Enclosure for electronic components

• US 6,426,461 B1
• Filed: 09/21/2000
• Issued: 07/30/2002
• Est. Priority Date: 09/21/2000
• Status: Expired due to Term

• Current Assignee: RPX Corporation
• Original Assignee: Delphi Technologies, Inc. (BorgWarner Incorporated)
• Inventors: Ginter, Mark Allan, Lowrance, Earl James
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): OLIVA, CARMELO B
• Application Number:
  US09/666,749
• Time in Patent Office: 677 Days
• Field of Search: 174/52.1, 174/52.3, 174/52.4, 174/50.5, 174/50.51, 174/50.54, 257/678, 257/701, 257/702, 257/704, 257/710, 257/713, 257/731, 257/732, 257/733, 361/748, 361/752, 361/760, 361/763, 361/764
• US Class Current: 174/540
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 5/0095 hermetically-sealed

Abstract

In one embodiment of the invention, an enclosure for an electronic component and a plurality of lead traces that connect the electronic component to a circuit board is used. The enclosure has a flexible diaphragm on one side and a sealing flange supporting said diaphragm and providing an attaching surface to fix the enclosure to the circuit board. This enclosure surrounds the electronic component and creates a barrier resistant to the external environment.

Claims

1. An enclosure for an electronic component connected to a circuit board by a plurality of lead traces, the enclosure comprising:

a flexible diaphragm;

a sealing flange forming a perimeter surrounding said diaphragm, said sealing flange supporting said diaphragm and providing an attaching surface to fix the enclosure to the circuit board;

whereby attaching the enclosure to the circuit board at said flange creates a barrier resistant to the surrounding environment.

2. The enclosure as recited in claim 1, wherein the enclosure is silicon rubber.

3. The enclosure as recited in claim 1, wherein the enclosure has a walled perimeter extending between said flange and said diaphragm.

4. The enclosure as recited in claim 1, wherein said diaphragm is concave with respect to the circuit board.

5. The enclosure as recited in claim 1, wherein said diaphragm is convex with respect to the circuit board.

6. A method for protecting an electronic component attached to a circuit board by a plurality of lead traces comprising the steps of:

placing an enclosure over at least a portion of one of the plurality of lead traces and the electronic component such that the electronic component and the portion of the plurality of lead traces are surrounded by said enclosure, said enclosure having a flexible diaphragm portion located over the electronic component; and

attaching the enclosure to the circuit board over the electronic component;

thereby creating a vacuum seal that is resistant to the surrounding environment.

7. The method for protecting the electronic component as recited in claim 6, wherein the step of placing includes the step of compressing said enclosure over the portion of the plurality of lead traces and the electronic component.

8. The method for protecting the electronic component as recited in claim 6, wherein said enclosure creates an internal environment between said enclosure and the electronic component.

9. The method for protecting the electronic component as recited in claim 6, wherein the step of placing includes the step of attaching said enclosure to said circuit board fully surrounding the electronic component.

10. The method for protecting the electronic component as recited in claim 6, which the step of attaching includes the step of applying adhesive to a flange.

11. The method for protecting the electronic component as recited in claim 6, wherein the step of attaching includes applying adhesive to the circuit board.

12. The method for protecting the electronic component as recited in claim 6, wherein the step of attaching includes the step of drawing a vacuum around the enclosure to seal it on to the circuit board.

13. A system for protecting an electronic component attached to a circuit board by a plurality of lead traces comprising:

an enclosure with a flange that is connected to the circuit board and surrounds the electronic component and a portion of the plurality of lead traces, said enclosure having a flexible diaphragm positioned over the electronic component;

said enclosure adhered to the circuit board at said flange of said enclosure.

14. The system for protecting an electronic component as recited in claim 13, wherein said enclosure adhered to the circuit board includes materials that are resistant to potting materials.

15. The system for protecting an electronic component as recited in claim 13, wherein said enclosure adhered to the circuit board includes materials that are resistant to adhesives.

16. The system for protecting an electronic component as recited in claim 13, wherein said enclosure adhered to the circuit board includes materials that are resistant to moisture.