2002
• Est. Priority Date: 07/14/1998
• Status: Expired due to Fees

• Current Assignee: Fleet Capital Corporation (Bank of America Corp.), SIA Adhesives, Inc.
• Original Assignee: SIA Adhesives, Inc., Simco Automotive Trim, Inc. (UFP Technologies, Inc.)
• Inventors: Kuivinen, Edward, Sloat, David W., Wilson, Jerry P., Jones, Vincent H-H
• Primary Examiner(s): Loney, Donald J.
• Application Number:
  US09/115,120
• Publication Number:
  US 20010008668A1
• Time in Patent Office: 1,477 Days
• Field of Search: 428/40.1, 428/41.7, 428/41.8, 428/158, 428/160, 428/159, 428/174, 264/46.4, 264/46.8, 264/46.6, 264/255, 264/271.1, 264/241, 264/319, 296/146.7
• US Class Current: 428/41.8
• CPC Class Codes: B29C 51/14 using multilayered preforms or sheets
• CPC Class Codes: B29L 2009/001 the layers being loose
• CPC Class Codes: B29L 2031/3035 Sun visors
• CPC Class Codes: B60R 13/0206 Arrangements of fasteners and clips specially adapted for attaching inner vehicle liners or mouldings devices for fastening or securing F16B
• CPC Class Codes: Y10T 428/14 Layer or component removable to expose adhesive
• CPC Class Codes: Y10T 428/1476 Release layer
• CPC Class Codes: Y10T 428/24628 Nonplanar uniform thickness material

Abstract

An automotive trim panel has a thermoformable structural layer shaped into a non-flat contour with a pressure sensitive adhesive system applied to one side of the panel. The pressure sensitive adhesive is coated onto a release liner which is then attached to the structural layer. Both the adhesive and release liner are capable of withstanding the high heat of thermoforming. The trim panel can be applied to a substrate by peeling away the release liner and sticking the panel to the substrate.

Claims

1. A panel for covering a substantially rigid substrate having a non-flat contour, the panel comprising a thermoformable structural layer, the structural layer having sufficient stiffness to impart to the panel a permanent, non-flat contour generally matching that of the substrate, a moldable pressure sensitive adhesive on the structural layer and a thermoformable release liner covering the adhesive, the structural layer being able to withstand thermoforming temperatures of at least about 300°

F. and the moldable pressure sensitive adhesive being able to withstand thermoforming temperatures of at least about 300°

F.

2. The panel of claim 1 further comprising an A-side layer laminated to the structural layer, the A-side layer by itself having insufficient stiffness to retain a particular shape.

3. The panel of claim 1 wherein the structural layer comprises a thermoformable foam.

4. The panel of claim 1 wherein the release liner is made of polymer film.

5. The panel of claim 4 wherein the release liner is made of polyester.

6. The panel of claim 5 further comprising a coating of silicone on at least one side of the release liner.

7. The panel of claim 6 further comprising a coating of silicone on each side of the release liner and an inhibitor on one of the coatings of silicone.

8. The panel of claim 1 wherein the pressure sensitive adhesive is based on a blocked copolymer system.

9. The panel of claim 8 wherein the pressure sensitive adhesive is a styrene isoprene styrene block copolymer pressure sensitive adhesive.

10. The panel of claim 1 wherein the pressure sensitive adhesive is selected from the group consisting of acrylic, butadiene-acrylonitrile, butyl rubber, natural rubber, silicone, polychloroprene, polyvinyl acetate, polyvinyl ether, polyurethanes or other synthetic rubber or resin systems.

11. A pressure sensitive adhesive system for use with a thermoformable panel having a non-flat contour, comprising a moldable pressure sensitive adhesive on one side of the panel and a thermoformable release liner covering the adhesive, the adhesive and release liner being able to withstand thermoforming temperatures of at least about 300°

F.

12. The panel of claim 11 wherein the release liner is made of polymer film.

13. The pressure sensitive adhesive system of claim 12 wherein the release liner is made of polyester.

14. The pressure sensitive adhesive system of claim 13 further comprising a coating of silicone on at least one side of the release liner.

15. The pressure sensitive adhesive system of claim 14 further comprising a coating of silicone on each side of the release liner and an inhibitor on one of the coatings of silicone.

16. The panel of claim 11 wherein the pressure sensitive adhesive is based on a blocked copolymer system.

17. The panel of claim 16 wherein the pressure sensitive adhesive is a styrene isoprene styrene block copolymer pressure sensitive adhesive.

18. The panel of claim 11 wherein the pressure sensitive adhesive is selected from the group consisting of acrylic, butadiene-acrylonitrile, butyl rubber, natural rubber, silicone, polychloroprene, polyvinyl acetate, polyvinyl ether, polyurethanes or other synthetic rubber or resin systems.

19. A method of making a panel for covering a substantially rigid substrate having a non-flat contour, comprising the steps of:

applying a moldable pressure sensitive adhesive and a thermoformable release liner to a thermoformable structural layer with the pressure sensitive adhesive between the structural layer and the release liner; and

thermoforming the structural layer, pressure sensitive adhesive and release liner at a temperature of at least about 300°

F. to impart to the panel a permanent, non-flat contour generally matching that of the substrate.

20. The method of claim 19 wherein the step of applying the pressure sensitive adhesive and thermoformable release liner is characterized by first applying the pressure sensitive adhesive to the release liner and then attaching the release liner and adhesive to the thermoformable structural layer.

21. The method of claim 19 wherein the step of applying the pressure sensitive adhesive and release liner is characterized by applying the pressure sensitive adhesive to a carrier sheet, attaching the carrier sheet and adhesive to the thermoformable structural layer, removing the carrier sheet, and attaching the thermoformable release liner to the adhesive.

22. A panel for covering a substantially rigid substrate having a non-flat contour, the panel being made by the process of applying a moldable pressure sensitive adhesive to a thermoformable release liner, attaching the pressure sensitive adhesive and release liner to a thermoformable structural layer, and thermoforming the structural layer, pressure sensitive adhesive and release liner at a temperature of at least about 300°

F. to impart to the panel a permanent, non-flat contour generally matching that of the substrate.

23. A panel for covering a substantially rigid substrate having a non-flat contour, the panel being made by the process of applying a moldable pressure sensitive adhesive to a carrier sheet, attaching the carrier sheet and adhesive to a thermoformable structural layer, removing the carrier sheet leaving the adhesive on the structural layer, attaching a thermoformable release liner to the adhesive, and thermoforming the structural layer, pressure sensitive adhesive and release liner at a temperature of at least about 300°

F. to impart to the panel a permanent, non-flat contour generally matching that of the substrate.